IT1295460B1 - Metodo per impilare pacchi di piastre di circuiti stampati e relativo dispositivo di carico e scarico di pacchi per una macchina utensile. - Google Patents
Metodo per impilare pacchi di piastre di circuiti stampati e relativo dispositivo di carico e scarico di pacchi per una macchina utensile.Info
- Publication number
- IT1295460B1 IT1295460B1 IT97TO000872A ITTO970872A IT1295460B1 IT 1295460 B1 IT1295460 B1 IT 1295460B1 IT 97TO000872 A IT97TO000872 A IT 97TO000872A IT TO970872 A ITTO970872 A IT TO970872A IT 1295460 B1 IT1295460 B1 IT 1295460B1
- Authority
- IT
- Italy
- Prior art keywords
- packages
- unloading
- loading
- plates
- machine tool
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Feeding Of Workpieces (AREA)
- Stacking Of Articles And Auxiliary Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Pile Receivers (AREA)
- Discharge By Other Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT97TO000872A IT1295460B1 (it) | 1997-10-02 | 1997-10-02 | Metodo per impilare pacchi di piastre di circuiti stampati e relativo dispositivo di carico e scarico di pacchi per una macchina utensile. |
EP98118304A EP0906808A3 (en) | 1997-10-02 | 1998-09-28 | Method of stacking packs of printed circuit boards and related pack loading and unloading device for a machine tool |
JP10312657A JPH11220291A (ja) | 1997-10-02 | 1998-09-29 | プリント回路基板のパックを積み重ねる方法、および加工機用のパック装荷取り外し装置 |
US09/162,641 US6183190B1 (en) | 1997-10-02 | 1998-09-29 | Method of stacking packs of printed circuit boards and relative pack loading and unloading device for a machine tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT97TO000872A IT1295460B1 (it) | 1997-10-02 | 1997-10-02 | Metodo per impilare pacchi di piastre di circuiti stampati e relativo dispositivo di carico e scarico di pacchi per una macchina utensile. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO970872A1 ITTO970872A1 (it) | 1999-04-02 |
IT1295460B1 true IT1295460B1 (it) | 1999-05-12 |
Family
ID=11416042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT97TO000872A IT1295460B1 (it) | 1997-10-02 | 1997-10-02 | Metodo per impilare pacchi di piastre di circuiti stampati e relativo dispositivo di carico e scarico di pacchi per una macchina utensile. |
Country Status (4)
Country | Link |
---|---|
US (1) | US6183190B1 (it) |
EP (1) | EP0906808A3 (it) |
JP (1) | JPH11220291A (it) |
IT (1) | IT1295460B1 (it) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942875B2 (en) * | 2001-07-05 | 2005-09-13 | Closure Medical Corporation | Adhesive treatment for skin yeast infections |
US6602496B2 (en) | 2001-07-05 | 2003-08-05 | Closure Medical Corporation | Adhesive treatment for tinea corporis |
US6585967B2 (en) | 2001-07-05 | 2003-07-01 | Closure Medical Corporation | Adhesive treatment for tinea cruris |
US6767552B2 (en) | 2001-07-05 | 2004-07-27 | Closure Medical Corporation | Adhesive treatment for oral fungal infection |
US7516534B2 (en) * | 2001-11-25 | 2009-04-14 | Stresswave, Inc. | Method for attaching a nut element to a metal structure |
ATE457733T1 (de) | 2002-05-09 | 2010-03-15 | Oncothyreon Inc | Lipid-a- und andere kohlenhydrat-liganden-analoga |
JP3855879B2 (ja) * | 2002-08-07 | 2006-12-13 | 松下電器産業株式会社 | フレキシブルプリント基板の搬送用キャリアおよびフレキシブルプリント基板への電子部品実装方法 |
FR2859466B1 (fr) * | 2003-09-10 | 2005-12-02 | Labadis | Dispositif de manutention de caisses et analogues |
ITMI20050809A1 (it) * | 2005-05-04 | 2006-11-05 | Cem Spa | Dispositivo e procedimento di taglio di moduli continui |
US20070040314A1 (en) * | 2005-07-12 | 2007-02-22 | Lkt Automation Sdn Bhd | Adjustable tool holder |
TWI271837B (en) * | 2005-11-25 | 2007-01-21 | Ind Tech Res Inst | Clamping device for a flexible and method for fabricating the same |
US20090241329A1 (en) * | 2008-03-28 | 2009-10-01 | Utac Thai Limited | Side rail remover |
US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
US9504163B2 (en) * | 2014-08-28 | 2016-11-22 | Wojciech B. Kosmowski | Y axis beam positioning system for a PCB drilling machine |
DE102014219060A1 (de) * | 2014-09-22 | 2016-03-24 | Homag Holzbearbeitungssysteme Gmbh | Bearbeitungsvorrichtung |
CN106696475B (zh) * | 2015-11-13 | 2019-06-18 | 富泰华工业(深圳)有限公司 | 打印机及利用打印机打印电路板的方法 |
JP7343303B2 (ja) * | 2019-05-26 | 2023-09-12 | 大船企業日本株式会社 | 基板の回収方法と、該回収方法の実施に供する加工後基板回収装置 |
TWI755906B (zh) * | 2020-10-23 | 2022-02-21 | 尚城科技股份有限公司 | 雙對稱結構交互式影像自動疊板機 |
CN113814778B (zh) * | 2021-09-24 | 2022-09-30 | 西安航空职业技术学院 | 一种旁推取料式多零件工作台码放装置 |
CN114126228B (zh) * | 2021-11-12 | 2023-02-03 | 东莞市吉宏五金科技有限公司 | 收板机、上pin针包胶及收板一体化生产设备 |
CN114340189B (zh) * | 2022-01-13 | 2023-12-19 | 深圳市众芯合创科技有限公司 | 一种基于电路板的精修、检测、测试、包装设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61197143A (ja) * | 1985-02-25 | 1986-09-01 | Toshiba Mach Co Ltd | 板状ワ−クの加工機械 |
JPS62105811A (ja) * | 1985-10-31 | 1987-05-16 | Mazda Motor Corp | 板状部材の位置決め搬送装置 |
JPS6331959A (ja) * | 1986-07-23 | 1988-02-10 | Seikosha Co Ltd | ワ−ク位置決め装置 |
DE3677778D1 (de) * | 1986-12-31 | 1991-04-04 | Willi Steiner | Satz von bauelementen und verwendung desselben. |
US5109584A (en) * | 1989-02-28 | 1992-05-05 | Hitachi Seiko Ltd. | Printed circuit board adapter supplying apparatus and method for use in printed circuit board drilling apparatus |
JP2828488B2 (ja) * | 1990-05-23 | 1998-11-25 | 日立精工株式会社 | プリント基板加工装置 |
US5101546A (en) * | 1990-11-30 | 1992-04-07 | Hitachi Seiko Ltd. | Apparatus for removing printed board |
JPH0625931A (ja) * | 1992-07-07 | 1994-02-01 | Toyobo Co Ltd | 複合マルチフイラメント糸 |
DE4338656C2 (de) * | 1993-11-12 | 1995-11-16 | Multiline International Europa | Vorrichtung zum Ausrichten von Leiterplatten und Bildträgern |
DE19514163B4 (de) * | 1995-04-15 | 2005-12-29 | Atg Test Systems Gmbh & Co.Kg | Verfahren zum vollautomatischen Handhaben von elektrisch zu prüfenden Leiterplatten und Vorrichtung zum Ausführen dieses Verfahrens |
US5692286A (en) * | 1995-10-02 | 1997-12-02 | Posulax S.A. | Method for shaping parts in one or more stacked board shaped elements and machine tool for implementing this method |
US5768772A (en) * | 1996-05-17 | 1998-06-23 | International Business Machines Corporation | Pinstacking process and fixture |
DE29712034U1 (de) * | 1997-07-09 | 1997-09-18 | Schmoll Gmbh Maschinen | Automatisierte Leiterplatten-Bohrmaschine |
-
1997
- 1997-10-02 IT IT97TO000872A patent/IT1295460B1/it active IP Right Grant
-
1998
- 1998-09-28 EP EP98118304A patent/EP0906808A3/en not_active Withdrawn
- 1998-09-29 US US09/162,641 patent/US6183190B1/en not_active Expired - Fee Related
- 1998-09-29 JP JP10312657A patent/JPH11220291A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0906808A3 (en) | 2000-04-05 |
ITTO970872A1 (it) | 1999-04-02 |
JPH11220291A (ja) | 1999-08-10 |
US6183190B1 (en) | 2001-02-06 |
EP0906808A2 (en) | 1999-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |