IN2015DN08200A - - Google Patents

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Publication number
IN2015DN08200A
IN2015DN08200A IN8200DEN2015A IN2015DN08200A IN 2015DN08200 A IN2015DN08200 A IN 2015DN08200A IN 8200DEN2015 A IN8200DEN2015 A IN 8200DEN2015A IN 2015DN08200 A IN2015DN08200 A IN 2015DN08200A
Authority
IN
India
Prior art keywords
copolymer latex
copolymerizing
carbonate
carboxylic acid
conjugated diene
Prior art date
Application number
Inventor
Atsumi Tanemura
Kimio Misaki
Koichi Maki
Original Assignee
Nippon A & L Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon A & L Inc filed Critical Nippon A & L Inc
Publication of IN2015DN08200A publication Critical patent/IN2015DN08200A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/10—Latex
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/10—Latex
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C09J161/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inorganic Chemistry (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)

Abstract

A copolymer latex for an adhesive containing: a copolymer latex obtained by copolymerizing an aliphatic conjugated diene monomer and another monomer copolymerizable therewith; an alkali metal salt of a carboxylic acid; and a carbonate of a divalent metal.
IN8200DEN2015 2013-03-19 2014-02-19 IN2015DN08200A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013057098 2013-03-19
PCT/JP2014/053852 WO2014148178A1 (en) 2013-03-19 2014-02-19 Copolymer latex for adhesive and adhesive composition

Publications (1)

Publication Number Publication Date
IN2015DN08200A true IN2015DN08200A (en) 2015-09-25

Family

ID=51579871

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8200DEN2015 IN2015DN08200A (en) 2013-03-19 2014-02-19

Country Status (9)

Country Link
US (1) US9428674B2 (en)
EP (1) EP2977421B1 (en)
JP (1) JP5671188B1 (en)
KR (1) KR101627987B1 (en)
CN (1) CN105143383B (en)
ES (1) ES2706479T3 (en)
IN (1) IN2015DN08200A (en)
TR (1) TR201900279T4 (en)
WO (1) WO2014148178A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102422205B1 (en) 2016-02-25 2022-07-18 가부시키가이샤 데라오카 세이사쿠쇼 Adhesive composition and adhesive tape
CN109688992A (en) * 2016-09-28 2019-04-26 日本瑞翁株式会社 The manufacturing method of packaging structure
WO2019058807A1 (en) * 2017-09-22 2019-03-28 日本ゼオン株式会社 Production method for latex composition

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241083A (en) * 1986-11-28 1988-10-06 Idemitsu Petrochem Co Ltd Adhesive
JPH075870B2 (en) * 1987-12-28 1995-01-25 住友ダウ株式会社 Adhesive composition of rubber and fiber
JP2824529B2 (en) * 1989-06-23 1998-11-11 武田薬品工業株式会社 Emulsion adhesive for vinyl chloride resin
JPH0333276A (en) * 1989-06-29 1991-02-13 Lion Corp Adhesive composition for carpet packing
JP2676931B2 (en) * 1989-08-01 1997-11-17 日本合成ゴム株式会社 Latex composition
JPH086077B2 (en) * 1989-10-03 1996-01-24 日本合成ゴム株式会社 Carpet backing agent
JP3652860B2 (en) 1997-11-27 2005-05-25 電気化学工業株式会社 Chloroprene latex composition and method for producing the same, and adhesive composition using the same
JPH11256130A (en) 1997-12-22 1999-09-21 Kuraray Co Ltd Adhesive, its production and laminate
JP2001026756A (en) * 1999-07-14 2001-01-30 Denki Kagaku Kogyo Kk Water-based adhesive
JP2001329232A (en) * 2000-05-24 2001-11-27 Bando Chem Ind Ltd Method for bonding conveyor belt and conveyor belt
JP2002138264A (en) * 2000-11-06 2002-05-14 Denki Kagaku Kogyo Kk Method for bonding elastomeric material and bonded structure
JP4626911B2 (en) 2000-11-20 2011-02-09 電気化学工業株式会社 Polychloroprene latex composition and aqueous adhesive
JP2002155167A (en) * 2000-11-20 2002-05-28 Denki Kagaku Kogyo Kk Polychloroprene latex composition and aqueous adhesive
JP4139692B2 (en) * 2003-01-07 2008-08-27 電気化学工業株式会社 Polychloroprene adhesive composition and adhesive structure
JP2004352924A (en) * 2003-05-30 2004-12-16 Dainippon Ink & Chem Inc Resin composition for adhesive, and chlorinated rubber adhesive
GB2421030B (en) 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
EP1894667A4 (en) 2005-06-10 2009-12-02 Senju Metal Industry Co METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART
KR101475092B1 (en) * 2007-03-29 2014-12-22 제온 코포레이션 Nitrile copolymer rubber composition and nitrile copolymer latex composition
EP1978063A1 (en) * 2007-04-05 2008-10-08 YKI, Ytkemiska Institutet AB An aqueous hydrophobic coating composition comprising a fatty acid or a salt thereof
WO2009011341A1 (en) 2007-07-13 2009-01-22 Senju Metal Industry Co., Ltd. Lead-free solder for vehicle, and in-vehicle electronic circuit
JP4962570B2 (en) 2007-07-18 2012-06-27 千住金属工業株式会社 In-containing lead-free solder for automotive electronic circuits
CN101932649B (en) * 2008-01-30 2013-04-24 日本瑞翁株式会社 Nitrile copolymer latex composition and nitrile copolymer rubber composition
CN102066044B (en) 2009-04-20 2014-05-21 松下电器产业株式会社 Soldering material and electronic component assembly
JP6000124B2 (en) * 2009-11-24 2016-09-28 オムノバ ソリューソンズ インコーポレーティッド Rubber adhesive composition containing vinylpyridine latex polymer containing nitrogen-containing monomer

Also Published As

Publication number Publication date
JP5671188B1 (en) 2015-02-18
JPWO2014148178A1 (en) 2017-02-16
EP2977421A1 (en) 2016-01-27
CN105143383B (en) 2016-12-14
TR201900279T4 (en) 2019-02-21
WO2014148178A1 (en) 2014-09-25
US9428674B2 (en) 2016-08-30
KR20150119042A (en) 2015-10-23
CN105143383A (en) 2015-12-09
KR101627987B1 (en) 2016-06-07
EP2977421B1 (en) 2018-10-24
EP2977421A4 (en) 2016-12-14
US20160040046A1 (en) 2016-02-11
ES2706479T3 (en) 2019-03-29

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