IT1155419B - Procedimento di metallizzazione fortemente adesiva di poliimmide - Google Patents
Procedimento di metallizzazione fortemente adesiva di poliimmideInfo
- Publication number
- IT1155419B IT1155419B IT24646/82A IT2464682A IT1155419B IT 1155419 B IT1155419 B IT 1155419B IT 24646/82 A IT24646/82 A IT 24646/82A IT 2464682 A IT2464682 A IT 2464682A IT 1155419 B IT1155419 B IT 1155419B
- Authority
- IT
- Italy
- Prior art keywords
- highly adhesive
- adhesive polyimide
- metalization
- procedure
- metalization procedure
- Prior art date
Links
- 239000004642 Polyimide Substances 0.000 title 1
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000001465 metallisation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813149919 DE3149919A1 (de) | 1981-12-11 | 1981-12-11 | Verfahren zum haftfesten metallisieren von polyimid |
Publications (3)
Publication Number | Publication Date |
---|---|
IT8224646A0 IT8224646A0 (it) | 1982-12-09 |
IT8224646A1 IT8224646A1 (it) | 1984-06-09 |
IT1155419B true IT1155419B (it) | 1987-01-28 |
Family
ID=6148931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT24646/82A IT1155419B (it) | 1981-12-11 | 1982-12-09 | Procedimento di metallizzazione fortemente adesiva di poliimmide |
Country Status (7)
Country | Link |
---|---|
US (1) | US4517254A (it) |
JP (1) | JPS58108228A (it) |
DE (1) | DE3149919A1 (it) |
FR (1) | FR2518102B1 (it) |
GB (1) | GB2123854B (it) |
IE (1) | IE53985B1 (it) |
IT (1) | IT1155419B (it) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3328765A1 (de) * | 1983-08-05 | 1985-02-14 | Schering AG, 1000 Berlin und 4709 Bergkamen | Loesung zur vorbehandlung von polyimid |
DE3328339A1 (de) * | 1983-08-05 | 1985-02-14 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung einer kunststoffoberflaeche |
DE3447669A1 (de) * | 1983-12-29 | 1985-07-18 | Hitachi, Ltd., Tokio/Tokyo | Verbundstruktur aus metall und kunstharz sowie verfahren zu deren herstellung |
DE3504455A1 (de) * | 1984-02-17 | 1985-08-22 | Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. | Verfahren zur behandlung eines elektrisch nicht leitenden substrats vor der stromlosen metallisierung |
US4659587A (en) * | 1984-10-11 | 1987-04-21 | Hitachi, Ltd. | Electroless plating process and process for producing multilayer wiring board |
DE3530617A1 (de) * | 1985-08-23 | 1987-02-26 | Schering Ag | Konditionierungsmittel fuer die behandlung von basismaterialien |
US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
US4775449A (en) * | 1986-12-29 | 1988-10-04 | General Electric Company | Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
US4832799A (en) * | 1987-02-24 | 1989-05-23 | Polyonics Corporation | Process for coating at least one surface of a polyimide sheet with copper |
US4806395A (en) * | 1987-02-24 | 1989-02-21 | Polyonics Corporation | Textured polyimide film |
US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
US4842946A (en) * | 1987-09-28 | 1989-06-27 | General Electric Company | Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
DE3743743A1 (de) * | 1987-12-23 | 1989-07-06 | Basf Ag | Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung |
DE3813430A1 (de) * | 1988-04-18 | 1989-10-26 | Schering Ag | Verfahren zur beidseitigen metallisierung von polyimid-folien |
US5104734A (en) * | 1988-06-03 | 1992-04-14 | International Business Machines Corporation | Method for improving adhesion between a polyimide layer and a metal and the article obtained |
US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
US5156731A (en) * | 1988-12-13 | 1992-10-20 | Sumitomo Metal Mining Co. Ltd. | Polyimide substrate and method of manufacturing a printed wiring board using the substrate |
US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
US4981715A (en) * | 1989-08-10 | 1991-01-01 | Microelectronics And Computer Technology Corporation | Method of patterning electroless plated metal on a polymer substrate |
US5192581A (en) * | 1989-08-10 | 1993-03-09 | Microelectronics And Computer Technology Corporation | Protective layer for preventing electroless deposition on a dielectric |
US5084299A (en) * | 1989-08-10 | 1992-01-28 | Microelectronics And Computer Technology Corporation | Method for patterning electroless plated metal on a polymer substrate |
US5133840A (en) * | 1990-05-15 | 1992-07-28 | International Business Machines Corporation | Surface midification of a polyimide |
US5187241A (en) * | 1990-05-15 | 1993-02-16 | International Business Machines Corporation | Isoimide modifications of a polyimide and reaction thereof with nucleophiles |
US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
US5156732A (en) * | 1990-07-11 | 1992-10-20 | Sumitomo Metal Mining Co. Ltd. | Polyimide substrate and method of manufacturing a printed wiring board using the substrate |
US5151304A (en) * | 1991-01-22 | 1992-09-29 | International Business Machines Corporation | Structure and method for enhancing adhesion to a polyimide surface |
US5147518A (en) * | 1991-03-07 | 1992-09-15 | E. I. Du Pont De Nemours And Company | Process for adhering metal to polyimide film |
US5156710A (en) * | 1991-05-06 | 1992-10-20 | International Business Machines Corporation | Method of laminating polyimide to thin sheet metal |
US5380560A (en) * | 1992-07-28 | 1995-01-10 | International Business Machines Corporation | Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition |
ES2257987T3 (es) * | 1993-03-18 | 2006-08-16 | Atotech Deutschland Gmbh | Composicion y procedimiento para tratar una superficie revestida con un revestimiento de inmersion autoacelerante y autorenovador, sin formaldehido. |
US5418073A (en) * | 1993-10-25 | 1995-05-23 | Pre Finish Metals Incorporated | Method of forming noise-damping composite with externally galvanized surfaces and composite formed thereby |
US5658414A (en) * | 1995-03-03 | 1997-08-19 | Kraft Foods, Inc. | Organometallic solvent seaming of cellulosic materials |
US5690777A (en) * | 1995-03-03 | 1997-11-25 | Kraft Foods, Inc. | Seamed cellulosic materials using organometallic solvents |
DE19615242A1 (de) * | 1996-04-18 | 1997-10-23 | Daimler Benz Ag | Verfahren zur Herstellung von Schichtsystemen auf Kunststoffoberflächen |
US6468672B1 (en) | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
US20050238812A1 (en) * | 2002-06-04 | 2005-10-27 | Bhangale Sunil M | Method for electroless metalisation of polymer substrate |
SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
JP2007271026A (ja) * | 2006-03-31 | 2007-10-18 | Denso Corp | 流体制御弁 |
JP2008255460A (ja) * | 2007-04-09 | 2008-10-23 | Rohm & Haas Electronic Materials Llc | ポリイミド樹脂の無電解めっき処理方法 |
MY156523A (en) | 2009-06-08 | 2016-02-26 | Basf Se | Use of ionic fluids for pretreating plastic surfaces for metallization |
EP2845923B1 (en) * | 2013-09-04 | 2018-11-28 | Rohm and Haas Electronic Materials LLC | Electroless metallization of dielectrics with stable alkaline catalysts containing pyrazine derivatives |
EP2845922A1 (en) * | 2013-09-04 | 2015-03-11 | Rohm and Haas Electronic Materials LLC | Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts |
US9918389B2 (en) | 2013-09-04 | 2018-03-13 | Rohm And Haas Electronic Materials Llc | Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts |
TWI615073B (zh) * | 2015-04-09 | 2018-02-11 | 柏彌蘭金屬化研究股份有限公司 | 製成可撓式金屬積層材之方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3573973A (en) * | 1967-11-13 | 1971-04-06 | Ibm | High speed additive circuit process |
FR2037988A5 (en) * | 1969-03-13 | 1970-12-31 | Ampex | Surface treatment of hydro-phobic plastics - surfaces to make them hydrophilic and plat |
CA954391A (en) * | 1971-06-14 | 1974-09-10 | Western Electric Company, Incorporated | Method of improving adhesive properties of a polymeric material to a species deposited thereon |
US3736170A (en) * | 1971-06-28 | 1973-05-29 | Ibm | Process for improved adhesion of electroless copper to a polyimide surface |
US3770528A (en) * | 1971-09-29 | 1973-11-06 | Martin Processing Co Inc | Method for the surface treatment of polyimide materials |
US3821016A (en) * | 1972-05-19 | 1974-06-28 | Western Electric Co | Method of forming an adherent metallic pattern on a polyimide surface |
US3791848A (en) * | 1972-05-19 | 1974-02-12 | Western Electric Co | A method of improving the adherence of a metal deposit to a polyimide surface |
JPS4983765A (it) * | 1972-12-16 | 1974-08-12 | ||
CA1053994A (en) * | 1974-07-03 | 1979-05-08 | Amp Incorporated | Sensitization of polyimide polymer for electroless metal deposition |
US3928670A (en) * | 1974-09-23 | 1975-12-23 | Amp Inc | Selective plating on non-metallic surfaces |
US4070851A (en) * | 1976-06-23 | 1978-01-31 | Package Machinery Company | Gum stick wrapping machine |
-
1981
- 1981-12-11 DE DE19813149919 patent/DE3149919A1/de active Granted
-
1982
- 1982-12-09 IT IT24646/82A patent/IT1155419B/it active
- 1982-12-09 JP JP57214808A patent/JPS58108228A/ja active Pending
- 1982-12-10 IE IE2933/82A patent/IE53985B1/en not_active IP Right Cessation
- 1982-12-13 GB GB08235408A patent/GB2123854B/en not_active Expired
- 1982-12-13 FR FR8220828A patent/FR2518102B1/fr not_active Expired
- 1982-12-13 US US06/449,492 patent/US4517254A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4517254A (en) | 1985-05-14 |
IE53985B1 (en) | 1989-05-10 |
FR2518102B1 (fr) | 1986-09-19 |
IT8224646A1 (it) | 1984-06-09 |
JPS58108228A (ja) | 1983-06-28 |
IE822933L (en) | 1983-06-11 |
IT8224646A0 (it) | 1982-12-09 |
GB2123854B (en) | 1986-04-16 |
FR2518102A1 (fr) | 1983-06-17 |
DE3149919A1 (de) | 1983-06-23 |
GB2123854A (en) | 1984-02-08 |
DE3149919C2 (it) | 1990-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1155419B (it) | Procedimento di metallizzazione fortemente adesiva di poliimmide | |
DK517785D0 (da) | Kirurgisk fastgoerelsesanordning | |
DE3583127D1 (de) | Fixiervorrichtung. | |
DE3577754D1 (de) | Verbindungsvorrichtung. | |
DK432583D0 (da) | Forbindelseselement | |
DK327683D0 (da) | Forbindelsesindretning | |
DK125785A (da) | Forbindelsesindretning | |
DK528783A (da) | Katetersamling | |
IT1184516B (it) | Complesso di dispositivi di fissaggio | |
IT8620128A0 (it) | Dispositivo di spalmatura. | |
AT370153B (de) | Gleisstopfaggregat | |
BR8506798A (pt) | Dispositivos fixadores | |
IT1183420B (it) | Dispositivo di raffreddamento | |
DK63585D0 (da) | Varmehaerdeligt polyurethan-formstof | |
IT1150640B (it) | Dispositivo di fissaggio | |
IT8619464A0 (it) | Dispositivo di spalmatura. | |
AT385905B (de) | Langlauf-spurgeraet | |
IT1218346B (it) | Dispositivo di connessione | |
IT8522500A0 (it) | Apparecchio di collegamento. | |
FI61159B (fi) | Aoterfoerslutbar taet ask | |
DE3582730D1 (de) | Verbindungsvorrichtung. | |
PT81667B (pt) | Dispositivos de fixacao | |
FR2569891B3 (fr) | Element de reperage | |
KR850006194U (ko) | 푸럭콘셋고정 연결장치 | |
KR840006088U (ko) | 선반의 조립장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971129 |