IT1106382B - Procedimento ed impianto per produrre materiali semiconduttori di elevata purezza e metalli purissimi - Google Patents

Procedimento ed impianto per produrre materiali semiconduttori di elevata purezza e metalli purissimi

Info

Publication number
IT1106382B
IT1106382B IT52131/78A IT5213178A IT1106382B IT 1106382 B IT1106382 B IT 1106382B IT 52131/78 A IT52131/78 A IT 52131/78A IT 5213178 A IT5213178 A IT 5213178A IT 1106382 B IT1106382 B IT 1106382B
Authority
IT
Italy
Prior art keywords
plant
procedure
production
high purity
pure metals
Prior art date
Application number
IT52131/78A
Other languages
English (en)
Other versions
IT7852131A0 (it
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of IT7852131A0 publication Critical patent/IT7852131A0/it
Application granted granted Critical
Publication of IT1106382B publication Critical patent/IT1106382B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/90—Carbides
    • C01B32/914—Carbides of single elements
    • C01B32/956—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/90—Carbides
    • C01B32/914—Carbides of single elements
    • C01B32/956—Silicon carbide
    • C01B32/963—Preparation from compounds containing silicon
    • C01B32/977—Preparation from organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
IT52131/78A 1977-12-01 1978-11-29 Procedimento ed impianto per produrre materiali semiconduttori di elevata purezza e metalli purissimi IT1106382B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2753567A DE2753567C3 (de) 1977-12-01 1977-12-01 Verfahren zur Herstellung von hochreinen Halbleitermaterialien und Reinstmetallen

Publications (2)

Publication Number Publication Date
IT7852131A0 IT7852131A0 (it) 1978-11-29
IT1106382B true IT1106382B (it) 1985-11-11

Family

ID=6025086

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52131/78A IT1106382B (it) 1977-12-01 1978-11-29 Procedimento ed impianto per produrre materiali semiconduttori di elevata purezza e metalli purissimi

Country Status (6)

Country Link
US (1) US4215154A (it)
JP (1) JPS5820297B2 (it)
DE (1) DE2753567C3 (it)
DK (1) DK152385C (it)
IT (1) IT1106382B (it)
NL (1) NL7811027A (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2928456C2 (de) * 1979-07-13 1983-07-07 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur Herstellung von hochreinem Silicium
JPS56104795A (en) * 1980-01-28 1981-08-20 Sony Corp Device for pulling up crystal
DE3319734C2 (de) * 1983-05-31 1994-02-03 Osaka Titanium Vorrichtung zur Einspeisung der Heizleistung in polykristalline Halbleiterstäbe
JPH0631185B2 (ja) * 1986-02-06 1994-04-27 東芝セラミツクス株式会社 炭化珪素発熱体の製造方法
US4724160A (en) * 1986-07-28 1988-02-09 Dow Corning Corporation Process for the production of semiconductor materials
JP4812938B2 (ja) 1997-12-15 2011-11-09 レック シリコン インコーポレイテッド 多結晶シリコン棒製造用化学的蒸気析着方式
US6544333B2 (en) 1997-12-15 2003-04-08 Advanced Silicon Materials Llc Chemical vapor deposition system for polycrystalline silicon rod production
JP2001274113A (ja) * 2000-03-23 2001-10-05 Nec Corp 半導体装置の製造方法
KR100768147B1 (ko) * 2006-05-11 2007-10-18 한국화학연구원 혼합된 코어수단을 이용한 다결정 실리콘 봉의 제조방법과그 제조장치
KR100768148B1 (ko) * 2006-05-22 2007-10-17 한국화학연구원 금속 코어수단을 이용한 다결정 실리콘 봉의 제조방법
DE102008002184A1 (de) * 2008-06-03 2009-12-10 Wacker Chemie Ag Vorrichtung zur Umformung elektrischer Energie zur konduktiven Erhitzung von Halbleitermaterial in Stabform
CN112770425A (zh) * 2020-12-31 2021-05-07 苏州三川换热器股份有限公司 工业电炉的变压器及电热元件的接线结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE570421A (it) *
NL233004A (it) * 1954-05-18 1900-01-01
NL123477C (it) * 1958-05-16
NL256255A (it) * 1959-11-02
NL7207136A (it) * 1971-07-07 1973-01-09
BE806098A (fr) * 1973-03-28 1974-02-01 Siemens Ag Procede de fabrication de silicium ou autre matiere semi-conductrice tres pure
DE2315469C3 (de) * 1973-03-28 1981-08-20 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum Herstellen von hochreinem Halbleitermaterial

Also Published As

Publication number Publication date
DE2753567C3 (de) 1982-04-15
DK152385C (da) 1988-08-01
DE2753567A1 (de) 1979-06-07
US4215154A (en) 1980-07-29
JPS5820297B2 (ja) 1983-04-22
NL7811027A (nl) 1979-06-06
IT7852131A0 (it) 1978-11-29
JPS5480284A (en) 1979-06-26
DK507278A (da) 1979-06-02
DK152385B (da) 1988-02-22
DE2753567B2 (de) 1980-08-07

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