IT966924B - PROCESS FOR CHEMICAL ENGRAVING OF POLYAMIDE SURFACES PARTICULARLY IN APPLICATION TO PRINTED CIRCUITS - Google Patents

PROCESS FOR CHEMICAL ENGRAVING OF POLYAMIDE SURFACES PARTICULARLY IN APPLICATION TO PRINTED CIRCUITS

Info

Publication number
IT966924B
IT966924B IT6890672A IT6890672A IT966924B IT 966924 B IT966924 B IT 966924B IT 6890672 A IT6890672 A IT 6890672A IT 6890672 A IT6890672 A IT 6890672A IT 966924 B IT966924 B IT 966924B
Authority
IT
Italy
Prior art keywords
application
printed circuits
surfaces particularly
chemical engraving
polyamide surfaces
Prior art date
Application number
IT6890672A
Other languages
Italian (it)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Application granted granted Critical
Publication of IT966924B publication Critical patent/IT966924B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
IT6890672A 1971-06-14 1972-06-13 PROCESS FOR CHEMICAL ENGRAVING OF POLYAMIDE SURFACES PARTICULARLY IN APPLICATION TO PRINTED CIRCUITS IT966924B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15279271A 1971-06-14 1971-06-14
US25512472A 1972-05-19 1972-05-19

Publications (1)

Publication Number Publication Date
IT966924B true IT966924B (en) 1974-02-20

Family

ID=26849870

Family Applications (1)

Application Number Title Priority Date Filing Date
IT6890672A IT966924B (en) 1971-06-14 1972-06-13 PROCESS FOR CHEMICAL ENGRAVING OF POLYAMIDE SURFACES PARTICULARLY IN APPLICATION TO PRINTED CIRCUITS

Country Status (9)

Country Link
JP (1) JPS5149442B1 (en)
BE (1) BE784790A (en)
CH (1) CH573956A5 (en)
DE (1) DE2227891C3 (en)
FR (1) FR2141865B1 (en)
GB (1) GB1379961A (en)
IT (1) IT966924B (en)
NL (1) NL149204B (en)
SE (1) SE396620B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130803A (en) * 1983-12-19 1985-07-12 松下電器産業株式会社 Variable resistor
DE3530617A1 (en) * 1985-08-23 1987-02-26 Schering Ag CONDITIONERS FOR TREATING BASE MATERIALS
DE19834721A1 (en) * 1998-07-31 2000-04-13 Siemens Ag Solution for deburring and/or etching plastic elements, especially polyester film separators for ceramic elements in computer tomography detectors, comprises an ethanolic or aqueous solution of alkali hydroxide
CN112203422A (en) * 2020-09-14 2021-01-08 珠海市晶昊电子科技有限公司 Surface treatment method of printed circuit board cover film

Also Published As

Publication number Publication date
DE2227891B2 (en) 1976-09-30
NL7208055A (en) 1972-12-18
CH573956A5 (en) 1976-03-31
GB1379961A (en) 1975-01-08
FR2141865A1 (en) 1973-01-26
SE396620B (en) 1977-09-26
FR2141865B1 (en) 1977-12-23
NL149204B (en) 1976-04-15
BE784790A (en) 1972-10-02
DE2227891A1 (en) 1973-01-04
DE2227891C3 (en) 1978-10-05
JPS5149442B1 (en) 1976-12-27

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