IT1263769B - Procedimento per fissare corpi semiconduttori su un substrato - Google Patents

Procedimento per fissare corpi semiconduttori su un substrato

Info

Publication number
IT1263769B
IT1263769B ITMI930071A ITMI930071A IT1263769B IT 1263769 B IT1263769 B IT 1263769B IT MI930071 A ITMI930071 A IT MI930071A IT MI930071 A ITMI930071 A IT MI930071A IT 1263769 B IT1263769 B IT 1263769B
Authority
IT
Italy
Prior art keywords
substrate
procedure
fixing
semiconductive bodies
bodies
Prior art date
Application number
ITMI930071A
Other languages
English (en)
Italian (it)
Inventor
Franz Kaussen
Martin Figura
Original Assignee
Eupec Europaische Ges
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eupec Europaische Ges filed Critical Eupec Europaische Ges
Publication of ITMI930071A0 publication Critical patent/ITMI930071A0/it
Publication of ITMI930071A1 publication Critical patent/ITMI930071A1/it
Application granted granted Critical
Publication of IT1263769B publication Critical patent/IT1263769B/it

Links

Classifications

    • H10W70/68—
    • H10W72/07327—
    • H10W72/07331—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/352—
    • H10W72/385—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
ITMI930071A 1992-01-24 1993-01-19 Procedimento per fissare corpi semiconduttori su un substrato IT1263769B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4201931A DE4201931C1 (enExample) 1992-01-24 1992-01-24

Publications (3)

Publication Number Publication Date
ITMI930071A0 ITMI930071A0 (it) 1993-01-19
ITMI930071A1 ITMI930071A1 (it) 1994-07-19
IT1263769B true IT1263769B (it) 1996-08-29

Family

ID=6450189

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI930071A IT1263769B (it) 1992-01-24 1993-01-19 Procedimento per fissare corpi semiconduttori su un substrato

Country Status (4)

Country Link
US (1) US5310701A (enExample)
JP (1) JPH07249645A (enExample)
DE (1) DE4201931C1 (enExample)
IT (1) IT1263769B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249723A (ja) * 1994-03-11 1995-09-26 Fujitsu Miyagi Electron:Kk 半導体装置の実装構造及び半導体装置の実装方法及びリードフレーム
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
DE19510003A1 (de) * 1995-03-22 1996-09-26 Inst Mikrotechnik Mainz Gmbh Verfahren zum hochgenauen Anordnen mehrerer Plättchen auf einem Träger sowie ein Träger für die Durchführung des Verfahrens
US5917245A (en) * 1995-12-26 1999-06-29 Mitsubishi Electric Corp. Semiconductor device with brazing mount
JP2992873B2 (ja) * 1995-12-26 1999-12-20 サンケン電気株式会社 半導体装置
US5891756A (en) 1997-06-27 1999-04-06 Delco Electronics Corporation Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby
FR2787920B1 (fr) * 1998-12-28 2003-10-17 Alstom Procede d'assemblage d'une puce a un element de circuit par brasage
DE102005047055A1 (de) * 2005-09-30 2007-04-05 Infineon Technologies Austria Ag Ansteuerschaltung mit einem Transformator für ein Halbleiterschaltelement
DE112014006446B4 (de) 2014-03-07 2021-08-05 Mitsubishi Electric Corporation Halbleiteranordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
US3962669A (en) * 1974-07-24 1976-06-08 Tyco Laboratories, Inc. Electrical contact structure for semiconductor body
DE2814642A1 (de) * 1978-04-05 1979-10-18 Bosch Gmbh Robert Verfahren zum befestigen mindestens eines halbleiterkoerpers auf einen traeger
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly

Also Published As

Publication number Publication date
ITMI930071A1 (it) 1994-07-19
JPH07249645A (ja) 1995-09-26
DE4201931C1 (enExample) 1993-05-27
US5310701A (en) 1994-05-10
ITMI930071A0 (it) 1993-01-19

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960129