IT1039341B - Dispositivo ad effetto di campo a metallo isolante semiconduttore - Google Patents

Dispositivo ad effetto di campo a metallo isolante semiconduttore

Info

Publication number
IT1039341B
IT1039341B IT24685/75A IT2468575A IT1039341B IT 1039341 B IT1039341 B IT 1039341B IT 24685/75 A IT24685/75 A IT 24685/75A IT 2468575 A IT2468575 A IT 2468575A IT 1039341 B IT1039341 B IT 1039341B
Authority
IT
Italy
Prior art keywords
field
effect device
semiconducting metal
metal insulation
insulation
Prior art date
Application number
IT24685/75A
Other languages
English (en)
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of IT1039341B publication Critical patent/IT1039341B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/905Plural dram cells share common contact or common trench

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Element Separation (AREA)
IT24685/75A 1974-06-24 1975-06-23 Dispositivo ad effetto di campo a metallo isolante semiconduttore IT1039341B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7207874A JPS5534582B2 (it) 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
IT1039341B true IT1039341B (it) 1979-12-10

Family

ID=13479001

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24685/75A IT1039341B (it) 1974-06-24 1975-06-23 Dispositivo ad effetto di campo a metallo isolante semiconduttore

Country Status (11)

Country Link
US (1) US4012762A (it)
JP (1) JPS5534582B2 (it)
AT (1) AT370560B (it)
CA (1) CA1044377A (it)
CH (1) CH586465A5 (it)
DE (1) DE2527621C3 (it)
FR (1) FR2276696A1 (it)
GB (1) GB1511531A (it)
IT (1) IT1039341B (it)
NL (1) NL7507540A (it)
SE (1) SE406136B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE392783B (sv) * 1975-06-19 1977-04-18 Asea Ab Halvledaranordning innefattande en tyristor och en felteffekttransistordel
US4140547A (en) * 1976-09-09 1979-02-20 Tokyo Shibaura Electric Co., Ltd. Method for manufacturing MOSFET devices by ion-implantation
US4173791A (en) * 1977-09-16 1979-11-06 Fairchild Camera And Instrument Corporation Insulated gate field-effect transistor read-only memory array
IT1110843B (it) * 1978-02-27 1986-01-06 Rca Corp Contatto affondato per dispositivi mos di tipo complementare
US4333099A (en) * 1978-02-27 1982-06-01 Rca Corporation Use of silicide to bridge unwanted polycrystalline silicon P-N junction
JPS54149469A (en) * 1978-05-16 1979-11-22 Toshiba Corp Semiconductor device
US4364078A (en) * 1978-08-15 1982-12-14 Synertek Edge barrier of polysilicon and metal for integrated circuit chips
US4262299A (en) * 1979-01-29 1981-04-14 Rca Corporation Semiconductor-on-insulator device and method for its manufacture
JPS5836506B2 (ja) * 1980-11-20 1983-08-09 富士通株式会社 半導体記憶装置
JPS60167278U (ja) * 1984-04-13 1985-11-06 原電子測器株式会社 電磁装置
JPS60231356A (ja) * 1984-04-28 1985-11-16 Mitsubishi Electric Corp 相補形金属酸化膜半導体集積回路装置
JPS61222137A (ja) * 1985-03-06 1986-10-02 Sharp Corp チップ識別用凹凸パターン形成方法
US4996576A (en) * 1986-11-24 1991-02-26 At&T Bell Laboratories Radiation-sensitive device
SE461490B (sv) * 1987-08-24 1990-02-19 Asea Ab Mos-transistor utbildad paa ett isolerande underlag
DE58906972D1 (de) * 1988-08-16 1994-03-24 Siemens Ag Bipolartransistor als Schutzelement für integrierte Schaltungen.
JP2701502B2 (ja) * 1990-01-25 1998-01-21 日産自動車株式会社 半導体装置
US6239662B1 (en) * 1998-02-25 2001-05-29 Citizen Watch Co., Ltd. Mis variable capacitor and temperature-compensated oscillator using the same
US6329703B1 (en) * 1998-02-25 2001-12-11 Infineon Technologies Ag Contact between a monocrystalline silicon region and a polycrystalline silicon structure and method for producing such a contact
US11171039B2 (en) * 2018-03-29 2021-11-09 Taiwan Semiconductor Manufacturing Company Ltd. Composite semiconductor substrate, semiconductor device and method for manufacturing the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE300472B (it) * 1965-03-31 1968-04-29 Asea Ab
US3710204A (en) * 1967-05-20 1973-01-09 Telefunken Patent A semiconductor device having a screen electrode of intrinsic semiconductor material
JPS497870B1 (it) * 1969-06-06 1974-02-22
US3576478A (en) * 1969-07-22 1971-04-27 Philco Ford Corp Igfet comprising n-type silicon substrate, silicon oxide gate insulator and p-type polycrystalline silicon gate electrode
US3602782A (en) * 1969-12-05 1971-08-31 Thomas Klein Conductor-insulator-semiconductor fieldeffect transistor with semiconductor layer embedded in dielectric underneath interconnection layer
US3787251A (en) * 1972-04-24 1974-01-22 Signetics Corp Mos semiconductor structure with increased field threshold and method for making the same
US3841926A (en) * 1973-01-02 1974-10-15 Ibm Integrated circuit fabrication process
JPS5314420B2 (it) * 1973-05-14 1978-05-17
JPS523277B2 (it) * 1973-05-19 1977-01-27

Also Published As

Publication number Publication date
AU8232375A (en) 1976-12-23
JPS5534582B2 (it) 1980-09-08
DE2527621A1 (de) 1976-01-22
DE2527621C3 (de) 1984-09-13
DE2527621B2 (de) 1981-04-30
JPS512380A (it) 1976-01-09
AT370560B (de) 1983-04-11
SE406136B (sv) 1979-01-22
CA1044377A (en) 1978-12-12
ATA485675A (de) 1982-08-15
GB1511531A (en) 1978-05-24
FR2276696B1 (it) 1979-01-19
US4012762A (en) 1977-03-15
CH586465A5 (it) 1977-03-31
FR2276696A1 (fr) 1976-01-23
NL7507540A (nl) 1975-12-30
SE7507147L (sv) 1975-12-29

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