IL236401B - Diode laser based broad band light sources for wafer inspection tools - Google Patents
Diode laser based broad band light sources for wafer inspection toolsInfo
- Publication number
- IL236401B IL236401B IL236401A IL23640114A IL236401B IL 236401 B IL236401 B IL 236401B IL 236401 A IL236401 A IL 236401A IL 23640114 A IL23640114 A IL 23640114A IL 236401 B IL236401 B IL 236401B
- Authority
- IL
- Israel
- Prior art keywords
- incident beam
- light sources
- laser diode
- broadband light
- different wavelength
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8845—Multiple wavelengths of illumination or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
- G01N2201/0612—Laser diodes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261664493P | 2012-06-26 | 2012-06-26 | |
| US13/924,216 US8896827B2 (en) | 2012-06-26 | 2013-06-21 | Diode laser based broad band light sources for wafer inspection tools |
| PCT/US2013/047901 WO2014004679A1 (en) | 2012-06-26 | 2013-06-26 | Diode laser based broad band light sources for wafer inspection tools |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL236401A0 IL236401A0 (en) | 2015-02-26 |
| IL236401B true IL236401B (en) | 2018-08-30 |
Family
ID=49774195
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL236401A IL236401B (en) | 2012-06-26 | 2014-12-23 | Diode laser based broad band light sources for wafer inspection tools |
| IL246806A IL246806B (en) | 2012-06-26 | 2016-07-17 | Diode laser based broad band light sources for wafer inspection tools |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL246806A IL246806B (en) | 2012-06-26 | 2016-07-17 | Diode laser based broad band light sources for wafer inspection tools |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8896827B2 (OSRAM) |
| JP (3) | JP6282643B2 (OSRAM) |
| KR (2) | KR102091987B1 (OSRAM) |
| IL (2) | IL236401B (OSRAM) |
| WO (1) | WO2014004679A1 (OSRAM) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
| US9128387B2 (en) * | 2013-05-14 | 2015-09-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ultraviolet light emitting diode array light source for photolithography and method |
| US9581554B2 (en) * | 2013-05-30 | 2017-02-28 | Seagate Technology Llc | Photon emitter array |
| US9558858B2 (en) * | 2013-08-14 | 2017-01-31 | Kla-Tencor Corporation | System and method for imaging a sample with a laser sustained plasma illumination output |
| US9709510B2 (en) | 2014-06-26 | 2017-07-18 | Kla-Tencor Corp. | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
| US9599573B2 (en) | 2014-12-02 | 2017-03-21 | Kla-Tencor Corporation | Inspection systems and techniques with enhanced detection |
| US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
| US10257918B2 (en) * | 2015-09-28 | 2019-04-09 | Kla-Tencor Corporation | System and method for laser-sustained plasma illumination |
| EP3276389A1 (en) * | 2016-07-27 | 2018-01-31 | Fundació Institut de Ciències Fotòniques | A common-path interferometric scattering imaging system and a method of using common-path interferometric scattering imaging to detect an object |
| CN106501959A (zh) * | 2016-10-26 | 2017-03-15 | 深圳奥比中光科技有限公司 | 一种面阵激光投影仪及其深度相机 |
| CN106568396A (zh) * | 2016-10-26 | 2017-04-19 | 深圳奥比中光科技有限公司 | 一种激光投影仪及其深度相机 |
| DE102017108873A1 (de) * | 2017-04-26 | 2018-10-31 | Carl Zeiss Microscopy Gmbh | Phasenkontrast-Bildgebung mit Übertragungsfunktion |
| CN108646167B (zh) * | 2018-04-27 | 2020-12-04 | 中科晶源微电子技术（北京）有限公司 | 用于半导体器件的激光辅助的电子束检测设备和方法 |
| CN109211803B (zh) * | 2018-09-17 | 2020-10-09 | 中国科学院生态环境研究中心 | 一种基于显微多光谱技术对微塑料进行快速识别的装置 |
| US11262591B2 (en) | 2018-11-09 | 2022-03-01 | Kla Corporation | System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution |
| CN111344559B (zh) * | 2018-12-26 | 2023-09-15 | 合刃科技（深圳）有限公司 | 缺陷检测方法及缺陷检测系统 |
| US11156846B2 (en) * | 2019-04-19 | 2021-10-26 | Kla Corporation | High-brightness illumination source for optical metrology |
| KR102170357B1 (ko) * | 2019-05-29 | 2020-10-27 | 재단법인대구경북과학기술원 | 비파괴 결함 검출방법 |
| KR20220030067A (ko) | 2020-09-02 | 2022-03-10 | 삼성전자주식회사 | 웨이퍼 검사 장치 및 이를 포함하는 시스템 |
| JP7807271B2 (ja) | 2022-03-22 | 2026-01-27 | 株式会社Ｓｃｒｅｅｎホールディングス | フォトマスク検査装置 |
| US20240069167A1 (en) * | 2022-08-23 | 2024-02-29 | Liturex (Guangzhou) Co. Ltd | Mirrorless solid state lidar |
| WO2025049716A2 (en) * | 2023-08-30 | 2025-03-06 | GS-HealthMatrix, LLC | Frustrated total internal reflection (ftir) surface topography and composition analysis systems, methods, and devices |
| US20250180484A1 (en) * | 2023-12-05 | 2025-06-05 | Orbotech Ltd. | Apparatus and method for fluorescence detection in electronic devices with high brightness coaxial diode laser illumination |
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| US5715270A (en) * | 1996-09-27 | 1998-02-03 | Mcdonnell Douglas Corporation | High efficiency, high power direct diode laser systems and methods therefor |
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| JP2008066032A (ja) * | 2006-09-05 | 2008-03-21 | Moritex Corp | 照明装置 |
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| DE102006059190B4 (de) * | 2006-12-15 | 2009-09-10 | Vistec Semiconductor Systems Gmbh | Vorrichtung zur Wafer-Inspektion |
| WO2008151266A2 (en) | 2007-06-05 | 2008-12-11 | Zygo Corporation | Interferometry for determining characteristics of an object surface, with spatially coherent illumination |
| JP4719284B2 (ja) | 2008-10-10 | 2011-07-06 | トヨタ自動車株式会社 | 表面検査装置 |
| SG164293A1 (en) | 2009-01-13 | 2010-09-29 | Semiconductor Technologies & Instruments Pte | System and method for inspecting a wafer |
| DE112011100812T5 (de) * | 2010-03-05 | 2013-03-07 | TeraDiode, Inc. | System und Verfahren zur Wellenlängenstrahlkombination |
| JP5832455B2 (ja) * | 2010-03-05 | 2015-12-16 | テラダイオード， インコーポレーテッド | 選択的再配置および回転波長ビーム結合システムならびに方法 |
| JP2012013632A (ja) * | 2010-07-05 | 2012-01-19 | Sumco Corp | 表面欠陥検査装置および表面欠陥検出方法 |
| US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
-
2013
- 2013-06-21 US US13/924,216 patent/US8896827B2/en active Active
- 2013-06-26 JP JP2015520466A patent/JP6282643B2/ja active Active
- 2013-06-26 KR KR1020197007979A patent/KR102091987B1/ko active Active
- 2013-06-26 KR KR1020157001970A patent/KR101961900B1/ko active Active
- 2013-06-26 WO PCT/US2013/047901 patent/WO2014004679A1/en not_active Ceased
-
2014
- 2014-10-23 US US14/521,977 patent/US9110037B2/en active Active
- 2014-12-23 IL IL236401A patent/IL236401B/en active IP Right Grant
-
2016
- 2016-07-17 IL IL246806A patent/IL246806B/en active IP Right Grant
-
2018
- 2018-01-24 JP JP2018009830A patent/JP2018119963A/ja active Pending
-
2019
- 2019-11-28 JP JP2019215516A patent/JP6932174B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102091987B1 (ko) | 2020-03-20 |
| US20130342825A1 (en) | 2013-12-26 |
| US9110037B2 (en) | 2015-08-18 |
| IL246806A0 (en) | 2016-08-31 |
| JP6282643B2 (ja) | 2018-02-21 |
| JP2015524556A (ja) | 2015-08-24 |
| JP2020064063A (ja) | 2020-04-23 |
| IL246806B (en) | 2019-08-29 |
| US8896827B2 (en) | 2014-11-25 |
| KR20190032643A (ko) | 2019-03-27 |
| JP2018119963A (ja) | 2018-08-02 |
| KR20150021586A (ko) | 2015-03-02 |
| JP6932174B2 (ja) | 2021-09-08 |
| KR101961900B1 (ko) | 2019-03-26 |
| US20150042979A1 (en) | 2015-02-12 |
| WO2014004679A1 (en) | 2014-01-03 |
| IL236401A0 (en) | 2015-02-26 |
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| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |