IT1112434B - Custodia per disposizione di semiconduttori - Google Patents
Custodia per disposizione di semiconduttoriInfo
- Publication number
- IT1112434B IT1112434B IT21967/79A IT2196779A IT1112434B IT 1112434 B IT1112434 B IT 1112434B IT 21967/79 A IT21967/79 A IT 21967/79A IT 2196779 A IT2196779 A IT 2196779A IT 1112434 B IT1112434 B IT 1112434B
- Authority
- IT
- Italy
- Prior art keywords
- semiconductors
- arrangement
- case
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2819499A DE2819499C3 (de) | 1978-05-03 | 1978-05-03 | Gehäuse für eine Halbleiteranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7921967A0 IT7921967A0 (it) | 1979-04-19 |
IT1112434B true IT1112434B (it) | 1986-01-13 |
Family
ID=6038612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21967/79A IT1112434B (it) | 1978-05-03 | 1979-04-19 | Custodia per disposizione di semiconduttori |
Country Status (6)
Country | Link |
---|---|
US (1) | US4230901A (it) |
JP (1) | JPS54144874A (it) |
DE (1) | DE2819499C3 (it) |
FR (1) | FR2425149A1 (it) |
GB (1) | GB2020489B (it) |
IT (1) | IT1112434B (it) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4367523A (en) * | 1981-02-17 | 1983-01-04 | Electronic Devices, Inc. | Rectifier bridge unit |
US4471407A (en) * | 1982-09-27 | 1984-09-11 | Kohler Company | Combination heat sink for a semiconductor |
US4477828A (en) * | 1982-10-12 | 1984-10-16 | Scherer Jeremy D | Microcircuit package and sealing method |
US4633573A (en) * | 1982-10-12 | 1987-01-06 | Aegis, Inc. | Microcircuit package and sealing method |
DE3443702A1 (de) * | 1984-11-30 | 1986-06-05 | Degussa Ag, 6000 Frankfurt | Vorrichtung zur vermeidung von lokalen ueberhitzungen an messumformern |
EP0284820A3 (en) * | 1987-03-04 | 1989-03-08 | Canon Kabushiki Kaisha | Electrically connecting member, and electric circuit member and electric circuit device with the connecting member |
EP0687588B1 (en) * | 1991-09-03 | 1999-01-07 | Honda Giken Kogyo Kabushiki Kaisha | Regenerative braking system in a motor vehicle |
DE4224720A1 (de) * | 1992-07-27 | 1994-02-03 | Duerrwaechter E Dr Doduco | Gehäuse für eine elektronische Schaltung mit einem Leistungshalbleiter |
DE59504639D1 (de) * | 1994-05-02 | 1999-02-04 | Siemens Matsushita Components | Verkapselung für elektronische bauelemente |
JP3357220B2 (ja) * | 1995-07-07 | 2002-12-16 | 三菱電機株式会社 | 半導体装置 |
DE19533298A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Elektronisches Modul mit Leistungsbauelementen |
US5810608A (en) * | 1996-10-15 | 1998-09-22 | Intel Corporation | Contact pad extender for integrated circuit packages |
DE19721610A1 (de) * | 1997-05-23 | 1998-11-26 | Abb Daimler Benz Transp | Drosselbaugruppe für ein Stromrichtergerät |
US5825107A (en) * | 1997-06-13 | 1998-10-20 | General Electric Company | Drive package for a dynamoelectric machine |
US5932839A (en) * | 1997-11-04 | 1999-08-03 | Ren; Jane | Method for dissipating heat away from a heat sensitive device using bicarbonate compositions |
DE102007025338B4 (de) * | 2007-05-31 | 2015-02-05 | Tyco Electronics Amp Gmbh | Verfahren zum Abdichten eines Gehäuses und elektrische Komponente |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622419A (en) * | 1969-10-08 | 1971-11-23 | Motorola Inc | Method of packaging an optoelectrical device |
US3848077A (en) * | 1970-10-16 | 1974-11-12 | M Whitman | Package for electronic semiconductor devices |
GB1397181A (en) * | 1973-01-16 | 1975-06-11 | Lucas Electrical Co Ltd | Film circuit assemblies |
IT992650B (it) * | 1973-07-19 | 1975-09-30 | Ates Componenti Elettron | Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato |
-
1978
- 1978-05-03 DE DE2819499A patent/DE2819499C3/de not_active Expired
-
1979
- 1979-04-19 IT IT21967/79A patent/IT1112434B/it active
- 1979-04-27 GB GB7914796A patent/GB2020489B/en not_active Expired
- 1979-05-01 US US06/035,271 patent/US4230901A/en not_active Expired - Lifetime
- 1979-05-02 FR FR7910996A patent/FR2425149A1/fr not_active Withdrawn
- 1979-05-02 JP JP5465779A patent/JPS54144874A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS54144874A (en) | 1979-11-12 |
FR2425149A1 (fr) | 1979-11-30 |
IT7921967A0 (it) | 1979-04-19 |
DE2819499A1 (de) | 1979-11-08 |
GB2020489A (en) | 1979-11-14 |
DE2819499C3 (de) | 1981-01-29 |
DE2819499B2 (de) | 1980-05-22 |
GB2020489B (en) | 1982-05-12 |
US4230901A (en) | 1980-10-28 |
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