IT947242B - Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico - Google Patents

Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico

Info

Publication number
IT947242B
IT947242B IT20144/72A IT2014472A IT947242B IT 947242 B IT947242 B IT 947242B IT 20144/72 A IT20144/72 A IT 20144/72A IT 2014472 A IT2014472 A IT 2014472A IT 947242 B IT947242 B IT 947242B
Authority
IT
Italy
Prior art keywords
conductors
flexible
thin
forming
insulating sheet
Prior art date
Application number
IT20144/72A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT947242B publication Critical patent/IT947242B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
IT20144/72A 1971-02-05 1972-02-02 Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico IT947242B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101602A NL7101602A (OSRAM) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
IT947242B true IT947242B (it) 1973-05-21

Family

ID=19812419

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20144/72A IT947242B (it) 1971-02-05 1972-02-02 Metodo per formare un disegno di conduttori su di un sottile foglio flessibile ed isolante di materia le sintetico

Country Status (9)

Country Link
US (1) US3821847A (OSRAM)
AU (1) AU471692B2 (OSRAM)
CA (1) CA978662A (OSRAM)
CH (1) CH537140A (OSRAM)
DE (1) DE2202801C3 (OSRAM)
FR (1) FR2124489B1 (OSRAM)
GB (1) GB1373433A (OSRAM)
IT (1) IT947242B (OSRAM)
NL (1) NL7101602A (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134801A (en) * 1976-05-17 1979-01-16 U.S. Philips Corporation Terminal connections on microcircuit chips
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US5032542A (en) * 1988-11-18 1991-07-16 Sanyo Electric Co., Ltd. Method of mass-producing integrated circuit devices using strip lead frame
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
ATE139370T1 (de) * 1990-07-23 1996-06-15 Siemens Nixdorf Inf Syst Filmträger zur bandautomatischen verdrahtung
US5956237A (en) * 1993-12-24 1999-09-21 Ibiden Co., Ltd. Primary printed wiring board
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
US7128442B2 (en) * 2003-05-09 2006-10-31 Kian Shin Lee Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2438205A (en) * 1945-09-15 1948-03-23 Douglas Aircraft Co Inc Measuring instrument
US2854386A (en) * 1955-02-07 1958-09-30 Aladdin Ind Inc Method of photographically printing conductive metallic patterns
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
ES316614A1 (es) * 1964-08-24 1966-07-01 Gen Electric Un procedimiento para preparar una composicion electronicamente conductora.
DE1263126B (de) * 1966-04-01 1968-03-14 Standard Elektrik Lorenz Ag Verfahren zur Herstellung von Duennfilmschaltungen
GB1188451A (en) * 1968-01-26 1970-04-15 Ass Elect Ind Improvements relating to methods of making Connections to Small Components
US3548494A (en) * 1968-01-31 1970-12-22 Western Electric Co Method of forming plated metallic patterns on a substrate
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits

Also Published As

Publication number Publication date
AU3853772A (en) 1973-08-09
DE2202801C3 (de) 1981-12-17
FR2124489A1 (OSRAM) 1972-09-22
US3821847A (en) 1974-07-02
FR2124489B1 (OSRAM) 1975-10-24
CA978662A (en) 1975-11-25
DE2202801A1 (de) 1972-08-17
GB1373433A (en) 1974-11-13
CH537140A (de) 1973-05-15
AU471692B2 (en) 1973-08-09
DE2202801B2 (de) 1979-06-13
NL7101602A (OSRAM) 1972-08-08

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