IL221519A - Method and system for determining coverage error - Google Patents

Method and system for determining coverage error

Info

Publication number
IL221519A
IL221519A IL221519A IL22151912A IL221519A IL 221519 A IL221519 A IL 221519A IL 221519 A IL221519 A IL 221519A IL 22151912 A IL22151912 A IL 22151912A IL 221519 A IL221519 A IL 221519A
Authority
IL
Israel
Prior art keywords
determining
overlay error
overlay
error
Prior art date
Application number
IL221519A
Other languages
English (en)
Hebrew (he)
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL221519A publication Critical patent/IL221519A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H01L2223/5446—Located in scribe lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
IL221519A 2011-08-30 2012-08-16 Method and system for determining coverage error IL221519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161528941P 2011-08-30 2011-08-30

Publications (1)

Publication Number Publication Date
IL221519A true IL221519A (en) 2015-10-29

Family

ID=47744864

Family Applications (1)

Application Number Title Priority Date Filing Date
IL221519A IL221519A (en) 2011-08-30 2012-08-16 Method and system for determining coverage error

Country Status (7)

Country Link
US (1) US9704810B2 (zh)
JP (1) JP5389235B2 (zh)
KR (1) KR101457030B1 (zh)
CN (1) CN102967997B (zh)
IL (1) IL221519A (zh)
NL (1) NL2009294A (zh)
TW (1) TWI470375B (zh)

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KR101882892B1 (ko) 2013-12-05 2018-07-27 에이에스엠엘 네델란즈 비.브이. 기판 상의 구조체를 측정하는 방법 및 장치, 오차 보정을 위한 모델, 이러한 방법 및 장치를 구현하기 위한 컴퓨터 프로그램 제품
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KR102237698B1 (ko) * 2014-04-15 2021-04-08 삼성전자주식회사 오버레이 마크의 비대칭부 검출 방법 및 이를 포함하는 오버레이 계측 방법
CN107077079B (zh) * 2014-09-01 2018-12-14 Asml荷兰有限公司 测量目标结构的属性的方法、检查设备、光刻系统和器件制造方法
KR102548650B1 (ko) 2014-10-03 2023-06-27 케이엘에이 코포레이션 검증 계측 타겟 및 그 설계
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
CN107078074B (zh) * 2014-11-25 2021-05-25 科磊股份有限公司 分析及利用景观
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
IL290735B2 (en) * 2014-11-26 2023-03-01 Asml Netherlands Bv Metrological method, computer product and system
US10437157B2 (en) 2014-12-09 2019-10-08 Asml Netherlands B.V. Method and apparatus for image analysis
WO2016091536A1 (en) * 2014-12-09 2016-06-16 Asml Netherlands B.V. Method and apparatus for image analysis
JP6524256B2 (ja) * 2015-04-21 2019-06-05 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジ方法及び装置、コンピュータプログラム、並びにリソグラフィシステム
JP6630369B2 (ja) * 2015-06-17 2020-01-15 エーエスエムエル ネザーランズ ビー．ブイ． 相互レシピ整合性に基づくレシピ選択
JP6782769B2 (ja) * 2015-09-28 2020-11-11 エーエスエムエル ネザーランズ ビー．ブイ． ２次元又は３次元の形状の階層的表現
NL2017739A (en) 2015-11-27 2017-06-07 Asml Netherlands Bv Metrology target, method and apparatus, computer program and lithographic system
US11016397B2 (en) 2015-12-17 2021-05-25 Asml Netherlands B.V. Source separation from metrology data
WO2017146785A1 (en) * 2016-02-25 2017-08-31 Kla-Tencor Corporation Analyzing root causes of process variation in scatterometry metrology
JP6678253B2 (ja) * 2016-06-03 2020-04-08 エーエスエムエル ホールディング エヌ．ブイ． アライメントシステムウェーハスタックビーム分析器
KR102207155B1 (ko) 2016-07-19 2021-01-25 어플라이드 머티어리얼스, 인코포레이티드 구분적 정렬 모델링 방법
JP6880184B2 (ja) 2016-11-10 2021-06-02 エーエスエムエル ネザーランズ ビー．ブイ． スタック差を使用した設計及び補正
KR102432667B1 (ko) * 2017-05-15 2022-08-17 삼성전자주식회사 오버레이 보정방법 및 제어 시스템
US11029673B2 (en) 2017-06-13 2021-06-08 Pdf Solutions, Inc. Generating robust machine learning predictions for semiconductor manufacturing processes
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TW201923332A (zh) 2017-10-10 2019-06-16 荷蘭商Ａｓｍｌ荷蘭公司 度量衡方法和設備、電腦程式及微影系統
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CN111033382B (zh) * 2017-10-22 2021-12-14 科磊股份有限公司 在成像叠加计量中利用叠加错位误差估计
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JP7227988B2 (ja) 2018-02-27 2023-02-22 エーエスエムエル ネザーランズ ビー．ブイ． 基板上の１つ又は複数の構造の特性を算出するメトロロジ装置及び方法
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US11029359B2 (en) 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US10777470B2 (en) 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
US10557802B2 (en) * 2018-05-09 2020-02-11 Kla-Tencor Corporation Capture of repeater defects on a semiconductor wafer
WO2019236084A1 (en) * 2018-06-07 2019-12-12 Kla-Tencor Corporation Overlay measurement using phase and amplitude modeling
KR102655300B1 (ko) * 2023-08-11 2024-04-05 (주)오로스 테크놀로지 오버레이 계측 장치의 보정 방법 및 오버레이 계측 장치의 보정 시스템

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Also Published As

Publication number Publication date
KR20130024839A (ko) 2013-03-08
CN102967997A (zh) 2013-03-13
TW201312294A (zh) 2013-03-16
KR101457030B1 (ko) 2014-10-31
TWI470375B (zh) 2015-01-21
JP2013051412A (ja) 2013-03-14
CN102967997B (zh) 2015-01-07
US20130054186A1 (en) 2013-02-28
JP5389235B2 (ja) 2014-01-15
US9704810B2 (en) 2017-07-11
NL2009294A (en) 2013-03-04

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