IL160779A0 - Method for trimming resistors - Google Patents

Method for trimming resistors

Info

Publication number
IL160779A0
IL160779A0 IL16077902A IL16077902A IL160779A0 IL 160779 A0 IL160779 A0 IL 160779A0 IL 16077902 A IL16077902 A IL 16077902A IL 16077902 A IL16077902 A IL 16077902A IL 160779 A0 IL160779 A0 IL 160779A0
Authority
IL
Israel
Prior art keywords
circuit
trimming
functional resistor
platform
micro
Prior art date
Application number
IL16077902A
Other languages
English (en)
Original Assignee
Microbridge Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microbridge Technologies Inc filed Critical Microbridge Technologies Inc
Publication of IL160779A0 publication Critical patent/IL160779A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/232—Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
    • H01C17/265—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing
    • H01C17/267—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing by passage of voltage pulses or electric current
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/47—Resistors having no potential barriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Resistance Heating (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
IL16077902A 2001-09-10 2002-09-10 Method for trimming resistors IL160779A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31796901P 2001-09-10 2001-09-10
PCT/CA2002/001366 WO2003023794A2 (en) 2001-09-10 2002-09-10 Method for trimming resistors

Publications (1)

Publication Number Publication Date
IL160779A0 true IL160779A0 (en) 2004-08-31

Family

ID=23236051

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16077902A IL160779A0 (en) 2001-09-10 2002-09-10 Method for trimming resistors

Country Status (11)

Country Link
US (4) US7249409B2 (de)
EP (1) EP1444705B1 (de)
JP (1) JP4268520B2 (de)
KR (1) KR20050026904A (de)
CN (1) CN1620704A (de)
AT (1) ATE371936T1 (de)
AU (1) AU2002325723A1 (de)
CA (1) CA2459902A1 (de)
DE (1) DE60222162T2 (de)
IL (1) IL160779A0 (de)
WO (1) WO2003023794A2 (de)

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AU2003209900A1 (en) * 2003-03-19 2004-10-11 Microbridge Technologies Inc. Method for measurement of temperature coefficients of electric circuit components
DE602004028225D1 (de) * 2003-03-20 2010-09-02 Microbridge Technologies Inc Verfahren zum thermischen abgleichen eines elektrischen widerstandes in zwei richtungen
US20040251988A1 (en) * 2003-06-16 2004-12-16 Manish Sharma Adjustable phase change material resistor
US7555829B2 (en) 2003-07-14 2009-07-07 Microbridge Technologies Inc. Method for adjusting an output parameter of a circuit
US6940133B1 (en) * 2004-04-05 2005-09-06 National Semiconductor Corporation Integrated trim structure utilizing dynamic doping
US20080190656A1 (en) * 2004-05-06 2008-08-14 Microbridge Technologies Inc. Trimming Of Embedded Passive Components Using Pulsed Heating
WO2006032142A1 (en) * 2004-09-21 2006-03-30 Microbridge Technologies Inc. Compensating for trimming-induced shift of temperature coefficient of resistance
US7714694B2 (en) 2004-09-21 2010-05-11 Microbridge Technologies Canada, Inc. Compensating for linear and non-linear trimming-induced shift of temperature coefficient of resistance
US7261461B2 (en) * 2004-09-23 2007-08-28 Microbridge Technologies Inc. Measuring and trimming circuit components embedded in micro-platforms
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Also Published As

Publication number Publication date
CA2459902A1 (en) 2003-03-20
JP4268520B2 (ja) 2009-05-27
WO2003023794A3 (en) 2004-01-15
AU2002325723A1 (en) 2003-03-24
KR20050026904A (ko) 2005-03-16
DE60222162T2 (de) 2008-06-12
EP1444705B1 (de) 2007-08-29
WO2003023794A2 (en) 2003-03-20
CN1620704A (zh) 2005-05-25
EP1444705A2 (de) 2004-08-11
US20040239477A1 (en) 2004-12-02
JP2005502212A (ja) 2005-01-20
US20040207507A1 (en) 2004-10-21
US20070246455A1 (en) 2007-10-25
US7119656B2 (en) 2006-10-10
DE60222162D1 (de) 2007-10-11
ATE371936T1 (de) 2007-09-15
US20070261232A1 (en) 2007-11-15
WO2003023794A9 (en) 2004-02-26
US7249409B2 (en) 2007-07-31

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