IT1284275B1 - Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione - Google Patents
Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazioneInfo
- Publication number
- IT1284275B1 IT1284275B1 IT96RM000084A ITRM960084A IT1284275B1 IT 1284275 B1 IT1284275 B1 IT 1284275B1 IT 96RM000084 A IT96RM000084 A IT 96RM000084A IT RM960084 A ITRM960084 A IT RM960084A IT 1284275 B1 IT1284275 B1 IT 1284275B1
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing process
- low resistance
- conductive state
- resistance vertical
- vertical igfet
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66719—With a step of forming an insulating sidewall spacer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
- Connection Of Batteries Or Terminals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/393,772 US5703389A (en) | 1995-02-24 | 1995-02-24 | Vertical IGFET configuration having low on-resistance and method |
Publications (3)
Publication Number | Publication Date |
---|---|
ITRM960084A0 ITRM960084A0 (it) | 1996-02-07 |
ITRM960084A1 ITRM960084A1 (it) | 1997-08-07 |
IT1284275B1 true IT1284275B1 (it) | 1998-05-18 |
Family
ID=23556188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT96RM000084A IT1284275B1 (it) | 1995-02-24 | 1996-02-07 | Configurazione igfet verticale a bassa resistenza nello stato conduttore e procedimento di fabbricazione |
Country Status (4)
Country | Link |
---|---|
US (1) | US5703389A (it) |
JP (1) | JPH0955506A (it) |
KR (1) | KR960032725A (it) |
IT (1) | IT1284275B1 (it) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19953620A1 (de) * | 1998-11-09 | 2000-05-11 | Int Rectifier Corp | Niederspannungs-MOSFET und Verfahren zu seiner Herstellung |
US6144067A (en) * | 1998-11-23 | 2000-11-07 | International Rectifier Corp. | Strip gate poly structure for increased channel width and reduced gate resistance |
WO2001018774A1 (en) * | 1999-09-08 | 2001-03-15 | Matsushita Electric Industrial Co., Ltd. | Electric circuit board, tft array substrate using the same, and liquid crystal display |
JP4666708B2 (ja) | 1999-10-13 | 2011-04-06 | 新電元工業株式会社 | 電界効果トランジスタ |
EP1387408A1 (en) * | 2002-06-12 | 2004-02-04 | Motorola, Inc. | Power semiconductor device and method of manufacturing the same |
JP4990140B2 (ja) * | 2004-08-31 | 2012-08-01 | フリースケール セミコンダクター インコーポレイテッド | パワー半導体デバイス |
JP2006339516A (ja) * | 2005-06-03 | 2006-12-14 | Rohm Co Ltd | 半導体装置およびその製造方法 |
EP1911097B1 (en) | 2005-07-25 | 2018-04-25 | NXP USA, Inc. | Power semiconductor device and method of manufacturing a power semiconductor device |
JP2007134500A (ja) * | 2005-11-10 | 2007-05-31 | Fuji Electric Holdings Co Ltd | 双方向半導体装置 |
US8030153B2 (en) * | 2007-10-31 | 2011-10-04 | Freescale Semiconductor, Inc. | High voltage TMOS semiconductor device with low gate charge structure and method of making |
US9324782B2 (en) | 2012-01-06 | 2016-04-26 | Mitsubishi Electric Corporation | Semiconductor device |
US11749758B1 (en) | 2019-11-05 | 2023-09-05 | Semiq Incorporated | Silicon carbide junction barrier schottky diode with wave-shaped regions |
US10950695B1 (en) * | 2019-11-05 | 2021-03-16 | Semiq Incorporated | Silicon carbide planar MOSFET with wave-shaped channel regions |
US11152503B1 (en) | 2019-11-05 | 2021-10-19 | Semiq Incorporated | Silicon carbide MOSFET with wave-shaped channel regions |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532534A (en) * | 1982-09-07 | 1985-07-30 | Rca Corporation | MOSFET with perimeter channel |
US4833513A (en) * | 1985-01-20 | 1989-05-23 | Tdk Corporation | MOS FET semiconductor device having a cell pattern arrangement for optimizing channel width |
US4775879A (en) * | 1987-03-18 | 1988-10-04 | Motorola Inc. | FET structure arrangement having low on resistance |
US5208471A (en) * | 1989-06-12 | 1993-05-04 | Hitachi, Ltd. | Semiconductor device and manufacturing method therefor |
JP2910489B2 (ja) * | 1993-03-22 | 1999-06-23 | 日本電気株式会社 | 縦型二重拡散mosfet |
US5396097A (en) * | 1993-11-22 | 1995-03-07 | Motorola Inc | Transistor with common base region |
-
1995
- 1995-02-24 US US08/393,772 patent/US5703389A/en not_active Expired - Lifetime
-
1996
- 1996-01-29 KR KR1019960001848A patent/KR960032725A/ko not_active Application Discontinuation
- 1996-02-06 JP JP8044162A patent/JPH0955506A/ja active Pending
- 1996-02-07 IT IT96RM000084A patent/IT1284275B1/it active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ITRM960084A0 (it) | 1996-02-07 |
US5703389A (en) | 1997-12-30 |
JPH0955506A (ja) | 1997-02-25 |
ITRM960084A1 (it) | 1997-08-07 |
KR960032725A (ko) | 1996-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19990226 |