IN2014CN04616A - - Google Patents

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Publication number
IN2014CN04616A
IN2014CN04616A IN4616CHN2014A IN2014CN04616A IN 2014CN04616 A IN2014CN04616 A IN 2014CN04616A IN 4616CHN2014 A IN4616CHN2014 A IN 4616CHN2014A IN 2014CN04616 A IN2014CN04616 A IN 2014CN04616A
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Rainer Buschulte
Original Assignee
Highcon Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Highcon Systems Ltd filed Critical Highcon Systems Ltd
Publication of IN2014CN04616A publication Critical patent/IN2014CN04616A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/14—Cutting, e.g. perforating, punching, slitting or trimming
    • B31B50/144—Cutting, e.g. perforating, punching, slitting or trimming using tools mounted on belts or chains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/14—Cutting, e.g. perforating, punching, slitting or trimming
    • B31B50/20—Cutting sheets or blanks
IN4616CHN2014 2011-11-23 2014-06-19 IN2014CN04616A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161563120P 2011-11-23 2011-11-23
US201261596379P 2012-02-08 2012-02-08
PCT/IL2012/000377 WO2013076716A2 (en) 2011-11-23 2012-11-21 System and method for cardboard-handling

Publications (1)

Publication Number Publication Date
IN2014CN04616A true IN2014CN04616A (zh) 2015-09-18

Family

ID=48425798

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4616CHN2014 IN2014CN04616A (zh) 2011-11-23 2014-06-19

Country Status (6)

Country Link
US (2) US9346129B2 (zh)
EP (1) EP2782704A4 (zh)
JP (2) JP2015505733A (zh)
CN (2) CN104066542B (zh)
IN (1) IN2014CN04616A (zh)
WO (1) WO2013076716A2 (zh)

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EP2409808A1 (de) * 2010-07-22 2012-01-25 Bystronic Laser AG Laserbearbeitungsmaschine
EP2782704A4 (en) * 2011-11-23 2016-02-17 Highcon Systems Ltd SYSTEM AND METHOD FOR PROCESSING PAPER
US9492984B2 (en) 2012-05-02 2016-11-15 Highcon Systems Ltd. Systems and methods for treating and handling cardboard sheets
WO2013164810A1 (en) * 2012-05-02 2013-11-07 Highcon Systems Ltd Method and system for a dynamic multiple scanners system
AU2014268154B2 (en) * 2012-05-02 2017-01-19 Highcon Systems Ltd Systems and methods for treating and handling cardboard sheets
US10315376B2 (en) 2012-11-08 2019-06-11 The C.W. Zumbiel Company System and associated method for digital scoring of carton blanks
EP2883647B1 (de) 2013-12-12 2019-05-29 Bystronic Laser AG Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung
EP3081372A1 (de) * 2015-04-14 2016-10-19 Mayr-Melnhof Karton AG Vorrichtung und verfahren zum herstellen von faltschachteln
US10619307B2 (en) 2015-06-12 2020-04-14 The C.W. Zumbiel Company Support needles for laser cutting of paperboard
BE1023456B1 (nl) * 2016-03-09 2017-03-27 Fit Things Nv Snijinrichting en -methode
GB201609363D0 (en) * 2016-05-26 2016-07-13 Highcon Systems Ltd System for impressing a relief pattern on a substrate
IT201600113932A1 (it) 2016-11-11 2018-05-11 Winform Medical Eng S R L Manipolo applicatore perfezionato per trattamenti terapeutici e/o cosmetici
SE540604C2 (en) * 2016-12-01 2018-10-02 Stora Enso Oyj Method and arrangement for laser-based processing of fibrous material
EP3582959B1 (en) 2017-02-20 2023-10-25 Marcus, Etgar Digital systems and processes for cutting and creasing corrugated cardboards
CN108081312A (zh) * 2017-11-03 2018-05-29 上海工程技术大学 一种用于抓取小型零件的机器人机械手对中校准系统
WO2021084433A1 (en) * 2019-10-30 2021-05-06 Rota Laser Dies S.R.L. System for monitoring cutting devices in a packaging production lines
CN113459588A (zh) * 2021-07-21 2021-10-01 广西生态工程职业技术学院 一种食品包装纸箱生产用模切机
EP4183515A1 (en) * 2021-11-23 2023-05-24 Bystronic Laser AG Laser cutting machine
CN114029618B (zh) * 2022-01-10 2022-04-12 铭镭激光智能装备（河源）有限公司 一种用于新能源汽车的锂电池激光焊接设备及使用方法
KR102556535B1 (ko) * 2023-01-19 2023-07-18 (주)더담패키지 박스 제조시스템

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DE102007027987B3 (de) 2007-06-14 2008-10-30 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung zur Aufnahme von plattenförmigen Materialien für zumindest einen Trennvorgang
FI119602B (fi) * 2007-09-26 2009-01-15 Metso Paper Inc Menetelmä kuiturainakoneessa käytettävän teräshihnan korjaushitsaamiseksi
JP2011011226A (ja) 2009-07-01 2011-01-20 Amada Co Ltd 可撓式スキッドテーブル
EP2782704A4 (en) * 2011-11-23 2016-02-17 Highcon Systems Ltd SYSTEM AND METHOD FOR PROCESSING PAPER

Also Published As

Publication number Publication date
CN104066542A (zh) 2014-09-24
CN106079557B (zh) 2018-10-16
WO2013076716A3 (en) 2013-08-01
EP2782704A2 (en) 2014-10-01
JP6546218B2 (ja) 2019-07-17
WO2013076716A2 (en) 2013-05-30
US9346129B2 (en) 2016-05-24
US10427248B2 (en) 2019-10-01
EP2782704A4 (en) 2016-02-17
CN104066542B (zh) 2016-06-01
CN106079557A (zh) 2016-11-09
JP2015505733A (ja) 2015-02-26
JP2017214220A (ja) 2017-12-07
US20130126489A1 (en) 2013-05-23
US20160332261A1 (en) 2016-11-17

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