IT1118159B - Perfezionamento nei dispositivi a semiconduttore a forma di dischetti con involucro di isolamento - Google Patents
Perfezionamento nei dispositivi a semiconduttore a forma di dischetti con involucro di isolamentoInfo
- Publication number
- IT1118159B IT1118159B IT4936979A IT4936979A IT1118159B IT 1118159 B IT1118159 B IT 1118159B IT 4936979 A IT4936979 A IT 4936979A IT 4936979 A IT4936979 A IT 4936979A IT 1118159 B IT1118159 B IT 1118159B
- Authority
- IT
- Italy
- Prior art keywords
- disc
- improvement
- semiconductor devices
- shaped semiconductor
- insulation enclosure
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0101—Neon [Ne]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2825682A DE2825682C2 (de) | 1978-06-12 | 1978-06-12 | Halbleiterbauelement mit Isoliergehäuse |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7949369A0 IT7949369A0 (it) | 1979-06-11 |
IT1118159B true IT1118159B (it) | 1986-02-24 |
Family
ID=6041592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT4936979A IT1118159B (it) | 1978-06-12 | 1979-06-11 | Perfezionamento nei dispositivi a semiconduttore a forma di dischetti con involucro di isolamento |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0016768B1 (it) |
JP (1) | JPS55500651A (it) |
DE (1) | DE2825682C2 (it) |
IT (1) | IT1118159B (it) |
WO (1) | WO1980000116A1 (it) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3143335A1 (de) * | 1981-10-31 | 1983-05-11 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitervorrichtung |
DE3221794A1 (de) * | 1982-06-09 | 1983-12-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente |
DE3612813A1 (de) * | 1985-04-16 | 1986-10-23 | Mitsubishi Denki K.K., Tokio/Tokyo | Halbleiter-bauelement |
FR2598031B1 (fr) * | 1986-04-29 | 1988-12-02 | Alsthom | Boitier pour semi-conducteur de puissance |
ITTO980414A1 (it) * | 1998-05-15 | 1999-11-15 | Ansaldo Trasporti Spa | Dispositivo semiconduttore di potenza. |
DE19843309A1 (de) * | 1998-09-22 | 2000-03-23 | Asea Brown Boveri | Kurzschlussfestes IGBT Modul |
EP3306663A1 (en) * | 2016-10-05 | 2018-04-11 | ABB Schweiz AG | Sic-on-si-based semiconductor module with short circuit failure mode |
CN112086403B (zh) * | 2020-09-02 | 2022-04-15 | 东莞市柏尔电子科技有限公司 | 一种防水型三极管及其制备工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1439132C3 (de) * | 1961-08-04 | 1975-04-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterbauelement |
US3437887A (en) * | 1966-06-03 | 1969-04-08 | Westinghouse Electric Corp | Flat package encapsulation of electrical devices |
GB1191232A (en) * | 1968-02-14 | 1970-05-13 | Westinghouse Brake & Signal | Semiconductor Devices and Their Manufacture |
DE2039806C3 (de) * | 1970-08-11 | 1975-05-07 | Brown, Boveri & Cie Ag, 6800 Mannheim | Halbleiterbauelement mit Druckkontakten |
US4021839A (en) * | 1975-10-16 | 1977-05-03 | Rca Corporation | Diode package |
DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
DE2654532C3 (de) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Scheibenförmige Halbleiterzelle |
-
1978
- 1978-06-12 DE DE2825682A patent/DE2825682C2/de not_active Expired
-
1979
- 1979-05-16 WO PCT/CH1979/000068 patent/WO1980000116A1/de unknown
- 1979-05-16 JP JP50075279A patent/JPS55500651A/ja active Pending
- 1979-05-16 EP EP79900486A patent/EP0016768B1/de not_active Expired
- 1979-06-11 IT IT4936979A patent/IT1118159B/it active
Also Published As
Publication number | Publication date |
---|---|
IT7949369A0 (it) | 1979-06-11 |
WO1980000116A1 (en) | 1980-01-24 |
DE2825682C2 (de) | 1984-09-20 |
DE2825682A1 (de) | 1979-12-20 |
EP0016768A1 (de) | 1980-10-15 |
EP0016768B1 (de) | 1982-10-27 |
JPS55500651A (it) | 1980-09-18 |
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