IT1054354B - Procedimento per formare uno o piu ugelli in un wafer di silicio monocristallino - Google Patents

Procedimento per formare uno o piu ugelli in un wafer di silicio monocristallino

Info

Publication number
IT1054354B
IT1054354B IT28866/75A IT2886675A IT1054354B IT 1054354 B IT1054354 B IT 1054354B IT 28866/75 A IT28866/75 A IT 28866/75A IT 2886675 A IT2886675 A IT 2886675A IT 1054354 B IT1054354 B IT 1054354B
Authority
IT
Italy
Prior art keywords
nozzles
procedure
forming
silicon wafer
monocrystalline silicon
Prior art date
Application number
IT28866/75A
Other languages
English (en)
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1054354B publication Critical patent/IT1054354B/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B9/00Blowing glass; Production of hollow glass articles
    • C03B9/30Details of blowing glass; Use of materials for the moulds
    • C03B9/32Giving special shapes to parts of hollow glass articles
    • C03B9/33Making hollow glass articles with feet or projections; Moulds therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14475Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S239/00Fluid sprinkling, spraying, and diffusing
    • Y10S239/19Nozzle materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Weting (AREA)
  • Nozzles (AREA)
  • Facsimile Heads (AREA)
IT28866/75A 1974-12-31 1975-10-31 Procedimento per formare uno o piu ugelli in un wafer di silicio monocristallino IT1054354B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US537799A US3921916A (en) 1974-12-31 1974-12-31 Nozzles formed in monocrystalline silicon

Publications (1)

Publication Number Publication Date
IT1054354B true IT1054354B (it) 1981-11-10

Family

ID=24144139

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28866/75A IT1054354B (it) 1974-12-31 1975-10-31 Procedimento per formare uno o piu ugelli in un wafer di silicio monocristallino

Country Status (7)

Country Link
US (1) US3921916A (enExample)
JP (1) JPS5516070B2 (enExample)
CA (1) CA1037519A (enExample)
DE (1) DE2555462C2 (enExample)
FR (1) FR2296504A1 (enExample)
GB (1) GB1492465A (enExample)
IT (1) IT1054354B (enExample)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007464A (en) * 1975-01-23 1977-02-08 International Business Machines Corporation Ink jet nozzle
US4014029A (en) * 1975-12-31 1977-03-22 International Business Machines Corporation Staggered nozzle array
US4047184A (en) * 1976-01-28 1977-09-06 International Business Machines Corporation Charge electrode array and combination for ink jet printing and method of manufacture
US4106976A (en) * 1976-03-08 1978-08-15 International Business Machines Corporation Ink jet nozzle method of manufacture
US4035812A (en) * 1976-07-12 1977-07-12 The Mead Corporation Ink jet recorder and charge ring plate therefor with reduced deplating current
US4169008A (en) * 1977-06-13 1979-09-25 International Business Machines Corporation Process for producing uniform nozzle orifices in silicon wafers
US4146899A (en) * 1977-10-13 1979-03-27 The Mead Corporation Formed orifice plate for ink jet printing apparatus
US4184925A (en) * 1977-12-19 1980-01-22 The Mead Corporation Solid metal orifice plate for a jet drop recorder
US4239586A (en) * 1979-06-29 1980-12-16 International Business Machines Corporation Etching of multiple holes of uniform size
US4229265A (en) * 1979-08-09 1980-10-21 The Mead Corporation Method for fabricating and the solid metal orifice plate for a jet drop recorder produced thereby
US4430784A (en) * 1980-02-22 1984-02-14 Celanese Corporation Manufacturing process for orifice nozzle devices for ink jet printing apparati
US4282533A (en) * 1980-02-22 1981-08-04 Celanese Corporation Precision orifice nozzle devices for ink jet printing apparati and the process for their manufacture
JPS5764563A (en) * 1980-10-07 1982-04-19 Fuji Xerox Co Ltd Ink particle jet apparatus of multi-nozzle ink jet printer
JPS57182449A (en) * 1981-05-07 1982-11-10 Fuji Xerox Co Ltd Forming method of ink jet multinozzle
JPS57208262A (en) * 1981-06-18 1982-12-21 Ibm Drop-on demand type ink jet printing method
DE3176140D1 (en) * 1981-10-30 1987-05-27 Ibm Deutschland Contact device for the detachable connection of electrical components
US4583690A (en) * 1983-04-05 1986-04-22 Hewlett-Packard Company Anti-wetting in fluid nozzles
US4555062A (en) * 1983-04-05 1985-11-26 Hewlett-Packard Company Anti-wetting in fluid nozzles
CA1210067A (en) * 1983-12-08 1986-08-19 Ronald D. Baxter Isfet sensor and method of manufacture
DE3583275D1 (de) * 1984-09-28 1991-07-25 Matsushita Electric Industrial Co Ltd Verfahren zur herstellung eines duesenkoerpers fuer einen tintenstrahldrucker.
CA1237020A (en) * 1984-10-13 1988-05-24 Herbert A. Waggener Silicon nozzle structure and method of manufacture
US4733823A (en) * 1984-10-15 1988-03-29 At&T Teletype Corporation Silicon nozzle structures and method of manufacture
US4647013A (en) * 1985-02-21 1987-03-03 Ford Motor Company Silicon valve
US4628576A (en) * 1985-02-21 1986-12-16 Ford Motor Company Method for fabricating a silicon valve
US4756508A (en) * 1985-02-21 1988-07-12 Ford Motor Company Silicon valve
US4768751A (en) * 1987-10-19 1988-09-06 Ford Motor Company Silicon micromachined non-elastic flow valves
US5176360A (en) * 1988-03-14 1993-01-05 Baxter International Inc. Infusor having fixed and variable flow rate control mechanisms
JPH02502079A (ja) * 1988-03-14 1990-07-12 バクスター、インターナショナル、インコーポレイテッド 固定および可変流量制御機構を有するシステム
US5014750A (en) * 1988-03-14 1991-05-14 Baxter International Inc. Systems having fixed and variable flow rate control mechanisms
US5009251A (en) * 1988-11-15 1991-04-23 Baxter International, Inc. Fluid flow control
SG45171A1 (en) * 1990-03-21 1998-01-16 Boehringer Ingelheim Int Atomising devices and methods
DE4112150C2 (de) * 1990-09-21 1998-11-19 Bosch Gmbh Robert Lochkörper und Ventil mit Lochkörper
IL100224A (en) * 1990-12-04 1994-10-21 Dmw Tech Ltd Spray nozzle
DE4104019C1 (enExample) * 1991-02-09 1992-04-23 Robert Bosch Gmbh, 7000 Stuttgart, De
EP0585854B1 (en) * 1992-08-31 1998-11-11 Canon Kabushiki Kaisha Ink jet head manufacturing method using ion machining and ink jet head manufactured thereby
IL107120A (en) * 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US6007676A (en) * 1992-09-29 1999-12-28 Boehringer Ingelheim International Gmbh Atomizing nozzle and filter and spray generating device
DE69415362T2 (de) * 1993-02-17 1999-06-10 DENSO CORPORATION, Kariya-city, Aichi-pref. Flüssigkeiteinspritzventil
US5569187A (en) * 1994-08-16 1996-10-29 Texas Instruments Incorporated Method and apparatus for wireless chemical supplying
DE19515722C1 (de) * 1995-05-03 1996-07-25 Tricumed Gmbh Implantierbare Infusionspumpe
US5908414A (en) * 1995-05-03 1999-06-01 Tricumed Gmbh Implantable infusion pump
US5992769A (en) * 1995-06-09 1999-11-30 The Regents Of The University Of Michigan Microchannel system for fluid delivery
JP3386099B2 (ja) * 1995-07-03 2003-03-10 セイコーエプソン株式会社 インクジェット式記録ヘッド用ノズルプレート、これの製造方法、及びインクジェット式記録ヘッド
GB2302842B (en) * 1995-07-03 1998-12-30 Seiko Epson Corp A nozzle plate, ink-jet head and manufacturing method thereof
US5658471A (en) * 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
US5757400A (en) * 1996-02-01 1998-05-26 Spectra, Inc. High resolution matrix ink jet arrangement
CA2259625A1 (en) 1996-07-08 1998-01-15 Spraychip Systems Corp. Gas-assisted atomizing device
US6352209B1 (en) 1996-07-08 2002-03-05 Corning Incorporated Gas assisted atomizing devices and methods of making gas-assisted atomizing devices
BR9714615A (pt) 1996-07-08 2004-04-06 Spraychip Systems Corp Dispositivo de atomização de queda de rayleigh e processos de fabricação de dispositvos de atomização de queda de 05 rayleigh
US5901425A (en) * 1996-08-27 1999-05-11 Topaz Technologies Inc. Inkjet print head apparatus
WO1998047712A1 (en) * 1997-04-18 1998-10-29 Topaz Technologies, Inc. Nozzle plate for an ink jet print head
WO1998051506A1 (en) * 1997-05-14 1998-11-19 Seiko Epson Corporation Method of forming nozzle for injectors and method of manufacturing ink jet head
JP3530744B2 (ja) * 1997-07-04 2004-05-24 キヤノン株式会社 インクジェット記録ヘッドの製造方法
DE19742439C1 (de) * 1997-09-26 1998-10-22 Boehringer Ingelheim Int Mikrostrukturiertes Filter
BR9813652A (pt) * 1997-12-19 2000-10-03 Corning Inc Queimador e método para produção de fuligem de óxido de metal
EP1876442A3 (en) 1998-09-17 2008-03-05 Advion BioSciences, Inc. Integrated monolithic microfabricated liquid chromatography system and method
US6363606B1 (en) * 1998-10-16 2002-04-02 Agere Systems Guardian Corp. Process for forming integrated structures using three dimensional printing techniques
US6633031B1 (en) 1999-03-02 2003-10-14 Advion Biosciences, Inc. Integrated monolithic microfabricated dispensing nozzle and liquid chromatography-electrospray system and method
JP2001179987A (ja) * 1999-12-22 2001-07-03 Samsung Electro Mech Co Ltd ノズルプレート及びその製造方法
CN1237572C (zh) 1999-12-30 2006-01-18 阿德维昂生物科学公司 多电雾化装置、系统和方法
AU2001229633A1 (en) 2000-01-18 2001-07-31 Advion Biosciences, Inc. Separation media, multiple electrospray nozzle system and method
KR100499118B1 (ko) 2000-02-24 2005-07-04 삼성전자주식회사 단결정 실리콘 웨이퍼를 이용한 일체형 유체 노즐어셈블리 및 그 제작방법
DE10101875B4 (de) * 2001-01-16 2006-05-04 Infineon Technologies Ag Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung
WO2003048641A1 (en) * 2001-12-04 2003-06-12 Atock Co., Ltd. Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid
JP3975272B2 (ja) * 2002-02-21 2007-09-12 独立行政法人産業技術総合研究所 超微細流体ジェット装置
WO2005024927A1 (en) * 2003-09-09 2005-03-17 Csg Solar, Ag Improved method of etching silicon
EP1665394A4 (en) * 2003-09-09 2006-12-13 Csg Solar Ag SETTING MASKS BY FLOW
CN100561668C (zh) * 2003-09-09 2009-11-18 Csg索拉尔有限公司 在有机树脂材料中形成开口的改进方法
US7548775B2 (en) * 2003-10-21 2009-06-16 The Regents Of The University Of Michigan Intracranial neural interface system
US7347532B2 (en) * 2004-08-05 2008-03-25 Fujifilm Dimatix, Inc. Print head nozzle formation
US9014796B2 (en) 2005-06-14 2015-04-21 Regents Of The University Of Michigan Flexible polymer microelectrode with fluid delivery capability and methods for making same
CN101583309B (zh) * 2005-10-07 2012-07-04 神经连结科技公司 模块化多通道微电极阵列及其制造方法
WO2007089738A2 (en) 2006-01-26 2007-08-09 The Regents Of The University Of Michigan Microelectrode with laterally extending platform for reduction of tissue encapsulation
JP4881126B2 (ja) * 2006-10-25 2012-02-22 株式会社東芝 ノズルプレートの製造方法、および液滴吐出ヘッドの製造方法
US8731673B2 (en) 2007-02-26 2014-05-20 Sapiens Steering Brain Stimulation B.V. Neural interface system
US20100276505A1 (en) * 2007-09-26 2010-11-04 Roger Earl Smith Drilling in stretched substrates
US8224417B2 (en) * 2007-10-17 2012-07-17 Neuronexus Technologies, Inc. Guide tube for an implantable device system
US8565894B2 (en) * 2007-10-17 2013-10-22 Neuronexus Technologies, Inc. Three-dimensional system of electrode leads
WO2009052425A1 (en) * 2007-10-17 2009-04-23 Neuronexus Technologies Implantable device including a resorbable carrier
US8498720B2 (en) * 2008-02-29 2013-07-30 Neuronexus Technologies, Inc. Implantable electrode and method of making the same
US20090240314A1 (en) * 2008-03-24 2009-09-24 Kong K C Implantable electrode lead system with a three dimensional arrangement and method of making the same
US9289142B2 (en) 2008-03-24 2016-03-22 Neuronexus Technologies, Inc. Implantable electrode lead system with a three dimensional arrangement and method of making the same
EP2349579A4 (en) * 2008-10-31 2014-01-22 Fujifilm Dimatix Inc SHAPES OF A NOZZLE OUTLET
US8197029B2 (en) * 2008-12-30 2012-06-12 Fujifilm Corporation Forming nozzles
JP5658263B2 (ja) * 2009-10-16 2015-01-21 サピエンス ステアリング ブレイン スティムレーション ベー ヴィ 神経インターフェースシステム
CN102686147B (zh) 2009-11-05 2016-01-20 格雷特巴奇有限公司 波导神经接口装置
US9155861B2 (en) 2010-09-20 2015-10-13 Neuronexus Technologies, Inc. Neural drug delivery system with fluidic threads
JP6901446B2 (ja) 2018-09-03 2021-07-14 株式会社東芝 無線通信装置、無線通信システム、無線通信方法及びプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665946A (en) * 1951-05-29 1954-01-12 Arthur E Broughton Spray nozzle
US2834635A (en) * 1955-06-22 1958-05-13 Muellermist Irrigation Co Liquid spray device
US2987262A (en) * 1959-11-24 1961-06-06 Lodding Engineering Corp Removable and replaceable shower device
US3125295A (en) * 1960-12-30 1964-03-17 Crystal
US3211088A (en) * 1962-05-04 1965-10-12 Sperry Rand Corp Exponential horn printer
JPS5040616B1 (enExample) * 1970-03-18 1975-12-25
US3655530A (en) * 1970-06-15 1972-04-11 Mead Corp Fabrication of orifices
US3742230A (en) * 1972-06-29 1973-06-26 Massachusetts Inst Technology Soft x-ray mask support substrate

Also Published As

Publication number Publication date
FR2296504A1 (fr) 1976-07-30
US3921916A (en) 1975-11-25
CA1037519A (en) 1978-08-29
FR2296504B1 (enExample) 1978-05-12
JPS5184641A (enExample) 1976-07-24
DE2555462C2 (de) 1982-06-03
GB1492465A (en) 1977-11-23
JPS5516070B2 (enExample) 1980-04-28
DE2555462A1 (de) 1976-07-08

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