IT1039921B - Procedimento per fabbricare undispositivo a semiconduttori - Google Patents

Procedimento per fabbricare undispositivo a semiconduttori

Info

Publication number
IT1039921B
IT1039921B IT25538/75A IT2553875A IT1039921B IT 1039921 B IT1039921 B IT 1039921B IT 25538/75 A IT25538/75 A IT 25538/75A IT 2553875 A IT2553875 A IT 2553875A IT 1039921 B IT1039921 B IT 1039921B
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
IT25538/75A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742435905 external-priority patent/DE2435905C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1039921B publication Critical patent/IT1039921B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/40—Vertical BJTs
    • H10D10/441—Vertical BJTs having an emitter-base junction ending at a main surface of the body and a base-collector junction ending at a lateral surface of the body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
IT25538/75A 1974-07-25 1975-07-18 Procedimento per fabbricare undispositivo a semiconduttori IT1039921B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742435905 DE2435905C3 (de) 1974-07-25 Verfahren zum Herstellen einer Halbleiteranordnung

Publications (1)

Publication Number Publication Date
IT1039921B true IT1039921B (it) 1979-12-10

Family

ID=5921549

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25538/75A IT1039921B (it) 1974-07-25 1975-07-18 Procedimento per fabbricare undispositivo a semiconduttori

Country Status (6)

Country Link
US (1) US3963524A (en:Method)
JP (1) JPS5140773A (en:Method)
CA (1) CA1070028A (en:Method)
FR (1) FR2280201A1 (en:Method)
GB (1) GB1492447A (en:Method)
IT (1) IT1039921B (en:Method)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143455A (en) * 1976-03-11 1979-03-13 Siemens Aktiengesellschaft Method of producing a semiconductor component
JPS5367383A (en) * 1976-08-08 1978-06-15 Fairchild Camera Instr Co Method of producing small ic implantation logic semiconductor
JPS6035818B2 (ja) * 1976-09-22 1985-08-16 日本電気株式会社 半導体装置の製造方法
US4135954A (en) * 1977-07-12 1979-01-23 International Business Machines Corporation Method for fabricating self-aligned semiconductor devices utilizing selectively etchable masking layers
US4233934A (en) * 1978-12-07 1980-11-18 General Electric Company Guard ring for TGZM processing
JPS6028135B2 (ja) * 1979-05-18 1985-07-03 富士通株式会社 半導体装置の製造方法
JPS58127374A (ja) * 1982-01-25 1983-07-29 Hitachi Ltd 半導体装置の製造方法
JPS58108737A (ja) * 1982-11-15 1983-06-28 Nec Corp 半導体装置の製造方法
IT1231913B (it) * 1987-10-23 1992-01-15 Sgs Microelettronica Spa Procedimento di fabbricazione di transistori ad alta frequenza.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
BE759667A (fr) * 1969-12-01 1971-06-01 Philips Nv Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur obtenu par la mise en oeuvre de ce procede
GB1332931A (en) * 1970-01-15 1973-10-10 Mullard Ltd Methods of manufacturing a semiconductor device
US3756861A (en) * 1972-03-13 1973-09-04 Bell Telephone Labor Inc Bipolar transistors and method of manufacture
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit
US3898105A (en) * 1973-10-25 1975-08-05 Mostek Corp Method for making FET circuits

Also Published As

Publication number Publication date
FR2280201A1 (fr) 1976-02-20
JPS5140773A (en) 1976-04-05
US3963524A (en) 1976-06-15
FR2280201B1 (en:Method) 1983-03-18
GB1492447A (en) 1977-11-16
DE2435905A1 (de) 1976-02-05
DE2435905B2 (de) 1976-08-26
CA1070028A (en) 1980-01-15

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