IN2015DN03088A - - Google Patents

Info

Publication number
IN2015DN03088A
IN2015DN03088A IN3088DEN2015A IN2015DN03088A IN 2015DN03088 A IN2015DN03088 A IN 2015DN03088A IN 3088DEN2015 A IN3088DEN2015 A IN 3088DEN2015A IN 2015DN03088 A IN2015DN03088 A IN 2015DN03088A
Authority
IN
India
Prior art keywords
array
fluid
fluid delivery
delivery system
flow
Prior art date
Application number
Other languages
English (en)
Inventor
Laurent Regimbal
Sean Archer
Steve Shafer
Lyle R Tufty
Original Assignee
Liquidcool Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquidcool Solutions Inc filed Critical Liquidcool Solutions Inc
Publication of IN2015DN03088A publication Critical patent/IN2015DN03088A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
IN3088DEN2015 2012-09-25 2013-09-25 IN2015DN03088A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261705409P 2012-09-25 2012-09-25
PCT/US2013/061565 WO2014052377A1 (en) 2012-09-25 2013-09-25 Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices

Publications (1)

Publication Number Publication Date
IN2015DN03088A true IN2015DN03088A (de) 2015-10-02

Family

ID=50338629

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3088DEN2015 IN2015DN03088A (de) 2012-09-25 2013-09-25

Country Status (7)

Country Link
US (2) US9451726B2 (de)
EP (1) EP2901829B1 (de)
JP (1) JP6293152B2 (de)
KR (1) KR102137294B1 (de)
CN (1) CN104770073B (de)
IN (1) IN2015DN03088A (de)
WO (1) WO2014052377A1 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10123464B2 (en) 2012-02-09 2018-11-06 Hewlett Packard Enterprise Development Lp Heat dissipating system
EP2826347B1 (de) * 2012-03-12 2017-10-25 Hewlett-Packard Enterprise Development LP Kühlung einer flüssigkeitstemperaturregelung
WO2014027405A1 (ja) * 2012-08-15 2014-02-20 富士通株式会社 受熱装置、冷却装置、及び電子装置
US9451726B2 (en) * 2012-09-25 2016-09-20 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
WO2014051604A1 (en) 2012-09-28 2014-04-03 Hewlett-Packard Development Company, L.P. Cooling assembly
US9803937B2 (en) 2013-01-31 2017-10-31 Hewlett Packard Enterprise Development Lp Liquid cooling
AU2014262796A1 (en) 2013-05-06 2015-12-24 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
JP2014222745A (ja) * 2013-05-14 2014-11-27 富士通株式会社 冷却構造体、基板ユニット、システム基板体及び電子機器
CN105981486B (zh) * 2013-11-22 2019-05-21 液体冷却解决方案公司 可缩放的液体浸没冷却系统
WO2015175693A1 (en) 2014-05-13 2015-11-19 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
WO2015174983A1 (en) * 2014-05-15 2015-11-19 Hewlett-Packard Development Company, L.P. Fluid manifold
WO2016019386A1 (en) * 2014-08-01 2016-02-04 Green Revolution Cooling, Inc. Controller for oil-cooled rack with multiple modes of operation
WO2016076882A1 (en) 2014-11-14 2016-05-19 Hewlett Packard Enterprise Development Lp Cooling rack
CN104754924B (zh) * 2015-03-31 2016-02-03 广东申菱环境系统股份有限公司 液冷装置和辅助散热装置结合的服务器散热系统
US10237999B2 (en) * 2015-10-30 2019-03-19 Hewlett Packard Enterprise Development Lp Configurable node expansion space
US10206312B2 (en) 2015-12-21 2019-02-12 Dell Products, L.P. Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation
US9968010B2 (en) * 2015-12-21 2018-05-08 Dell Products, L.P. Information handling system having flexible chassis block radiators
US9795065B2 (en) 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem
US10064314B2 (en) 2015-12-21 2018-08-28 Dell Products, L.P. Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance
US10156873B2 (en) * 2015-12-21 2018-12-18 Dell Products, L.P. Information handling system having fluid manifold with embedded heat exchanger system
US10146231B2 (en) 2015-12-21 2018-12-04 Dell Products, L.P. Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
US10485137B2 (en) 2017-03-01 2019-11-19 Microsoft Technology Licensing, Llc Cooling device for fluid submersion of electronics
US10188017B2 (en) 2017-05-31 2019-01-22 Microsoft Technology Licensing, Llc Server cooling fluid inlet and pickup placement in submerged cooling enclosures
EP3685642A4 (de) * 2017-09-20 2021-07-28 Liquidcool Solutions, Inc. Flüssigkeitstauchgekühlte elektronische systeme und vorrichtungen
CN107690267B (zh) * 2017-09-30 2023-11-28 深圳绿色云图科技有限公司 一种数据中心冷却系统以及数据中心
JP7036416B2 (ja) * 2017-10-18 2022-03-15 Ｎｅｃプラットフォームズ株式会社 装置
US10892208B2 (en) * 2017-10-19 2021-01-12 Beijing E. Motor Advance Co. Ltd. Heat dissipation apparatus and method for power semiconductor devices
US10438867B2 (en) * 2018-03-08 2019-10-08 Northrop Grumman Systems Corporation Immersion cooling temperature control method, system, and apparatus
CN108304054B (zh) * 2018-03-26 2023-07-21 广东西江数据科技有限公司 一种自封式回油结构
US10165707B1 (en) * 2018-04-27 2018-12-25 Northrop Grumman Systems Corporation Device and method for providing immersion cooling in a compact-format circuit card environment
US10225958B1 (en) * 2018-05-03 2019-03-05 Baidu Usa Llc Liquid cooling system for a data center
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
US11102912B2 (en) 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform
US11129298B2 (en) 2018-09-19 2021-09-21 Tmgcore, Inc. Process for liquid immersion cooling
US10694643B2 (en) 2018-09-19 2020-06-23 TMGCore, LLC Ballast blocks for a liquid immersion cooling system
US10624237B2 (en) 2018-09-19 2020-04-14 TMGCore, LLC Liquid immersion cooling vessel and components thereof
US10653043B2 (en) 2018-09-19 2020-05-12 TMGCore, LLC Vapor management system for a liquid immersion cooling system
JP2022501728A (ja) * 2018-09-19 2022-01-06 ティーエムジーコア，エルエルシー 液浸冷却プラットフォーム
US10617032B1 (en) 2018-09-19 2020-04-07 TMGCore, LLC Robot for a liquid immersion cooling system
US10969842B2 (en) 2018-09-19 2021-04-06 TMGCore, LLC Chassis for a liquid immersion cooling system
US11895804B2 (en) 2018-09-19 2024-02-06 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
US10609839B1 (en) 2018-09-28 2020-03-31 Liquidcool Solutions, Inc. Liquid submersion cooled electronic systems and devices
US11785747B2 (en) 2018-11-16 2023-10-10 TMGCore. INC. Methods and devices for testing immersion cooling controllers
JP6696686B1 (ja) * 2019-02-05 2020-05-20 Ｎｅｃプラットフォームズ株式会社 配管保護装置および冷却装置
CN110413081B (zh) * 2019-06-25 2021-04-09 苏州浪潮智能科技有限公司 一种散热装置及用于服务器的液冷方法
US11140799B2 (en) * 2019-09-18 2021-10-05 Baidu Usa Llc InRow liquid cooling module
US11452241B2 (en) 2019-11-18 2022-09-20 Liquidcool Solutions, Inc. Liquid submersion cooled server module assemblies and server systems that include the server module assemblies
TWI773981B (zh) * 2020-04-10 2022-08-11 緯創資通股份有限公司 流體分流裝置以及具有阻流器的流體分流模組
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
US11877428B2 (en) * 2021-04-20 2024-01-16 Dell Products L.P. Modular horizontal rack manifold for liquid cooling
US11703137B2 (en) * 2021-07-28 2023-07-18 Ford Global Technologies, Llc Coolant distribution module for electrified vehicle
US11871547B2 (en) * 2021-09-02 2024-01-09 Baidu Usa Llc Two phase system for enclosure systems
US11910575B2 (en) 2021-09-02 2024-02-20 Baidu Usa Llc Rack systems and packaging for servers
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
TW202328569A (zh) 2021-10-11 2023-07-16 美商Ｔｍｇ科爾股份有限公司 在液體浸沒式冷卻中採用空氣冷卻電腦的方法和設備
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
CN117440641A (zh) * 2022-07-13 2024-01-23 华为云计算技术有限公司 计算设备及基于相变浸没液冷系统的液冷工质分配单元
WO2024059016A1 (en) * 2022-09-14 2024-03-21 Green Revolution Cooling, Inc. System and method for supplying uniform flow of dielectric cooling fluid for data servers

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT231661B (de) * 1962-07-13 1964-02-10 Luwa Ag Klimaanlage und Differenzdruckregler hiefür
US3485534A (en) * 1967-12-19 1969-12-23 Frederick Wheelock Wanzenberg Deep mine ore retrieval system
US4445629A (en) * 1980-11-26 1984-05-01 Horix Manufacturing Company Container filling machine product dispensing cylinder
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US5523028A (en) * 1995-01-05 1996-06-04 Cool Fog Sysems, Inc. Fogger bar assembly
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
JP3296260B2 (ja) * 1997-09-01 2002-06-24 三菱電機株式会社 高圧電気機器の水冷装置
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
JP4199018B2 (ja) * 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
DE102004008461A1 (de) * 2004-02-17 2005-10-06 Rittal Gmbh & Co. Kg Gehäuseanordnung
US7420804B2 (en) * 2004-06-30 2008-09-02 Intel Corporation Liquid cooling system including hot-swappable components
JP4321413B2 (ja) * 2004-09-02 2009-08-26 株式会社日立製作所 ディスクアレイ装置
US7355852B2 (en) * 2004-09-30 2008-04-08 Amphenol Corporation Modular liquid cooling of electronic assemblies
US7380409B2 (en) * 2004-09-30 2008-06-03 International Business Machines Corporation Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
US20080016887A1 (en) * 2006-04-19 2008-01-24 Locke Marcos A Pressure balancing accumulator
DE202006007275U1 (de) * 2006-05-06 2006-09-07 Schroff Gmbh Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen
US8240165B2 (en) * 2007-09-13 2012-08-14 Vette Corp. Liquid cooling circuits and method for electrical cabinets, drawers, bays, modules, circuit boards and electrical components using quick-disconnect fittings for interfacing to a host cooling source
US7946383B2 (en) * 2007-11-15 2011-05-24 Ge-Hitachi Nuclear Energy Americas Llc Acoustic load mitigator
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
CN102037426B (zh) * 2008-04-21 2014-08-06 固核电脑公司 一种液体浸没式冷却式服务器电脑阵列、服务器电脑
US7639499B1 (en) * 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US7826216B2 (en) * 2008-10-08 2010-11-02 Dell Products L.P. Information handling center cooling system
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7978472B2 (en) * 2009-06-10 2011-07-12 International Business Machines Corporation Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
US8035972B2 (en) * 2009-07-31 2011-10-11 Oracle America, Inc. Method and apparatus for liquid cooling computer equipment
US8522569B2 (en) * 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US20110240281A1 (en) * 2010-03-31 2011-10-06 Industrial Idea Partners, Inc. Liquid-Based Cooling System For Data Centers Having Proportional Flow Control Device
WO2011136842A1 (en) * 2010-04-26 2011-11-03 Baker Richard L Vertical planter
US8351206B2 (en) * 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
WO2012030473A2 (en) * 2010-08-30 2012-03-08 Hardcore Computer, Inc. Server case with optical input/output and/or wireless power supply
US8514575B2 (en) 2010-11-16 2013-08-20 International Business Machines Corporation Multimodal cooling apparatus for an electronic system
US20150257303A1 (en) * 2011-06-27 2015-09-10 Ebullient, Llc Method of cooling multiple processors using series-connected heat sinks
US9854715B2 (en) * 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US9901013B2 (en) * 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9848509B2 (en) * 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US20150237767A1 (en) * 2011-06-27 2015-08-20 Ebullient, Llc Heat sink for use with pumped coolant
US9832913B2 (en) * 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
US20130340427A1 (en) * 2012-06-25 2013-12-26 GM Global Technology Operations LLC Engine including low pressure egr system and internal egr
US9873511B2 (en) * 2012-09-24 2018-01-23 Hamilton Sundstrand Corporation Primary heat exchanger crossover bypass manifold
US9451726B2 (en) * 2012-09-25 2016-09-20 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
FR3002410B1 (fr) * 2013-02-20 2016-06-03 Bull Sas Carte electronique pourvue d'un systeme de refroidissement liquide
FR3002624B1 (fr) * 2013-02-28 2015-02-27 Bull Sas Repartiteur hydraulique
DE202014010695U1 (de) * 2013-03-26 2016-05-09 Zakryitoe Aktsionernoe Obschestvo "Rsc Technologies" Montagegestell für die Anordnung von elektronischen Komponenten
US9432621B2 (en) 2014-02-19 2016-08-30 Citrix Systems, Inc. Techniques for interfacing a user to an online meeting
US20160366792A1 (en) * 2014-05-28 2016-12-15 Hewlett Packard Enterprise Development Lp Multiple tank cooling system
WO2016053260A1 (en) * 2014-09-29 2016-04-07 Hewlett Packard Enterprise Development Lp Immersion cooled top-loading computing cartridges
US10080310B2 (en) * 2015-06-26 2018-09-18 International Business Machines Corporation Bypassing a removed element in a liquid cooling system
US10188016B2 (en) * 2015-10-30 2019-01-22 Hewlett Packard Enterprise Development Lp Node blind mate liquid cooling

Also Published As

Publication number Publication date
JP6293152B2 (ja) 2018-03-14
KR20150060894A (ko) 2015-06-03
JP2015536049A (ja) 2015-12-17
KR102137294B1 (ko) 2020-07-23
CN104770073B (zh) 2018-04-10
CN104770073A (zh) 2015-07-08
EP2901829A4 (de) 2016-05-11
US20160360649A1 (en) 2016-12-08
WO2014052377A1 (en) 2014-04-03
US9918408B2 (en) 2018-03-13
EP2901829A1 (de) 2015-08-05
EP2901829B1 (de) 2019-12-18
US20140085821A1 (en) 2014-03-27
US9451726B2 (en) 2016-09-20

Similar Documents

Publication Publication Date Title
IN2015DN03088A (de)
WO2019060576A3 (en) Liquid submersion cooled electronic systems and devices
PH12016502202A1 (en) Integrated vapor chamber for thermal management of computing devices
IN2015DN03895A (de)
PH12014501742A1 (en) Ionic liquids for cooling in high temperature environment
EP3280233A4 (de) Kühlkörpersystem für serverrack mit einer kombination aus einer flüssigkeitskühlvorrichtung und hilfskühlkörpervorrichtung
MX2014001219A (es) Manejo de sodio para sistemas de dialisis.
MX2016003123A (es) Sistemas, aparatos y metodos de gestion termica de baterias.
WO2014013346A3 (en) Server memory cooling apparatus
CL2015002032A1 (es) Dispositivo de tratamiento de liquido
MY174963A (en) Devolatilization of thermally produced liquids
MX2015010058A (es) Estimacion de rutina.
IN2015KN00243A (de)
MX2015009705A (es) Aparato de refrigeracion.
WO2012158687A3 (en) Liquid cooling during testing
IN2013CH04361A (de)
SG11201501063XA (en) Power supply and voltage multiplication for submerged subsea systems based on cathodic protection system
AR092651A1 (es) Circuito electronico para medidor y metodo para obtener la viscosidad de un fluido a una temperatura de referencia
MX343162B (es) Aparato portátil de regulación de temperatura para medicamento.
GB201309470D0 (en) Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium
TW201612483A (en) Reversible liquid cooling device and reverse method thereof
GB2520444A (en) Firmware agent
AR096215A1 (es) Método para controlar una parte de una estación de bombeo
EP2990736A4 (de) Warmwasserzufuhrvorrichtung mit einer wärmepumpe und warmwasserspeichersystem mit der warmwasserzufuhrvorrichtung mit einer wärmepumpe
SE1400472A1 (sv) Subsea aluminium heat exchanger