IT1289525B1 - Cella di memoria per dispositivi di tipo eeprom e relativo processo di fabbricazione - Google Patents
Cella di memoria per dispositivi di tipo eeprom e relativo processo di fabbricazioneInfo
- Publication number
- IT1289525B1 IT1289525B1 IT96MI002741A ITMI962741A IT1289525B1 IT 1289525 B1 IT1289525 B1 IT 1289525B1 IT 96MI002741 A IT96MI002741 A IT 96MI002741A IT MI962741 A ITMI962741 A IT MI962741A IT 1289525 B1 IT1289525 B1 IT 1289525B1
- Authority
- IT
- Italy
- Prior art keywords
- memory cell
- manufacturing process
- type devices
- related manufacturing
- eeprom type
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MI002741A IT1289525B1 (it) | 1996-12-24 | 1996-12-24 | Cella di memoria per dispositivi di tipo eeprom e relativo processo di fabbricazione |
US08/996,923 US6080626A (en) | 1996-12-24 | 1997-12-23 | Memory cell for EEPROM devices, and corresponding fabricating process |
US09/576,168 US6320219B1 (en) | 1996-12-24 | 2000-05-22 | Memory cell for EEPROM devices and corresponding fabricating process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MI002741A IT1289525B1 (it) | 1996-12-24 | 1996-12-24 | Cella di memoria per dispositivi di tipo eeprom e relativo processo di fabbricazione |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI962741A1 ITMI962741A1 (it) | 1998-06-24 |
IT1289525B1 true IT1289525B1 (it) | 1998-10-15 |
Family
ID=11375491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT96MI002741A IT1289525B1 (it) | 1996-12-24 | 1996-12-24 | Cella di memoria per dispositivi di tipo eeprom e relativo processo di fabbricazione |
Country Status (2)
Country | Link |
---|---|
US (2) | US6080626A (it) |
IT (1) | IT1289525B1 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101751047B1 (ko) * | 2011-01-18 | 2017-07-03 | 삼성전자 주식회사 | 반도체 소자 및 그 제조 방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US35094A (en) * | 1862-04-29 | Faucet | ||
US3914357A (en) | 1973-01-04 | 1975-10-21 | Western Electric Co | Method of monitoring the application of cellular plastic insulation to elongated conductive material |
IE39611B1 (en) * | 1973-08-14 | 1978-11-22 | Siemens Ag | Improvements in or relating to two-phase charge coupled devices |
US5081054A (en) | 1989-04-03 | 1992-01-14 | Atmel Corporation | Fabrication process for programmable and erasable MOS memory device |
US5411904A (en) * | 1990-11-19 | 1995-05-02 | Sharp Kabushiki Kaisha | Process for fabricating nonvolatile random access memory having a tunnel oxide film |
IT1252214B (it) * | 1991-12-13 | 1995-06-05 | Sgs Thomson Microelectronics | Procedimento per la definizione di porzioni di ossido sottile particolarmente per celle di memoria a sola lettura programmabili e cancellabile elettricamente. |
JP2970158B2 (ja) * | 1991-12-20 | 1999-11-02 | 日本電気株式会社 | 固体撮像装置の製造方法 |
JPH0745730A (ja) * | 1993-02-19 | 1995-02-14 | Sgs Thomson Microelettronica Spa | 2レベルのポリシリコンeepromメモリ・セル並びにそのプログラミング方法及び製造方法、集積されたeeprom記憶回路、eepromメモリ・セル及びそのプログラミング方法 |
JP3093096B2 (ja) * | 1993-08-27 | 2000-10-03 | シャープ株式会社 | 不揮発性メモリの製造方法 |
EP0655778A3 (en) * | 1993-11-25 | 1996-01-03 | Matsushita Electronics Corp | Method of manufacturing semiconductor memory devices. |
US5501996A (en) * | 1994-12-14 | 1996-03-26 | United Microelectronics Corporation | Method of manufacture of high coupling ratio single polysilicon floating gate EPROM or EEPROM cell |
US5518942A (en) * | 1995-02-22 | 1996-05-21 | Alliance Semiconductor Corporation | Method of making flash EPROM cell having improved erase characteristics by using a tilt angle implant |
US5894146A (en) * | 1995-02-28 | 1999-04-13 | Sgs-Thomson Microelectronics, S.R.L. | EEPROM memory cells matrix with double polysilicon level and relating manufacturing process |
US5877054A (en) * | 1995-06-29 | 1999-03-02 | Sharp Kabushiki Kaisha | Method of making nonvolatile semiconductor memory |
-
1996
- 1996-12-24 IT IT96MI002741A patent/IT1289525B1/it active IP Right Grant
-
1997
- 1997-12-23 US US08/996,923 patent/US6080626A/en not_active Expired - Lifetime
-
2000
- 2000-05-22 US US09/576,168 patent/US6320219B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6320219B1 (en) | 2001-11-20 |
ITMI962741A1 (it) | 1998-06-24 |
US6080626A (en) | 2000-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |