KR101765348B1 - 패턴화된 층들에 대한 향상된 민감도를 위한 광학적 결함 증폭 - Google Patents

패턴화된 층들에 대한 향상된 민감도를 위한 광학적 결함 증폭 Download PDF

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KR101765348B1
KR101765348B1 KR1020127004026A KR20127004026A KR101765348B1 KR 101765348 B1 KR101765348 B1 KR 101765348B1 KR 1020127004026 A KR1020127004026 A KR 1020127004026A KR 20127004026 A KR20127004026 A KR 20127004026A KR 101765348 B1 KR101765348 B1 KR 101765348B1
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inspection
layer
target
test
layers
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KR20120037010A (ko
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스티븐 알 랑게
스테판 두란트
그레고리 커크
로버트 엠 다넨
프라샨트 아지
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케이엘에이-텐코 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020127004026A 2009-07-16 2010-07-15 패턴화된 층들에 대한 향상된 민감도를 위한 광학적 결함 증폭 Active KR101765348B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22626009P 2009-07-16 2009-07-16
US61/226,260 2009-07-16
PCT/US2010/042148 WO2011008964A1 (en) 2009-07-16 2010-07-15 Optical defect amplification for improved sensitivity on patterned layers

Publications (2)

Publication Number Publication Date
KR20120037010A KR20120037010A (ko) 2012-04-18
KR101765348B1 true KR101765348B1 (ko) 2017-08-08

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KR1020127004026A Active KR101765348B1 (ko) 2009-07-16 2010-07-15 패턴화된 층들에 대한 향상된 민감도를 위한 광학적 결함 증폭

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US (1) US8705027B2 (enExample)
JP (1) JP2012533737A (enExample)
KR (1) KR101765348B1 (enExample)
IL (1) IL216974A0 (enExample)
WO (1) WO2011008964A1 (enExample)

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US10317347B2 (en) 2013-11-01 2019-06-11 Kla-Tencor Corp. Determining information for defects on wafers
US9599573B2 (en) 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
WO2016103286A1 (en) * 2014-12-24 2016-06-30 Datalogic Ip Tech S.R.L. System and method for identifying the presence or absence of transparent pills in blister packer machines using high resolution 3d stereo reconstruction based on color linear cameras
US9870612B2 (en) * 2016-06-06 2018-01-16 Taiwan Semiconductor Manufacturing Co., Ltd. Method for repairing a mask
US10249546B2 (en) * 2016-07-20 2019-04-02 Kla-Tencor Corporation Reverse decoration for defect detection amplification
TWI728197B (zh) 2016-10-24 2021-05-21 美商克萊譚克公司 整合至一計量及/或檢測工具中之製程模組
US10795270B2 (en) * 2017-08-25 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of defect inspection
US10615067B2 (en) * 2018-05-18 2020-04-07 Kla-Tencor Corporation Phase filter for enhanced defect detection in multilayer structure
US11092893B2 (en) 2018-12-10 2021-08-17 Kla Corporation Inspection sensitivity improvements for optical and electron beam inspection
TWI753739B (zh) * 2021-01-08 2022-01-21 閎康科技股份有限公司 物性分析方法、物性分析試片及其製備方法
US12066763B2 (en) * 2021-02-04 2024-08-20 Kla Corporation Sensitivity improvement of optical and SEM defection inspection

Citations (2)

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JP2008082999A (ja) * 2006-09-29 2008-04-10 Hitachi Ltd 基板表面の欠陥検査方法及び欠陥検査装置
US20080311283A1 (en) * 2007-06-15 2008-12-18 Qimonda Ag Method of Inspecting and Manufacturing an Integrated Circuit

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JPS5834345A (ja) * 1981-08-25 1983-02-28 Fujitsu Ltd レジスト膜パタ−ンの検査方法
JPS61161796A (ja) * 1985-01-10 1986-07-22 富士通株式会社 プリント基板の導体パタ−ンの表面処理方法
JPH02190705A (ja) * 1989-01-20 1990-07-26 Hitachi Ltd 外観検査方法
DE4310025A1 (de) * 1993-03-27 1994-09-29 Boehringer Mannheim Gmbh Vorrichtung zur lateral aufgelösten Untersuchung einer lateral heterogenen ultradünnen Objektschicht
JPH09115973A (ja) * 1995-10-16 1997-05-02 Nec Corp 異物検査方法
JPH1012681A (ja) * 1996-06-21 1998-01-16 Fujitsu Ltd 層間の空隙の検出方法
EP0973069A3 (en) * 1998-07-14 2006-10-04 Nova Measuring Instruments Limited Monitoring apparatus and method particularly useful in photolithographically processing substrates
AU5597000A (en) * 1999-06-07 2000-12-28 Regents Of The University Of California, The Coatings on reflective mask substrates
JP3729156B2 (ja) * 2002-06-07 2005-12-21 株式会社日立製作所 パターン欠陥検出方法およびその装置
US7969564B2 (en) 2002-10-03 2011-06-28 Applied Materials Israel, Ltd. System and method for defect localization on electrical test structures
DE10301931A1 (de) * 2003-01-19 2004-07-29 Massen, Robert, Prof. Dr.-Ing. Automatische optische Oberflächeninspektion von farbig gemusterten Oberflächen, welche mit einer transparenten Schutzschicht versehen sind
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
JP4496164B2 (ja) * 2005-12-21 2010-07-07 株式会社神戸製鋼所 熱弾性特性測定装置、熱弾性特性測定方法
US7791055B2 (en) 2006-07-10 2010-09-07 Micron Technology, Inc. Electron induced chemical etching/deposition for enhanced detection of surface defects
DE102007028800B4 (de) * 2007-06-22 2016-11-03 Advanced Mask Technology Center Gmbh & Co. Kg Maskensubstrat, Photomaske und Verfahren zur Herstellung einer Photomaske

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082999A (ja) * 2006-09-29 2008-04-10 Hitachi Ltd 基板表面の欠陥検査方法及び欠陥検査装置
US20080311283A1 (en) * 2007-06-15 2008-12-18 Qimonda Ag Method of Inspecting and Manufacturing an Integrated Circuit

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Publication number Publication date
US8705027B2 (en) 2014-04-22
JP2012533737A (ja) 2012-12-27
WO2011008964A1 (en) 2011-01-20
KR20120037010A (ko) 2012-04-18
US20120113416A1 (en) 2012-05-10
IL216974A0 (en) 2012-02-29

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