IL81551A0 - Rapid curing,thermally stable adhesive compositions - Google Patents

Rapid curing,thermally stable adhesive compositions

Info

Publication number
IL81551A0
IL81551A0 IL81551A IL8155187A IL81551A0 IL 81551 A0 IL81551 A0 IL 81551A0 IL 81551 A IL81551 A IL 81551A IL 8155187 A IL8155187 A IL 8155187A IL 81551 A0 IL81551 A0 IL 81551A0
Authority
IL
Israel
Prior art keywords
thermally stable
adhesive compositions
rapid curing
stable adhesive
curing
Prior art date
Application number
IL81551A
Other languages
English (en)
Original Assignee
Stauffer Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stauffer Chemical Co filed Critical Stauffer Chemical Co
Publication of IL81551A0 publication Critical patent/IL81551A0/xx

Links

Classifications

    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IL81551A 1986-04-14 1987-02-12 Rapid curing,thermally stable adhesive compositions IL81551A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/851,605 US4652398A (en) 1985-09-12 1986-04-14 Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker

Publications (1)

Publication Number Publication Date
IL81551A0 true IL81551A0 (en) 1987-09-16

Family

ID=25311189

Family Applications (1)

Application Number Title Priority Date Filing Date
IL81551A IL81551A0 (en) 1986-04-14 1987-02-12 Rapid curing,thermally stable adhesive compositions

Country Status (9)

Country Link
US (1) US4652398A (de)
EP (1) EP0244070A3 (de)
JP (1) JPS62243673A (de)
KR (1) KR870010147A (de)
CN (1) CN87102640A (de)
BR (1) BR8701756A (de)
CA (1) CA1286818C (de)
IL (1) IL81551A0 (de)
PH (1) PH24374A (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US4808676A (en) * 1986-10-11 1989-02-28 Nippon Telegraph And Telephone Corporation Polyetherimide/epoxyimide resin composition
US4874548A (en) * 1988-03-14 1989-10-17 Ameron, Inc. Conductive adhesive
US5099090A (en) * 1988-05-11 1992-03-24 Ariel Electronics, Inc. Circuit writer
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
EP0418313A4 (en) * 1988-05-11 1992-01-15 Ariel Electronics, Inc. Circuit writer
US5037689A (en) * 1989-02-17 1991-08-06 Basf Aktiengesellschaft Toughened thermosetting structural materials
EP0384704A3 (de) * 1989-02-21 1991-05-08 General Electric Company Material für Würfelbefestigung und Verfahren zur Befestigung eines Würfels
US5225023A (en) * 1989-02-21 1993-07-06 General Electric Company High density interconnect thermoplastic die attach material and solvent die attach processing
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5159034A (en) * 1989-09-01 1992-10-27 Isp Investments Inc. Polymerization process using tertiary-amylperoxy pivalate as the free radical initiator
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5258139A (en) * 1990-04-20 1993-11-02 Hitachi Chemical Company, Ltd. Epoxy resin and adhesive composition containing the same
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
EP0651602B1 (de) 1993-10-29 1999-04-07 Matsushita Electric Industrial Co., Ltd. Leitfähige Pastenzusammensetzung zum Füllen von Kontaktlöchern, Leiterplatte unter Anwendung dieser leifähigen Paste und Verfahren zur Herstellung
US5683627A (en) * 1995-03-15 1997-11-04 Tokuyama Corporation Curable electroconductive composition
JP5280597B2 (ja) * 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
US6482335B1 (en) 2001-05-16 2002-11-19 Conley Corporation Conductive adhesive and method
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
WO2004092244A2 (en) * 2003-04-16 2004-10-28 Huntsman Advanced Materials (Switzerland) Gmbh Accelerator systems for low-temperature curing of epoxy resin compositions
MY142246A (en) * 2003-06-10 2010-11-15 Hitachi Chemical Co Ltd Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
JP4839670B2 (ja) * 2005-04-28 2011-12-21 日立化成工業株式会社 接着フィルム、接着シート及び半導体装置
JP4942338B2 (ja) * 2005-12-14 2012-05-30 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及び金属ポリイミド複合体
US20070226995A1 (en) * 2006-03-30 2007-10-04 Gregory Alan Bone System and method for adhering large semiconductor applications to pcb
JP2010059387A (ja) * 2008-08-04 2010-03-18 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
CN102216394A (zh) * 2008-11-13 2011-10-12 东邦特耐克丝株式会社 热固性树脂组合物以及使用该热固性树脂组合物的预浸料坯
CN102925062A (zh) * 2011-08-12 2013-02-13 汉高股份有限公司 光学透明的双固化粘合剂
CN102417808A (zh) * 2011-09-29 2012-04-18 西北工业大学 一种耐高温胶粘剂及其制备方法
CN103160232A (zh) * 2013-03-31 2013-06-19 广东普赛特电子科技股份有限公司 一种含改性镁粉的灌封胶及其制备方法
KR102599915B1 (ko) * 2015-08-28 2023-11-08 가부시끼가이샤 레조낙 완충 시트용 조성물 및 완충 시트
CN105462514A (zh) * 2015-11-24 2016-04-06 苏州盖德精细材料有限公司 一种高性能聚酰亚胺改性环氧树脂导电胶及其制备方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
CN108219730A (zh) * 2018-01-16 2018-06-29 黑龙江省科学院石油化学研究院 一种导电胶粘剂的制备方法及其导电胶黏剂
CN113429890B (zh) * 2021-07-14 2023-06-02 嘉兴蓉阳电子科技有限公司 复合型固化剂、胶黏剂、导电胶及其制备方法、应用
CN116656292B (zh) * 2023-06-08 2025-08-12 清华大学 一种缓固型环氧胶泥组合物及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH615935A5 (de) * 1975-06-19 1980-02-29 Ciba Geigy Ag
CH621810A5 (de) * 1976-06-17 1981-02-27 Ciba Geigy Ag
JPS5341398A (en) * 1976-09-28 1978-04-14 Toshiba Corp Heat resistant resin composition
JPS53134087A (en) * 1977-04-28 1978-11-22 Toshiba Corp Heat-resistant resin composition
JPS54155297A (en) * 1978-05-30 1979-12-07 Toshiba Corp Resin composition
US4401777A (en) * 1981-10-20 1983-08-30 Mitsui Toatsu Chemicals, Inc. Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition
CH647249A5 (de) * 1981-12-23 1985-01-15 Ciba Geigy Ag Lagerstabile, waermehaertbare, einen polymerisationskatalysator enthaltende mischungen auf polyimidbasis.
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin

Also Published As

Publication number Publication date
BR8701756A (pt) 1988-01-12
EP0244070A3 (de) 1989-04-12
EP0244070A2 (de) 1987-11-04
CN87102640A (zh) 1987-11-04
JPS62243673A (ja) 1987-10-24
KR870010147A (ko) 1987-11-30
PH24374A (en) 1990-06-13
US4652398A (en) 1987-03-24
CA1286818C (en) 1991-07-23

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