IT1247130B - Metodo e apparato per sorvegliare otticamente lavorazione di materiali mediante laser - Google Patents

Metodo e apparato per sorvegliare otticamente lavorazione di materiali mediante laser

Info

Publication number
IT1247130B
IT1247130B ITMI910563A ITMI910563A IT1247130B IT 1247130 B IT1247130 B IT 1247130B IT MI910563 A ITMI910563 A IT MI910563A IT MI910563 A ITMI910563 A IT MI910563A IT 1247130 B IT1247130 B IT 1247130B
Authority
IT
Italy
Prior art keywords
processing
laser
optically
surveilling
materials
Prior art date
Application number
ITMI910563A
Other languages
English (en)
Inventor
John Lewis Schneiter
Angel Luis Ortiz Jr
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of ITMI910563A0 publication Critical patent/ITMI910563A0/it
Publication of ITMI910563A1 publication Critical patent/ITMI910563A1/it
Application granted granted Critical
Publication of IT1247130B publication Critical patent/IT1247130B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Apparato per lavorazione di materiali mediante laser contenente mezzi per sorvegliare otticamente la lavorazione e generare un segnale di lavorazione rappresentante la medesima, mezzi per interpretare il segnale di lavorazione e generare un'uscita interpretata e mezzi per controllare la lavorazione dei materiali basati sull'uscita interpretata e generare un segnale di controllo applicato ad un componente laser di lavorazione di materiali.
ITMI910563A 1990-03-05 1991-03-05 Metodo e apparato per sorvegliare otticamente lavorazione di materiali mediante laser IT1247130B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/489,306 US5026979A (en) 1990-03-05 1990-03-05 Method and apparatus for optically monitoring laser materials processing

Publications (3)

Publication Number Publication Date
ITMI910563A0 ITMI910563A0 (it) 1991-03-05
ITMI910563A1 ITMI910563A1 (it) 1992-09-05
IT1247130B true IT1247130B (it) 1994-12-12

Family

ID=23943292

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI910563A IT1247130B (it) 1990-03-05 1991-03-05 Metodo e apparato per sorvegliare otticamente lavorazione di materiali mediante laser

Country Status (6)

Country Link
US (1) US5026979A (it)
JP (1) JP2648401B2 (it)
DE (1) DE4105647C2 (it)
FR (1) FR2659039B1 (it)
GB (1) GB2241779B (it)
IT (1) IT1247130B (it)

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US6130405A (en) * 1998-09-10 2000-10-10 Chromalloy Gas Turbine Corporation Laser drilling holes in a cylindrical workpiece
DE10036125A1 (de) * 2000-07-25 2002-02-07 Volkswagen Ag Verfahren und Vorrichtung zum Bearbeiten einer zylindrischen Innenwandfläche einer Bohrung
WO2003076150A1 (fr) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Procede et systeme d'usinage d'un materiau fragile
DE10256262B4 (de) * 2002-12-03 2013-02-21 Robert Bosch Gmbh Verfahren zur Prozesskontrolle bei der Laserbearbeitung von Bauteilen, Vorrichtung zur Laserbearbeitung sowie Computerprogramm und Computerprogrammprodukt zur Durchführung des Verfahrens
WO2008070784A1 (en) * 2006-12-06 2008-06-12 The Regents Of The University Of Michigan Optical sensor for quality monitoring of a welding process
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US8723078B2 (en) * 2008-11-21 2014-05-13 The Regents Of The University Of Michigan Monitoring of a welding process
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
ITTO20110352A1 (it) * 2011-04-21 2012-10-22 Adige Spa Metodo per il controllo di un processo di taglio laser e sistema di taglio laser implementante tale metodo
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
ES2909882T3 (es) * 2012-10-19 2022-05-10 Ipg Photonics Corp Dispositivo robótico paso a paso de soldadura láser
IN2015DN03325A (it) * 2012-10-19 2015-10-09 Ipg Photonics Corp
US9468991B2 (en) 2014-01-27 2016-10-18 General Electric Company Method determining hole completion
US9662743B2 (en) 2014-01-27 2017-05-30 General Electric Company Method for drilling a hole in an airfoil
US9676058B2 (en) 2014-01-27 2017-06-13 General Electric Company Method and system for detecting drilling progress in laser drilling
WO2015152059A1 (ja) * 2014-04-03 2015-10-08 新日鐵住金株式会社 溶接状態監視システム及び溶接状態監視方法
US11292081B2 (en) 2015-01-08 2022-04-05 General Electric Company Method and system for confined laser drilling
US10589385B2 (en) 2015-01-08 2020-03-17 General Electric Company Method and system for confined laser drilling
US9962792B2 (en) 2015-02-20 2018-05-08 General Electric Company Component repair using confined laser drilling
CN112404632B (zh) * 2019-08-22 2022-09-02 台达电子工业股份有限公司 焊锡装置及其系统控制器
ES2921930A1 (es) * 2021-02-19 2022-09-02 Fund Tekniker Microperforadora y metodo para monitorizar y controlar procesos de microperforacion laser de pulso unico

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Also Published As

Publication number Publication date
GB2241779A (en) 1991-09-11
DE4105647C2 (de) 1994-09-22
JP2648401B2 (ja) 1997-08-27
ITMI910563A1 (it) 1992-09-05
JPH04224092A (ja) 1992-08-13
DE4105647A1 (de) 1991-09-19
ITMI910563A0 (it) 1991-03-05
US5026979A (en) 1991-06-25
FR2659039B1 (fr) 1995-10-20
GB9104387D0 (en) 1991-04-17
FR2659039A1 (fr) 1991-09-06
GB2241779B (en) 1993-12-22

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Legal Events

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19980327