IT1263769B - Procedimento per fissare corpi semiconduttori su un substrato - Google Patents

Procedimento per fissare corpi semiconduttori su un substrato

Info

Publication number
IT1263769B
IT1263769B ITMI930071A ITMI930071A IT1263769B IT 1263769 B IT1263769 B IT 1263769B IT MI930071 A ITMI930071 A IT MI930071A IT MI930071 A ITMI930071 A IT MI930071A IT 1263769 B IT1263769 B IT 1263769B
Authority
IT
Italy
Prior art keywords
substrate
procedure
fixing
semiconductive bodies
bodies
Prior art date
Application number
ITMI930071A
Other languages
English (en)
Italian (it)
Inventor
Franz Kaussen
Martin Figura
Original Assignee
Eupec Europaische Ges
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eupec Europaische Ges filed Critical Eupec Europaische Ges
Publication of ITMI930071A0 publication Critical patent/ITMI930071A0/it
Publication of ITMI930071A1 publication Critical patent/ITMI930071A1/it
Application granted granted Critical
Publication of IT1263769B publication Critical patent/IT1263769B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/385—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
ITMI930071A 1992-01-24 1993-01-19 Procedimento per fissare corpi semiconduttori su un substrato IT1263769B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4201931A DE4201931C1 (enExample) 1992-01-24 1992-01-24

Publications (3)

Publication Number Publication Date
ITMI930071A0 ITMI930071A0 (it) 1993-01-19
ITMI930071A1 ITMI930071A1 (it) 1994-07-19
IT1263769B true IT1263769B (it) 1996-08-29

Family

ID=6450189

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI930071A IT1263769B (it) 1992-01-24 1993-01-19 Procedimento per fissare corpi semiconduttori su un substrato

Country Status (4)

Country Link
US (1) US5310701A (enExample)
JP (1) JPH07249645A (enExample)
DE (1) DE4201931C1 (enExample)
IT (1) IT1263769B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249723A (ja) * 1994-03-11 1995-09-26 Fujitsu Miyagi Electron:Kk 半導体装置の実装構造及び半導体装置の実装方法及びリードフレーム
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
DE19510003A1 (de) * 1995-03-22 1996-09-26 Inst Mikrotechnik Mainz Gmbh Verfahren zum hochgenauen Anordnen mehrerer Plättchen auf einem Träger sowie ein Träger für die Durchführung des Verfahrens
JP2992873B2 (ja) * 1995-12-26 1999-12-20 サンケン電気株式会社 半導体装置
US5917245A (en) * 1995-12-26 1999-06-29 Mitsubishi Electric Corp. Semiconductor device with brazing mount
US5891756A (en) 1997-06-27 1999-04-06 Delco Electronics Corporation Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby
FR2787920B1 (fr) * 1998-12-28 2003-10-17 Alstom Procede d'assemblage d'une puce a un element de circuit par brasage
DE102005047055A1 (de) * 2005-09-30 2007-04-05 Infineon Technologies Austria Ag Ansteuerschaltung mit einem Transformator für ein Halbleiterschaltelement
WO2015132969A1 (ja) 2014-03-07 2015-09-11 三菱電機株式会社 絶縁基板及び半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
US3962669A (en) * 1974-07-24 1976-06-08 Tyco Laboratories, Inc. Electrical contact structure for semiconductor body
DE2814642A1 (de) * 1978-04-05 1979-10-18 Bosch Gmbh Robert Verfahren zum befestigen mindestens eines halbleiterkoerpers auf einen traeger
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly

Also Published As

Publication number Publication date
ITMI930071A0 (it) 1993-01-19
US5310701A (en) 1994-05-10
DE4201931C1 (enExample) 1993-05-27
JPH07249645A (ja) 1995-09-26
ITMI930071A1 (it) 1994-07-19

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960129