IT1284275B1 - Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione - Google Patents

Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione

Info

Publication number
IT1284275B1
IT1284275B1 IT96RM000084A ITRM960084A IT1284275B1 IT 1284275 B1 IT1284275 B1 IT 1284275B1 IT 96RM000084 A IT96RM000084 A IT 96RM000084A IT RM960084 A ITRM960084 A IT RM960084A IT 1284275 B1 IT1284275 B1 IT 1284275B1
Authority
IT
Italy
Prior art keywords
manufacturing process
low resistance
conductive state
resistance vertical
vertical igfet
Prior art date
Application number
IT96RM000084A
Other languages
English (en)
Inventor
Lynnita K Knoch
Pak Tam
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of ITRM960084A0 publication Critical patent/ITRM960084A0/it
Publication of ITRM960084A1 publication Critical patent/ITRM960084A1/it
Application granted granted Critical
Publication of IT1284275B1 publication Critical patent/IT1284275B1/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692Surface layout
    • H01L29/0696Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42372Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
    • H01L29/4238Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66674DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/66712Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/66719With a step of forming an insulating sidewall spacer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
  • Connection Of Batteries Or Terminals (AREA)
IT96RM000084A 1995-02-24 1996-02-07 Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione IT1284275B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/393,772 US5703389A (en) 1995-02-24 1995-02-24 Vertical IGFET configuration having low on-resistance and method

Publications (3)

Publication Number Publication Date
ITRM960084A0 ITRM960084A0 (it) 1996-02-07
ITRM960084A1 ITRM960084A1 (it) 1997-08-07
IT1284275B1 true IT1284275B1 (it) 1998-05-18

Family

ID=23556188

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96RM000084A IT1284275B1 (it) 1995-02-24 1996-02-07 Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione

Country Status (4)

Country Link
US (1) US5703389A (it)
JP (1) JPH0955506A (it)
KR (1) KR960032725A (it)
IT (1) IT1284275B1 (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19953620A1 (de) * 1998-11-09 2000-05-11 Int Rectifier Corp Niederspannungs-MOSFET und Verfahren zu seiner Herstellung
US6144067A (en) * 1998-11-23 2000-11-07 International Rectifier Corp. Strip gate poly structure for increased channel width and reduced gate resistance
WO2001018774A1 (en) * 1999-09-08 2001-03-15 Matsushita Electric Industrial Co., Ltd. Electric circuit board, tft array substrate using the same, and liquid crystal display
JP4666708B2 (ja) 1999-10-13 2011-04-06 新電元工業株式会社 電界効果トランジスタ
EP1387408A1 (en) * 2002-06-12 2004-02-04 Motorola, Inc. Power semiconductor device and method of manufacturing the same
JP4990140B2 (ja) * 2004-08-31 2012-08-01 フリースケール セミコンダクター インコーポレイテッド パワー半導体デバイス
JP2006339516A (ja) * 2005-06-03 2006-12-14 Rohm Co Ltd 半導体装置およびその製造方法
EP1911097B1 (en) 2005-07-25 2018-04-25 NXP USA, Inc. Power semiconductor device and method of manufacturing a power semiconductor device
JP2007134500A (ja) * 2005-11-10 2007-05-31 Fuji Electric Holdings Co Ltd 双方向半導体装置
US8030153B2 (en) * 2007-10-31 2011-10-04 Freescale Semiconductor, Inc. High voltage TMOS semiconductor device with low gate charge structure and method of making
US9324782B2 (en) 2012-01-06 2016-04-26 Mitsubishi Electric Corporation Semiconductor device
US11749758B1 (en) 2019-11-05 2023-09-05 Semiq Incorporated Silicon carbide junction barrier schottky diode with wave-shaped regions
US10950695B1 (en) * 2019-11-05 2021-03-16 Semiq Incorporated Silicon carbide planar MOSFET with wave-shaped channel regions
US11152503B1 (en) 2019-11-05 2021-10-19 Semiq Incorporated Silicon carbide MOSFET with wave-shaped channel regions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532534A (en) * 1982-09-07 1985-07-30 Rca Corporation MOSFET with perimeter channel
US4833513A (en) * 1985-01-20 1989-05-23 Tdk Corporation MOS FET semiconductor device having a cell pattern arrangement for optimizing channel width
US4775879A (en) * 1987-03-18 1988-10-04 Motorola Inc. FET structure arrangement having low on resistance
US5208471A (en) * 1989-06-12 1993-05-04 Hitachi, Ltd. Semiconductor device and manufacturing method therefor
JP2910489B2 (ja) * 1993-03-22 1999-06-23 日本電気株式会社 縦型二重拡散mosfet
US5396097A (en) * 1993-11-22 1995-03-07 Motorola Inc Transistor with common base region

Also Published As

Publication number Publication date
ITRM960084A0 (it) 1996-02-07
US5703389A (en) 1997-12-30
JPH0955506A (ja) 1997-02-25
ITRM960084A1 (it) 1997-08-07
KR960032725A (ko) 1996-09-17

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Legal Events

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19990226