IT1188279B - Struttura di condensatore di disaccoppiamento,in particolare per l'impiego con un contenitore a schiera di piedini - Google Patents

Struttura di condensatore di disaccoppiamento,in particolare per l'impiego con un contenitore a schiera di piedini

Info

Publication number
IT1188279B
IT1188279B IT19116/86A IT1911686A IT1188279B IT 1188279 B IT1188279 B IT 1188279B IT 19116/86 A IT19116/86 A IT 19116/86A IT 1911686 A IT1911686 A IT 1911686A IT 1188279 B IT1188279 B IT 1188279B
Authority
IT
Italy
Prior art keywords
feet
based container
decoupling condenser
decoupling
condenser
Prior art date
Application number
IT19116/86A
Other languages
English (en)
Italian (it)
Other versions
IT8619116A0 (it
Inventor
Steven C Lockard
Michael S Hyslop
Jorge M Hernandez
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IT8619116A0 publication Critical patent/IT8619116A0/it
Application granted granted Critical
Publication of IT1188279B publication Critical patent/IT1188279B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12Protection against corrosion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10704Pin grid array [PGA]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
IT19116/86A 1985-01-22 1986-01-20 Struttura di condensatore di disaccoppiamento,in particolare per l'impiego con un contenitore a schiera di piedini IT1188279B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69318985A 1985-01-22 1985-01-22

Publications (2)

Publication Number Publication Date
IT8619116A0 IT8619116A0 (it) 1986-01-20
IT1188279B true IT1188279B (it) 1988-01-07

Family

ID=24783676

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19116/86A IT1188279B (it) 1985-01-22 1986-01-20 Struttura di condensatore di disaccoppiamento,in particolare per l'impiego con un contenitore a schiera di piedini

Country Status (7)

Country Link
BE (1) BE904074A (de)
BR (1) BR8600229A (de)
DE (1) DE3601681A1 (de)
FR (1) FR2576448B1 (de)
GB (1) GB2170047B (de)
IT (1) IT1188279B (de)
MX (1) MX160273A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667267A (en) * 1985-01-22 1987-05-19 Rogers Corporation Decoupling capacitor for pin grid array package
GB2176654B (en) * 1985-06-11 1988-08-10 Avx Corp Method for optimising the decoupling of integrated circuit devices
DE3636714C2 (de) * 1986-10-28 1993-11-25 Roederstein Kondensatoren Verwendung eines Schichtkondensators als kapazitive Stromschiene
DE3910518A1 (de) * 1989-04-01 1990-10-04 Manfred Haller Schaltungsplatine fuer die optimale entkopplung von schaltungen mit digitalen ic's
JPH0724332B2 (ja) * 1989-07-04 1995-03-15 富士通株式会社 プリント回路板
US5049979A (en) * 1990-06-18 1991-09-17 Microelectronics And Computer Technology Corporation Combined flat capacitor and tab integrated circuit chip and method
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6067594A (en) 1997-09-26 2000-05-23 Rambus, Inc. High frequency bus system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332233B1 (de) * 1968-12-25 1978-09-07
US3611051A (en) * 1970-03-13 1971-10-05 Sprague Electric Co Feed-through, electrolytic, book capacitor
NL7207899A (de) * 1972-06-09 1973-12-11
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4439754A (en) * 1981-04-03 1984-03-27 Electro-Films, Inc. Apertured electronic circuit package
JPS5816552A (ja) * 1981-07-22 1983-01-31 Fujitsu Ltd 半導体素子用パッケ−ジ
DE3214991A1 (de) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Halbleiterbaustein mit diskretem kondensator
JPS594060A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
US4502101A (en) * 1982-07-30 1985-02-26 Rogers Corporation Decoupled integrated circuit package
GB2132019A (en) * 1982-12-07 1984-06-27 Stc Plc Electrolytic capacitor manufacture
US4475143A (en) * 1983-01-10 1984-10-02 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4494169A (en) * 1983-11-14 1985-01-15 Rogers Corporation Decoupling capacitor and method of manufacture thereof

Also Published As

Publication number Publication date
BE904074A (fr) 1986-05-15
FR2576448A1 (fr) 1986-07-25
GB2170047A (en) 1986-07-23
MX160273A (es) 1990-01-25
DE3601681A1 (de) 1986-08-07
FR2576448B1 (fr) 1989-04-14
GB8601412D0 (en) 1986-02-26
GB2170047B (en) 1988-12-21
IT8619116A0 (it) 1986-01-20
BR8600229A (pt) 1986-09-30

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940126