IT1000480B - Composizione e processo per l at tivazione di corpi resinosi per una metallizzazione aderente - Google Patents
Composizione e processo per l at tivazione di corpi resinosi per una metallizzazione aderenteInfo
- Publication number
- IT1000480B IT1000480B IT5431073A IT5431073A IT1000480B IT 1000480 B IT1000480 B IT 1000480B IT 5431073 A IT5431073 A IT 5431073A IT 5431073 A IT5431073 A IT 5431073A IT 1000480 B IT1000480 B IT 1000480B
- Authority
- IT
- Italy
- Prior art keywords
- activation
- composition
- resinous bodies
- adherent metallization
- metallization
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31474872A | 1972-12-13 | 1972-12-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1000480B true IT1000480B (it) | 1976-03-30 |
Family
ID=23221265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT5431073A IT1000480B (it) | 1972-12-13 | 1973-12-14 | Composizione e processo per l at tivazione di corpi resinosi per una metallizzazione aderente |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5224549B2 (ja) |
AT (1) | AT328822B (ja) |
CH (1) | CH606471A5 (ja) |
DE (1) | DE2362381C3 (ja) |
DK (1) | DK148485B (ja) |
ES (1) | ES421398A1 (ja) |
FR (1) | FR2210652B1 (ja) |
GB (1) | GB1401600A (ja) |
IT (1) | IT1000480B (ja) |
NL (1) | NL178018C (ja) |
SE (1) | SE419239B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK154600C (da) * | 1974-11-07 | 1989-04-17 | Kollmorgen Tech Corp | Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis. |
JPS536376A (en) * | 1976-07-06 | 1978-01-20 | Minolta Camera Kk | Pretreating of reinforced plastics for electr plating |
JPS5418875A (en) * | 1977-07-12 | 1979-02-13 | Nippon Denki Kagaku Co Ltd | Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate |
DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
DK175025B1 (da) * | 2002-09-26 | 2004-05-03 | Inst Produktudvikling | Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652351A (en) * | 1970-05-13 | 1972-03-28 | Carus Corp | Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions |
-
1973
- 1973-12-07 GB GB5673073A patent/GB1401600A/en not_active Expired
- 1973-12-10 AT AT1029173A patent/AT328822B/de not_active IP Right Cessation
- 1973-12-11 SE SE7316722A patent/SE419239B/sv unknown
- 1973-12-11 CH CH1732473A patent/CH606471A5/xx not_active IP Right Cessation
- 1973-12-12 DK DK673573AA patent/DK148485B/da unknown
- 1973-12-12 FR FR7344339A patent/FR2210652B1/fr not_active Expired
- 1973-12-12 DE DE2362381A patent/DE2362381C3/de not_active Expired
- 1973-12-12 ES ES421398A patent/ES421398A1/es not_active Expired
- 1973-12-13 NL NL7317078A patent/NL178018C/xx not_active IP Right Cessation
- 1973-12-13 JP JP14115773A patent/JPS5224549B2/ja not_active Expired
- 1973-12-14 IT IT5431073A patent/IT1000480B/it active
Also Published As
Publication number | Publication date |
---|---|
JPS4989771A (ja) | 1974-08-27 |
ATA1029173A (de) | 1975-06-15 |
AT328822B (de) | 1976-04-12 |
ES421398A1 (es) | 1976-04-16 |
DK148485B (da) | 1985-07-15 |
DE2365730A1 (de) | 1976-04-22 |
AU6175973A (en) | 1975-04-24 |
DE2365730B2 (de) | 1977-04-21 |
NL178018B (nl) | 1985-08-01 |
CH606471A5 (ja) | 1978-10-31 |
GB1401600A (en) | 1975-07-16 |
JPS5224549B2 (ja) | 1977-07-01 |
DE2362381A1 (de) | 1974-07-04 |
FR2210652B1 (ja) | 1976-06-25 |
NL7317078A (ja) | 1974-06-17 |
SE419239B (sv) | 1981-07-20 |
NL178018C (nl) | 1986-01-02 |
DE2362381C3 (de) | 1978-08-31 |
FR2210652A1 (ja) | 1974-07-12 |
DE2362381B2 (de) | 1977-05-05 |
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