IL216974A0 - Optical defect amplification for improved sensitivity on patterned layes - Google Patents

Optical defect amplification for improved sensitivity on patterned layes

Info

Publication number
IL216974A0
IL216974A0 IL216974A IL21697411A IL216974A0 IL 216974 A0 IL216974 A0 IL 216974A0 IL 216974 A IL216974 A IL 216974A IL 21697411 A IL21697411 A IL 21697411A IL 216974 A0 IL216974 A0 IL 216974A0
Authority
IL
Israel
Prior art keywords
layes
patterned
improved sensitivity
optical defect
amplification
Prior art date
Application number
IL216974A
Other languages
English (en)
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL216974A0 publication Critical patent/IL216974A0/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL216974A 2009-07-16 2011-12-14 Optical defect amplification for improved sensitivity on patterned layes IL216974A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22626009P 2009-07-16 2009-07-16
PCT/US2010/042148 WO2011008964A1 (en) 2009-07-16 2010-07-15 Optical defect amplification for improved sensitivity on patterned layers

Publications (1)

Publication Number Publication Date
IL216974A0 true IL216974A0 (en) 2012-02-29

Family

ID=43449792

Family Applications (1)

Application Number Title Priority Date Filing Date
IL216974A IL216974A0 (en) 2009-07-16 2011-12-14 Optical defect amplification for improved sensitivity on patterned layes

Country Status (5)

Country Link
US (1) US8705027B2 (enExample)
JP (1) JP2012533737A (enExample)
KR (1) KR101765348B1 (enExample)
IL (1) IL216974A0 (enExample)
WO (1) WO2011008964A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10317347B2 (en) 2013-11-01 2019-06-11 Kla-Tencor Corp. Determining information for defects on wafers
US9599573B2 (en) 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
WO2016103286A1 (en) * 2014-12-24 2016-06-30 Datalogic Ip Tech S.R.L. System and method for identifying the presence or absence of transparent pills in blister packer machines using high resolution 3d stereo reconstruction based on color linear cameras
US9870612B2 (en) * 2016-06-06 2018-01-16 Taiwan Semiconductor Manufacturing Co., Ltd. Method for repairing a mask
US10249546B2 (en) * 2016-07-20 2019-04-02 Kla-Tencor Corporation Reverse decoration for defect detection amplification
TWI728197B (zh) 2016-10-24 2021-05-21 美商克萊譚克公司 整合至一計量及/或檢測工具中之製程模組
US10795270B2 (en) * 2017-08-25 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of defect inspection
US10615067B2 (en) * 2018-05-18 2020-04-07 Kla-Tencor Corporation Phase filter for enhanced defect detection in multilayer structure
US11092893B2 (en) 2018-12-10 2021-08-17 Kla Corporation Inspection sensitivity improvements for optical and electron beam inspection
TWI753739B (zh) * 2021-01-08 2022-01-21 閎康科技股份有限公司 物性分析方法、物性分析試片及其製備方法
US12066763B2 (en) * 2021-02-04 2024-08-20 Kla Corporation Sensitivity improvement of optical and SEM defection inspection

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834345A (ja) * 1981-08-25 1983-02-28 Fujitsu Ltd レジスト膜パタ−ンの検査方法
JPS61161796A (ja) * 1985-01-10 1986-07-22 富士通株式会社 プリント基板の導体パタ−ンの表面処理方法
JPH02190705A (ja) * 1989-01-20 1990-07-26 Hitachi Ltd 外観検査方法
DE4310025A1 (de) * 1993-03-27 1994-09-29 Boehringer Mannheim Gmbh Vorrichtung zur lateral aufgelösten Untersuchung einer lateral heterogenen ultradünnen Objektschicht
JPH09115973A (ja) * 1995-10-16 1997-05-02 Nec Corp 異物検査方法
JPH1012681A (ja) * 1996-06-21 1998-01-16 Fujitsu Ltd 層間の空隙の検出方法
EP0973069A3 (en) * 1998-07-14 2006-10-04 Nova Measuring Instruments Limited Monitoring apparatus and method particularly useful in photolithographically processing substrates
AU5597000A (en) * 1999-06-07 2000-12-28 Regents Of The University Of California, The Coatings on reflective mask substrates
JP3729156B2 (ja) * 2002-06-07 2005-12-21 株式会社日立製作所 パターン欠陥検出方法およびその装置
US7969564B2 (en) 2002-10-03 2011-06-28 Applied Materials Israel, Ltd. System and method for defect localization on electrical test structures
DE10301931A1 (de) * 2003-01-19 2004-07-29 Massen, Robert, Prof. Dr.-Ing. Automatische optische Oberflächeninspektion von farbig gemusterten Oberflächen, welche mit einer transparenten Schutzschicht versehen sind
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
JP4496164B2 (ja) * 2005-12-21 2010-07-07 株式会社神戸製鋼所 熱弾性特性測定装置、熱弾性特性測定方法
US7791055B2 (en) 2006-07-10 2010-09-07 Micron Technology, Inc. Electron induced chemical etching/deposition for enhanced detection of surface defects
JP2008082999A (ja) * 2006-09-29 2008-04-10 Hitachi Ltd 基板表面の欠陥検査方法及び欠陥検査装置
US20080311283A1 (en) * 2007-06-15 2008-12-18 Qimonda Ag Method of Inspecting and Manufacturing an Integrated Circuit
DE102007028800B4 (de) * 2007-06-22 2016-11-03 Advanced Mask Technology Center Gmbh & Co. Kg Maskensubstrat, Photomaske und Verfahren zur Herstellung einer Photomaske

Also Published As

Publication number Publication date
US8705027B2 (en) 2014-04-22
JP2012533737A (ja) 2012-12-27
KR101765348B1 (ko) 2017-08-08
WO2011008964A1 (en) 2011-01-20
KR20120037010A (ko) 2012-04-18
US20120113416A1 (en) 2012-05-10

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