IT8019078A0 - Procedimento per la fabbricazione di un dispositivo semiconduttore ad ossido metallico con contatti autoallineati. - Google Patents

Procedimento per la fabbricazione di un dispositivo semiconduttore ad ossido metallico con contatti autoallineati.

Info

Publication number
IT8019078A0
IT8019078A0 IT8019078A IT1907880A IT8019078A0 IT 8019078 A0 IT8019078 A0 IT 8019078A0 IT 8019078 A IT8019078 A IT 8019078A IT 1907880 A IT1907880 A IT 1907880A IT 8019078 A0 IT8019078 A0 IT 8019078A0
Authority
IT
Italy
Prior art keywords
self
procedure
manufacturing
semiconductor device
oxide semiconductor
Prior art date
Application number
IT8019078A
Other languages
English (en)
Inventor
Batra Tarsaim Lal
Original Assignee
American Micro Syst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Micro Syst filed Critical American Micro Syst
Publication of IT8019078A0 publication Critical patent/IT8019078A0/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568Lateral single gate silicon transistors
    • H01L29/66575Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
IT8019078A 1979-01-08 1980-01-08 Procedimento per la fabbricazione di un dispositivo semiconduttore ad ossido metallico con contatti autoallineati. IT8019078A0 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US184079A 1979-01-08 1979-01-08

Publications (1)

Publication Number Publication Date
IT8019078A0 true IT8019078A0 (it) 1980-01-08

Family

ID=21698078

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8019078A IT8019078A0 (it) 1979-01-08 1980-01-08 Procedimento per la fabbricazione di un dispositivo semiconduttore ad ossido metallico con contatti autoallineati.

Country Status (7)

Country Link
JP (1) JPS5593271A (it)
CA (1) CA1131796A (it)
DE (1) DE3000121A1 (it)
FR (1) FR2446011A1 (it)
GB (1) GB2040564A (it)
IT (1) IT8019078A0 (it)
NL (1) NL7908534A (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455737A (en) * 1978-05-26 1984-06-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4506437A (en) * 1978-05-26 1985-03-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4409722A (en) * 1980-08-29 1983-10-18 International Business Machines Corporation Borderless diffusion contact process and structure
US4341009A (en) * 1980-12-05 1982-07-27 International Business Machines Corporation Method for making an electrical contact to a silicon substrate through a relatively thin layer of silicon dioxide on the surface of the substrate
JPS57113289A (en) * 1980-12-30 1982-07-14 Fujitsu Ltd Semiconductor device and its manufacture
US4517729A (en) * 1981-07-27 1985-05-21 American Microsystems, Incorporated Method for fabricating MOS device with self-aligned contacts
US4686000A (en) * 1985-04-02 1987-08-11 Heath Barbara A Self-aligned contact process
JPS63207171A (ja) * 1987-02-24 1988-08-26 Nippon Telegr & Teleph Corp <Ntt> 半導体メモリ装置及びその製造方法
US5159353A (en) * 1991-07-02 1992-10-27 Hewlett-Packard Company Thermal inkjet printhead structure and method for making the same
KR100377833B1 (ko) * 2001-06-19 2003-03-29 삼성전자주식회사 보더리스 콘택 구조를 갖는 반도체 장치 및 그 제조방법

Also Published As

Publication number Publication date
DE3000121A1 (de) 1980-07-17
GB2040564A (en) 1980-08-28
NL7908534A (nl) 1980-07-10
JPS5593271A (en) 1980-07-15
CA1131796A (en) 1982-09-14
FR2446011A1 (fr) 1980-08-01
FR2446011B3 (it) 1981-11-06

Similar Documents

Publication Publication Date Title
AU500226B2 (en) Cooling assembly for highpower semiconductor elements
GB2065973B (en) Processes for manufacturing semiconductor devices
DE2861528D1 (en) Method for making self-aligned integrated semiconductor devices
AU506465B2 (en) Semiconductor F. E. T. device
IT7928441A0 (it) Circuito integrato a semiconduttori e procedimento per la sua fabbricazione.
IT8367973A0 (it) Procedimento per la fabbricazione di circuiti integrati a semiconduttori con contatti autoallineati e circuiti integrati realizzati con tale procedimento
AU472212B2 (en) A method employing precision stamping for fabricating the wafers ofa multiwafer electrical circuit structure
GB2054265B (en) Manufacturing emitters by diffusion from polysilicon
NO152858C (no) Toveis elektrisk kontaktanordning.
IT8322981A0 (it) Procedimento per la fabbricazione di un dispositivo a semiconduttori.
IT7922832A0 (it) Laser a semiconduttore eprocedimento per la fabbricazione di un laser a semiconduttore.
NO771130L (no) Yttriumoksyd-elektroder.
IT7922105A0 (it) Processo per fabbricare contatti conduttivi in dispositivi semiconduttori.
NO153947C (no) Elektrisk kontaktanordning.
ES517117A0 (es) Un dispositivo semiconductor para emitir electrones.
IT8019078A0 (it) Procedimento per la fabbricazione di un dispositivo semiconduttore ad ossido metallico con contatti autoallineati.
IT8025035A0 (it) Procedimento per formare contatti ohmici di bassa resistenza su ossidi semiconduttori.
NL7805397A (nl) Werkwijze om halfgeleiderinrichtingen te vervaardigen.
IT8019551A0 (it) Procedimento per fabbricare un dispositivo di gaas avente unacorrente di ricombinazione superficiale ridotta.
IT8021530A0 (it) Dispositivo semiconduttore ad elettroluminescenza.
ES225751Y (es) Un contacto electrico.
NO157317C (no) Material for elektriske kontakter.
IT8025523A0 (it) Apparecchio di manovra elettronico, operante senza contatto meccanico.
NO801695L (no) Elektrisk kontakt-innretning.
GB2035682B (en) Semiconductor device contacts