IL261451B - All surface film metrology system - Google Patents
All surface film metrology systemInfo
- Publication number
- IL261451B IL261451B IL261451A IL26145118A IL261451B IL 261451 B IL261451 B IL 261451B IL 261451 A IL261451 A IL 261451A IL 26145118 A IL26145118 A IL 26145118A IL 261451 B IL261451 B IL 261451B
- Authority
- IL
- Israel
- Prior art keywords
- metrology system
- layered
- layered metrology
- metrology
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/27—Structural arrangements therefor
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Medical Informatics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Geometry (AREA)
- Biomedical Technology (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662314276P | 2016-03-28 | 2016-03-28 | |
| US15/255,605 US10563973B2 (en) | 2016-03-28 | 2016-09-02 | All surface film metrology system |
| PCT/US2017/024332 WO2017172627A1 (en) | 2016-03-28 | 2017-03-27 | All surface film metrology system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL261451A IL261451A (en) | 2018-12-31 |
| IL261451B true IL261451B (en) | 2022-03-01 |
Family
ID=59898812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL261451A IL261451B (en) | 2016-03-28 | 2018-08-29 | All surface film metrology system |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10563973B2 (enExample) |
| JP (1) | JP6774501B2 (enExample) |
| KR (1) | KR102177682B1 (enExample) |
| CN (1) | CN109155263B (enExample) |
| DE (1) | DE112017001576B4 (enExample) |
| IL (1) | IL261451B (enExample) |
| TW (1) | TWI734761B (enExample) |
| WO (1) | WO2017172627A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784719B (zh) * | 2016-08-26 | 2022-11-21 | 美商應用材料股份有限公司 | 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品 |
| CN108022849B (zh) * | 2017-11-30 | 2020-06-16 | 上海华力微电子有限公司 | 一种亮场缺陷检测设备自动优化光强条件的方法及系统 |
| US11164768B2 (en) | 2018-04-27 | 2021-11-02 | Kla Corporation | Process-induced displacement characterization during semiconductor production |
| TWI830864B (zh) * | 2019-02-07 | 2024-02-01 | 美商應用材料股份有限公司 | 使用色彩度量術進行的基板的厚度測量 |
| KR102810856B1 (ko) | 2019-09-02 | 2025-05-20 | 삼성전자주식회사 | 반도체 소자 제조 장치, 반도체 소자 검사 장치 및 반도체 소자 제조 방법 |
| US11221300B2 (en) | 2020-03-20 | 2022-01-11 | KLA Corp. | Determining metrology-like information for a specimen using an inspection tool |
| US11544838B2 (en) * | 2020-03-21 | 2023-01-03 | Kla Corporation | Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging |
| KR20230148849A (ko) | 2021-03-04 | 2023-10-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 이미지들의 프로세싱에 기초한 필름 불균일의 픽셀 및 영역 분류 |
| CN119555020A (zh) * | 2025-02-05 | 2025-03-04 | 四川省开璞环保包装制品有限公司 | 一种环保无纺布表面涂层检测方法及系统 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5333049A (en) * | 1991-12-06 | 1994-07-26 | Hughes Aircraft Company | Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation |
| US5293214A (en) | 1991-12-06 | 1994-03-08 | Hughes Aircraft Company | Apparatus and method for performing thin film layer thickness metrology by deforming a thin film layer into a reflective condenser |
| US6809809B2 (en) * | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| JP4202841B2 (ja) | 2003-06-30 | 2008-12-24 | 株式会社Ｓｕｍｃｏ | 表面研磨装置 |
| KR101295207B1 (ko) * | 2003-09-15 | 2013-08-09 | 지고 코포레이션 | 표면에 대한 간섭 측정의 분석 |
| TW200604491A (en) * | 2004-07-15 | 2006-02-01 | Zygo Corp | Transparent film measurements |
| JP4885212B2 (ja) * | 2005-05-19 | 2012-02-29 | ザイゴ コーポレーション | 薄膜構造についての情報に関する低コヒーレンス干渉計信号を解析するための方法およびシステム |
| WO2007092950A2 (en) | 2006-02-09 | 2007-08-16 | Kla-Tencor Technologies Corporation | Methods and systems for determining a characteristic of a wafer |
| US7463369B2 (en) * | 2006-03-29 | 2008-12-09 | Kla-Tencor Technologies Corp. | Systems and methods for measuring one or more characteristics of patterned features on a specimen |
| JP5030604B2 (ja) * | 2007-01-29 | 2012-09-19 | セイコーインスツル株式会社 | ウェハ外観検査装置 |
| US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
| US7782452B2 (en) | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| US8685596B2 (en) * | 2007-12-04 | 2014-04-01 | Sharp Laboratories Of America, Inc. | Semi-transparent film grayscale mask |
| TWI521625B (zh) * | 2010-07-30 | 2016-02-11 | 應用材料股份有限公司 | 使用光譜監測來偵測層級清除 |
| DE102011101416B4 (de) | 2011-05-13 | 2016-06-16 | MTU Aero Engines AG | Dickenmessung einer Beschichtung eines rotierenden Bauteils unter Berücksichtigung der Wärmeausdehnung |
| JP2012251816A (ja) | 2011-06-01 | 2012-12-20 | Toshiba Mitsubishi-Electric Industrial System Corp | 形状測定装置 |
| US8843875B2 (en) * | 2012-05-08 | 2014-09-23 | Kla-Tencor Corporation | Measurement model optimization based on parameter variations across a wafer |
| TWI597491B (zh) * | 2012-09-28 | 2017-09-01 | 魯道夫科技股份有限公司 | 光學系統、晶圓檢測系統以及光學檢測的方法 |
| JP6290637B2 (ja) | 2014-01-30 | 2018-03-07 | 浜松ホトニクス株式会社 | 膜厚計測方法及び膜厚計測装置 |
| US9658150B2 (en) | 2015-01-12 | 2017-05-23 | Kla-Tencor Corporation | System and method for semiconductor wafer inspection and metrology |
| US9747520B2 (en) | 2015-03-16 | 2017-08-29 | Kla-Tencor Corporation | Systems and methods for enhancing inspection sensitivity of an inspection tool |
-
2016
- 2016-09-02 US US15/255,605 patent/US10563973B2/en active Active
-
2017
- 2017-03-27 KR KR1020187030962A patent/KR102177682B1/ko active Active
- 2017-03-27 CN CN201780015931.0A patent/CN109155263B/zh active Active
- 2017-03-27 DE DE112017001576.6T patent/DE112017001576B4/de active Active
- 2017-03-27 JP JP2018550750A patent/JP6774501B2/ja active Active
- 2017-03-27 WO PCT/US2017/024332 patent/WO2017172627A1/en not_active Ceased
- 2017-03-28 TW TW106110247A patent/TWI734761B/zh active
-
2018
- 2018-08-29 IL IL261451A patent/IL261451B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6774501B2 (ja) | 2020-10-28 |
| WO2017172627A1 (en) | 2017-10-05 |
| DE112017001576B4 (de) | 2025-12-11 |
| WO2017172627A9 (en) | 2018-11-22 |
| TW201801216A (zh) | 2018-01-01 |
| KR20180121663A (ko) | 2018-11-07 |
| JP2019516239A (ja) | 2019-06-13 |
| CN109155263B (zh) | 2023-06-02 |
| CN109155263A (zh) | 2019-01-04 |
| TWI734761B (zh) | 2021-08-01 |
| DE112017001576T5 (de) | 2018-12-20 |
| US10563973B2 (en) | 2020-02-18 |
| IL261451A (en) | 2018-12-31 |
| US20170278236A1 (en) | 2017-09-28 |
| KR102177682B1 (ko) | 2020-11-11 |
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