IN2014DN05780A - - Google Patents
Info
- Publication number
- IN2014DN05780A IN2014DN05780A IN5780DEN2014A IN2014DN05780A IN 2014DN05780 A IN2014DN05780 A IN 2014DN05780A IN 5780DEN2014 A IN5780DEN2014 A IN 5780DEN2014A IN 2014DN05780 A IN2014DN05780 A IN 2014DN05780A
- Authority
- IN
- India
- Prior art keywords
- insulation film
- membrane
- wiring
- sensitive element
- heat sensitive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2098—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using light, e.g. UV photohardening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J2005/103—Absorbing heated plate or film and temperature detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J2005/206—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices on foils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2039—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat with means for controlling the fixing temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/00362—Apparatus for electrophotographic processes relating to the copy medium handling
- G03G2215/00535—Stable handling of copy medium
- G03G2215/00717—Detection of physical properties
- G03G2215/00772—Detection of physical properties of temperature influencing copy sheet handling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012019431A JP5892368B2 (ja) | 2012-02-01 | 2012-02-01 | 赤外線センサ |
PCT/JP2013/000467 WO2013114861A1 (ja) | 2012-02-01 | 2013-01-29 | 赤外線センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN05780A true IN2014DN05780A (enrdf_load_stackoverflow) | 2015-04-10 |
Family
ID=48904908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN5780DEN2014 IN2014DN05780A (enrdf_load_stackoverflow) | 2012-02-01 | 2013-01-29 |
Country Status (8)
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5488751B1 (ja) * | 2013-08-30 | 2014-05-14 | 富士ゼロックス株式会社 | 温度センサ、定着装置、および画像形成装置 |
JP6677925B2 (ja) * | 2016-01-29 | 2020-04-08 | 三菱マテリアル株式会社 | 赤外線センサ |
JP6860812B2 (ja) * | 2017-01-05 | 2021-04-21 | 三菱マテリアル株式会社 | 赤外線センサ |
EP3410083A4 (en) * | 2016-01-29 | 2019-09-04 | Mitsubishi Materials Corporation | INFRARED SENSOR |
CN106525270A (zh) * | 2016-11-22 | 2017-03-22 | 合肥舒实工贸有限公司 | 温度传感器 |
CN106556470A (zh) * | 2016-11-22 | 2017-04-05 | 合肥舒实工贸有限公司 | 温度传感器 |
JP6743737B2 (ja) * | 2017-03-24 | 2020-08-19 | 三菱マテリアル株式会社 | 赤外線センサ |
JP6743741B2 (ja) * | 2017-03-29 | 2020-08-19 | 三菱マテリアル株式会社 | 赤外線センサ |
JP7030420B2 (ja) * | 2017-04-10 | 2022-03-07 | 日本特殊陶業株式会社 | 保持装置 |
JP7131570B2 (ja) * | 2017-12-28 | 2022-09-06 | 株式会社村田製作所 | 光検出器 |
JP6726771B2 (ja) * | 2018-02-08 | 2020-07-22 | 株式会社芝浦電子 | 赤外線温度センサ |
US11243118B2 (en) | 2018-03-07 | 2022-02-08 | Tdk Corporation | Electromagnetic wave sensor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0763585A (ja) * | 1993-08-26 | 1995-03-10 | Hokuriku Electric Ind Co Ltd | 環境センサ |
JP3327668B2 (ja) * | 1994-03-24 | 2002-09-24 | 石塚電子株式会社 | 赤外線検出器 |
JP3494747B2 (ja) * | 1995-03-31 | 2004-02-09 | 石塚電子株式会社 | 薄膜温度センサ及びその製造方法 |
JPH08278192A (ja) * | 1995-04-07 | 1996-10-22 | Ishizuka Denshi Kk | 赤外線検出器 |
US5962854A (en) | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
JP2002071451A (ja) | 2000-08-29 | 2002-03-08 | Sharp Corp | 熱型赤外線検出素子及びそれを用いた赤外線撮像素子 |
JP4628540B2 (ja) | 2000-11-20 | 2011-02-09 | 石塚電子株式会社 | 赤外線温度センサ |
JP2003194630A (ja) * | 2001-12-27 | 2003-07-09 | Ishizuka Electronics Corp | 非接触温度センサおよび非接触温度センサ用検出回路 |
JP5079211B2 (ja) * | 2004-10-13 | 2012-11-21 | 浜松ホトニクス株式会社 | 赤外線検出装置及びその製造方法 |
JP4483521B2 (ja) | 2004-10-21 | 2010-06-16 | Tdk株式会社 | 非接触温度センサ |
JP2009180682A (ja) | 2008-01-31 | 2009-08-13 | Ritsumeikan | 赤外線センサ |
JP2011013213A (ja) * | 2009-06-02 | 2011-01-20 | Mitsubishi Materials Corp | 赤外線センサ |
JP5640529B2 (ja) * | 2009-10-17 | 2014-12-17 | 三菱マテリアル株式会社 | 赤外線センサ及びこれを備えた回路基板 |
JP5832007B2 (ja) * | 2009-12-25 | 2015-12-16 | 三菱マテリアル株式会社 | 赤外線センサ及びその製造方法 |
JP2011220939A (ja) * | 2010-04-13 | 2011-11-04 | Panasonic Electric Works Co Ltd | 赤外線センサの製造方法 |
-
2012
- 2012-02-01 JP JP2012019431A patent/JP5892368B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-29 IN IN5780DEN2014 patent/IN2014DN05780A/en unknown
- 2013-01-29 KR KR1020147021179A patent/KR101972196B1/ko not_active Expired - Fee Related
- 2013-01-29 EP EP13743471.8A patent/EP2811271B1/en active Active
- 2013-01-29 WO PCT/JP2013/000467 patent/WO2013114861A1/ja active Application Filing
- 2013-01-29 CN CN201380004514.8A patent/CN104011519B/zh not_active Expired - Fee Related
- 2013-01-29 US US14/375,065 patent/US9568371B2/en not_active Expired - Fee Related
- 2013-01-30 TW TW102103482A patent/TWI568997B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2811271B1 (en) | 2019-04-24 |
KR20140128973A (ko) | 2014-11-06 |
JP2013156235A (ja) | 2013-08-15 |
US9568371B2 (en) | 2017-02-14 |
WO2013114861A1 (ja) | 2013-08-08 |
US20140374596A1 (en) | 2014-12-25 |
TW201344166A (zh) | 2013-11-01 |
JP5892368B2 (ja) | 2016-03-23 |
CN104011519A (zh) | 2014-08-27 |
EP2811271A1 (en) | 2014-12-10 |
TWI568997B (zh) | 2017-02-01 |
KR101972196B1 (ko) | 2019-04-24 |
CN104011519B (zh) | 2016-03-23 |
EP2811271A4 (en) | 2015-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IN2014DN05780A (enrdf_load_stackoverflow) | ||
IN2012DN01529A (enrdf_load_stackoverflow) | ||
JP2012517012A5 (enrdf_load_stackoverflow) | ||
WO2015148005A3 (en) | Micro-pirani vacuum gauges | |
MX2018013837A (es) | Aparatos y métodos para detectar la temperatura a lo largo de un sondeo utilizando elementos semiconductores. | |
IN2015DN01724A (enrdf_load_stackoverflow) | ||
EP2339334A3 (en) | Thermal gas sensor | |
WO2018129439A3 (en) | Socket side thermal system | |
WO2014025953A3 (en) | Printed circuit board with integrated temperature sensing | |
MX2013012875A (es) | Cordon de corriente resistente al sobrecalentamiento y metodo. | |
WO2015010127A8 (en) | Methods of on-actuator temperature measurement | |
WO2014093888A3 (en) | Apparel having sensor system | |
JP2008076144A (ja) | 電子温度計 | |
JP2017101982A5 (enrdf_load_stackoverflow) | ||
JP2016523356A5 (enrdf_load_stackoverflow) | ||
ATE409336T1 (de) | Temperaturempfindliches branderkennungskabel mit analogleitung | |
EP2400283A3 (en) | Sensor temperatur sensing device | |
WO2012103356A3 (en) | Dual thermistor redundant temperature sensor | |
GB201218398D0 (en) | Pressure sensing device with stepped cavity to minimize thermal noise | |
CN104111269A (zh) | 一种用于高温大热流环境的热流传感器标定装置 | |
WO2014064026A3 (de) | Luftmassenmesser mit einem sensorelement | |
WO2014093304A3 (en) | Sensor with an embedded thermistor for precise local temperature measurement | |
EP2574891A3 (en) | Temperature sensor attachment facilitating thermal conductivity to a measurement point and insulation from a surrounding environment | |
CN116337278A (zh) | 温度传感器单元及体内温度计 | |
TR201203290U (tr) | Bir ısıtıcı elemanın ısı emisyonunun tespiti için tertibat. |