IL179192A0 - Electrochemical -mechanical polishing composition and method for using the same - Google Patents

Electrochemical -mechanical polishing composition and method for using the same

Info

Publication number
IL179192A0
IL179192A0 IL179192A IL17919206A IL179192A0 IL 179192 A0 IL179192 A0 IL 179192A0 IL 179192 A IL179192 A IL 179192A IL 17919206 A IL17919206 A IL 17919206A IL 179192 A0 IL179192 A0 IL 179192A0
Authority
IL
Israel
Prior art keywords
electrochemical
same
mechanical polishing
polishing composition
composition
Prior art date
Application number
IL179192A
Other languages
English (en)
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of IL179192A0 publication Critical patent/IL179192A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/20—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
    • H10P52/203—Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IL179192A 2004-05-28 2006-11-12 Electrochemical -mechanical polishing composition and method for using the same IL179192A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/857,432 US20050263407A1 (en) 2004-05-28 2004-05-28 Electrochemical-mechanical polishing composition and method for using the same
PCT/US2005/017579 WO2005118736A1 (en) 2004-05-28 2005-05-19 Electrochemical-mechanical polishing composition and method for using the same

Publications (1)

Publication Number Publication Date
IL179192A0 true IL179192A0 (en) 2007-03-08

Family

ID=34973029

Family Applications (1)

Application Number Title Priority Date Filing Date
IL179192A IL179192A0 (en) 2004-05-28 2006-11-12 Electrochemical -mechanical polishing composition and method for using the same

Country Status (6)

Country Link
US (1) US20050263407A1 (https=)
JP (1) JP2008501240A (https=)
CN (1) CN1961055B (https=)
IL (1) IL179192A0 (https=)
TW (1) TWI316083B (https=)
WO (1) WO2005118736A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080105651A1 (en) * 2004-09-14 2008-05-08 Katsumi Mabuchi Polishing Slurry for Cmp
US7504044B2 (en) 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7531105B2 (en) * 2004-11-05 2009-05-12 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US20060137995A1 (en) * 2004-12-29 2006-06-29 Sukanta Ghosh Method for removal of metal from a workpiece
US20060163083A1 (en) * 2005-01-21 2006-07-27 International Business Machines Corporation Method and composition for electro-chemical-mechanical polishing
KR101332302B1 (ko) * 2005-06-06 2013-11-25 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 단일 플래튼 처리를 위한 방법 및 일체형 화학적 기계적연마 조성물
US7879255B2 (en) * 2005-11-04 2011-02-01 Applied Materials, Inc. Method and composition for electrochemically polishing a conductive material on a substrate
JP4954558B2 (ja) * 2006-01-31 2012-06-20 富士フイルム株式会社 金属用研磨液、及びそれを用いた化学的機械的研磨方法
US7732393B2 (en) * 2006-03-20 2010-06-08 Cabot Microelectronics Corporation Oxidation-stabilized CMP compositions and methods
US8137580B2 (en) * 2006-12-29 2012-03-20 Lg Chem, Ltd. CMP slurry composition for forming metal wiring line
JP5616273B2 (ja) 2011-03-31 2014-10-29 富士フイルム株式会社 有機半導体ポリマー、有機半導体材料用組成物および光電池
TW201305291A (zh) * 2011-07-28 2013-02-01 Anji Microelectronics Co Ltd 化學機械拋光液
CN102337580A (zh) * 2011-09-21 2012-02-01 合肥金盟工贸有限公司 一种用于电化学抛光镁合金的离子液体抛光液及其制备方法
KR20140000496A (ko) * 2012-06-22 2014-01-03 에스케이하이닉스 주식회사 연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법
CN102977153B (zh) * 2012-11-21 2016-04-20 宁波大学 L-酒石酸2,2-二吡啶胺钴铁电功能材料及制备方法
CN103012495B (zh) * 2012-11-21 2016-04-20 宁波大学 D-酒石酸2,2-二吡啶胺钴铁电功能材料及制备方法
US9732430B2 (en) * 2013-10-24 2017-08-15 Baker Hughes Incorporated Chemical inhibition of pitting corrosion in methanolic solutions containing an organic halide
TWI583756B (zh) * 2016-01-12 2017-05-21 常州時創能源科技有限公司 結晶矽酸性拋光液的添加劑及其應用
EP3584298B1 (en) * 2017-02-17 2022-12-28 Fujimi Incorporated Polishing method using a polishing composition
US11043151B2 (en) * 2017-10-03 2021-06-22 Cmc Materials, Inc. Surface treated abrasive particles for tungsten buff applications
JP7035773B2 (ja) * 2018-04-27 2022-03-15 三菱ケミカル株式会社 研磨組成物
CN110172031B (zh) * 2019-05-23 2021-03-16 北京师范大学 一种阴离子型n-取代苯胺离子液体及其制备方法
TWI769619B (zh) * 2020-01-07 2022-07-01 美商Ｃｍｃ材料股份有限公司 經衍生的聚胺基酸
KR102608626B1 (ko) * 2020-11-30 2023-12-04 한국과학기술연구원 Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지
CN115287739B (zh) * 2022-08-11 2025-07-29 临沂市兴冠精细化工有限公司 一种金属表面清洗剂的制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1049259C (zh) * 1994-12-29 2000-02-09 华中理工大学 铝及铝合金焊丝的电化学抛光方法
EP0786504A3 (en) * 1996-01-29 1998-05-20 Fujimi Incorporated Polishing composition
DE69734868T2 (de) * 1996-07-25 2006-08-03 Dupont Air Products Nanomaterials L.L.C., Tempe Zusammensetzung und verfahren zum chemisch-mechanischen polieren
JPH10166258A (ja) * 1996-12-06 1998-06-23 Tadahiro Omi 研磨剤組成物
US6348076B1 (en) * 1999-10-08 2002-02-19 International Business Machines Corporation Slurry for mechanical polishing (CMP) of metals and use thereof
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) * 2001-04-10 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US6592742B2 (en) * 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US7029373B2 (en) * 2001-08-14 2006-04-18 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
JP3813865B2 (ja) * 2001-12-11 2006-08-23 株式会社荏原製作所 研磨方法及び研磨装置
CN1646649A (zh) * 2002-02-26 2005-07-27 应用材料股份有限公司 研磨基材的方法及组合物
JP2003311540A (ja) * 2002-04-30 2003-11-05 Sony Corp 電解研磨液、電解研磨方法及び半導体装置の製造方法
US20030224184A1 (en) * 2002-05-07 2003-12-04 Hermes Ann Robertson Method of producing wear resistant traffic markings

Also Published As

Publication number Publication date
TWI316083B (en) 2009-10-21
WO2005118736A1 (en) 2005-12-15
JP2008501240A (ja) 2008-01-17
US20050263407A1 (en) 2005-12-01
CN1961055A (zh) 2007-05-09
CN1961055B (zh) 2010-05-12
TW200611965A (en) 2006-04-16

Similar Documents

Publication Publication Date Title
TWI316083B (en) Electrochemical-mechanical polishing composition and method for using the same
GB0505446D0 (en) Polishing composition and polishing method
SG115831A1 (en) Polishing composition and polishing method
GB2412919B (en) Polishing composition and polishing method
GB2412917B (en) Polishing composition
TWI349690B (en) Polishing slurry composition and method of using the same
GB2419134B (en) Polishing composition and polishing method using the same
EP1800797A4 (en) APPARATUS AND METHOD FOR POLISHING
GB2417034B (en) Polishing composition
IL182537A0 (en) Metal ion-containing cmp composition and method for using the same
SG131099A1 (en) Polishing method, polishing composition and polishing composition kit
GB2439470B (en) Nail polishing tool and method
GB0428214D0 (en) Polishing composition and polishing method
GB0400248D0 (en) Polishing composition
GB2420122B (en) Polishing composition and polishing method using the same
GB0619096D0 (en) Polishing composition and polishing method
GB2421244B (en) Polishing composition
SG115786A1 (en) Polishing composition and polishing method
GB0428054D0 (en) Polishing composition and polishing method
GB2415199B (en) Polishing composition
PL1685926T3 (pl) Sposób szlifowania
GB0410214D0 (en) Polishing composition
GB0407024D0 (en) Polishing composition
SG131098A1 (en) Polishing composition and polishing method
GB0521905D0 (en) Polishing composition