IL155214A0 - Tantalum and tantalum nitride powder mixtures for electrolytic capacitor substrates - Google Patents
Tantalum and tantalum nitride powder mixtures for electrolytic capacitor substratesInfo
- Publication number
- IL155214A0 IL155214A0 IL15521401A IL15521401A IL155214A0 IL 155214 A0 IL155214 A0 IL 155214A0 IL 15521401 A IL15521401 A IL 15521401A IL 15521401 A IL15521401 A IL 15521401A IL 155214 A0 IL155214 A0 IL 155214A0
- Authority
- IL
- Israel
- Prior art keywords
- tantalum
- electrolytic capacitor
- nitride powder
- powder mixtures
- capacitor substrates
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 239000000843 powder Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 229910052715 tantalum Inorganic materials 0.000 title 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
- H01G9/0525—Powder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/16—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on nitrides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Ceramic Products (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/695,512 US6554884B1 (en) | 2000-10-24 | 2000-10-24 | Tantalum and tantalum nitride powder mixtures for electrolytic capacitors substrates |
| PCT/US2001/046281 WO2002034436A1 (en) | 2000-10-24 | 2001-10-23 | Tantalum and tantalum nitride powder mixtures for electrolytic capacitors substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL155214A0 true IL155214A0 (en) | 2003-11-23 |
Family
ID=24793302
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL15521401A IL155214A0 (en) | 2000-10-24 | 2001-10-23 | Tantalum and tantalum nitride powder mixtures for electrolytic capacitor substrates |
| IL155214A IL155214A (en) | 2000-10-24 | 2003-06-04 | Powdered mixtures of tantalum and tantalum nitride for electrolytic capacitor substrates |
| IL173587A IL173587A0 (en) | 2000-10-24 | 2006-02-07 | Refractory metal made of a refractory metal powder and a refractory metal nitride powder, processes for its preparation and use thereof |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL155214A IL155214A (en) | 2000-10-24 | 2003-06-04 | Powdered mixtures of tantalum and tantalum nitride for electrolytic capacitor substrates |
| IL173587A IL173587A0 (en) | 2000-10-24 | 2006-02-07 | Refractory metal made of a refractory metal powder and a refractory metal nitride powder, processes for its preparation and use thereof |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US6554884B1 (cs) |
| EP (2) | EP1337371B1 (cs) |
| JP (1) | JP4294951B2 (cs) |
| KR (1) | KR100850386B1 (cs) |
| CN (1) | CN1309513C (cs) |
| AU (1) | AU2002228767A1 (cs) |
| CA (1) | CA2425869A1 (cs) |
| CZ (1) | CZ305289B6 (cs) |
| DE (2) | DE60112962T2 (cs) |
| IL (3) | IL155214A0 (cs) |
| MX (1) | MXPA03003544A (cs) |
| PT (1) | PT1527834E (cs) |
| WO (1) | WO2002034436A1 (cs) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3871824B2 (ja) | 1999-02-03 | 2007-01-24 | キャボットスーパーメタル株式会社 | 高容量コンデンサー用タンタル粉末 |
| JP3718412B2 (ja) * | 2000-06-01 | 2005-11-24 | キャボットスーパーメタル株式会社 | ニオブまたはタンタル粉末およびその製造方法 |
| US6554884B1 (en) | 2000-10-24 | 2003-04-29 | H.C. Starck, Inc. | Tantalum and tantalum nitride powder mixtures for electrolytic capacitors substrates |
| KR100663735B1 (ko) * | 2001-05-15 | 2007-01-03 | 쇼와 덴코 가부시키가이샤 | 니오브 분말, 니오브 소결체 및 이 소결체를 사용한 콘덴서 |
| JP4396970B2 (ja) | 2001-10-01 | 2010-01-13 | 昭和電工株式会社 | タンタル焼結体及びその焼結体を用いたコンデンサ |
| DE60222467T3 (de) * | 2001-12-10 | 2017-12-07 | Showa Denko K.K. | Nioblegierung, gesinterter körper davon und kondensator damit |
| JP2003338433A (ja) * | 2002-05-22 | 2003-11-28 | Nec Tokin Corp | 固体電解コンデンサ用の陽極体、その製造方法及び固体電解コンデンサ |
| US6965510B1 (en) * | 2003-12-11 | 2005-11-15 | Wilson Greatbatch Technologies, Inc. | Sintered valve metal powders for implantable capacitors |
| US7682362B2 (en) * | 2005-02-01 | 2010-03-23 | Smith & Nephew, Inc. | Lockable orientation stylus |
| CN100415640C (zh) * | 2005-05-24 | 2008-09-03 | 株洲硬质合金集团有限公司 | 超细高氮氮化钽粉末及其制备方法 |
| JP5289669B2 (ja) * | 2005-06-10 | 2013-09-11 | ローム株式会社 | Ｎｂ化合物の微粉末の製造方法、Ｎｂ化合物の微粉末を用いた固体電解コンデンサの製造方法 |
| FR2894597B1 (fr) * | 2005-12-12 | 2008-04-11 | Ceramique Plastique Sa | Ebauche massive pour piece mecanique, en materiau ceramique fritte et procede de fabrication d'une telle ebauche |
| WO2007130483A2 (en) * | 2006-05-05 | 2007-11-15 | Cabot Corporation | Tantalum powder with smooth surface and methods of manufacturing same |
| GB0622463D0 (en) * | 2006-11-10 | 2006-12-20 | Avx Ltd | Powder modification in the manufacture of solid state capacitor anodes |
| US20080144257A1 (en) * | 2006-12-18 | 2008-06-19 | Yuri Freeman | Anodes for electrolytic capacitors with high volumetric efficiency |
| US7731893B2 (en) * | 2006-12-18 | 2010-06-08 | Kemet Electronics Corporation | Method for making anodes for electrolytic capacitor with high volumetric efficiency |
| KR20080085293A (ko) * | 2007-03-19 | 2008-09-24 | 삼성전기주식회사 | 탄탈 콘덴서 제조방법 |
| KR20080085294A (ko) * | 2007-03-19 | 2008-09-24 | 삼성전기주식회사 | 탄탈 콘덴서 제조방법 |
| US20090279233A1 (en) * | 2008-05-12 | 2009-11-12 | Yuri Freeman | High volumetric efficiency anodes for electrolytic capacitors |
| DE102011109756A1 (de) * | 2011-08-09 | 2013-02-14 | H.C. Starck Gmbh | Verfahren zur Herstellung von Elektrolytkondensatoren aus Ventilmetallpulvern |
| US8349030B1 (en) | 2011-09-21 | 2013-01-08 | Kemet Electronics Corporation | Method for making anodes for high voltage electrolytic capacitors with high volumetric efficiency and stable D.C. leakage |
| USRE48439E1 (en) | 2013-09-06 | 2021-02-16 | Greatbatch Ltd. | High voltage tantalum anode and method of manufacture |
| US9312075B1 (en) | 2013-09-06 | 2016-04-12 | Greatbatch Ltd. | High voltage tantalum anode and method of manufacture |
| WO2015085476A1 (zh) | 2013-12-10 | 2015-06-18 | 宁夏东方钽业股份有限公司 | 一种高氮含量电容器级钽粉末的制备方法、由该方法制备的电容器级钽粉以及由该钽粉制备的阳极和电容器 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2218633B1 (cs) * | 1973-02-19 | 1977-07-22 | Lignes Telegraph Telephon | |
| US3825802A (en) * | 1973-03-12 | 1974-07-23 | Western Electric Co | Solid capacitor |
| DE2610224C2 (de) * | 1976-03-11 | 1983-01-05 | Fa. Hermann C. Starck Berlin, 1000 Berlin | Verfahren zur Herstellung von porösen Anodenkörpern durch Pressen und Sintern von Pulvern aus Ventilmetallen |
| JPS5349254A (en) | 1976-10-15 | 1978-05-04 | Fujitsu Ltd | Method of manufacturing tantalum nitride electrolytic capacitor |
| US4544403A (en) | 1984-11-30 | 1985-10-01 | Fansteel Inc. | High charge, low leakage tantalum powders |
| US5448447A (en) * | 1993-04-26 | 1995-09-05 | Cabot Corporation | Process for making an improved tantalum powder and high capacitance low leakage electrode made therefrom |
| EP0665302B1 (en) * | 1994-01-26 | 2000-05-03 | H.C. Starck, INC. | Nitriding tantalum powder |
| US5825611A (en) * | 1997-01-29 | 1998-10-20 | Vishay Sprague, Inc. | Doped sintered tantalum pellets with nitrogen in a capacitor |
| US6185090B1 (en) | 1997-01-29 | 2001-02-06 | Vishay Sprague, Inc. | Method for doping sintered tantalum and niobium pellets with nitrogen |
| JP3254163B2 (ja) * | 1997-02-28 | 2002-02-04 | 昭和電工株式会社 | コンデンサ |
| US6051044A (en) * | 1998-05-04 | 2000-04-18 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
| JP3196832B2 (ja) * | 1998-05-15 | 2001-08-06 | 日本電気株式会社 | 固体電解コンデンサ及びその製造方法 |
| WO2000049633A1 (fr) | 1999-02-16 | 2000-08-24 | Showa Denko K.K. | Poudre de niobium, element fritte a base de niobium, condensateur renfermant cet element et procede de fabrication de ce condensateur |
| US6423110B1 (en) | 1999-12-08 | 2002-07-23 | Showa Denko K.K. | Powder composition for capacitor and sintered body using the composition, and capacitor using the sintered body |
| US6432161B1 (en) | 2000-02-08 | 2002-08-13 | Cabot Supermetals K.K. | Nitrogen-containing metal powder, production process thereof, and porous sintered body and solid electrolytic capacitor using the metal powder |
| AU2001239946B2 (en) | 2000-03-01 | 2004-12-16 | Cabot Corporation | Nitrided valve metals and processes for making the same |
| US6214271B1 (en) | 2000-05-26 | 2001-04-10 | Kemet Electronics Corporation | Thermal treatment process for valve metal nitride electrolytic capacitors having manganese oxide cathodes |
| US6554884B1 (en) | 2000-10-24 | 2003-04-29 | H.C. Starck, Inc. | Tantalum and tantalum nitride powder mixtures for electrolytic capacitors substrates |
| US6447570B1 (en) | 2000-11-30 | 2002-09-10 | Vishay Sprague, Inc. | Sintered Tantalum and Niobium capacitor pellets doped with Nitrogen, and method of making the same |
-
2000
- 2000-10-24 US US09/695,512 patent/US6554884B1/en not_active Expired - Lifetime
-
2001
- 2001-10-23 AU AU2002228767A patent/AU2002228767A1/en not_active Abandoned
- 2001-10-23 EP EP01988636A patent/EP1337371B1/en not_active Expired - Lifetime
- 2001-10-23 MX MXPA03003544A patent/MXPA03003544A/es active IP Right Grant
- 2001-10-23 DE DE60112962T patent/DE60112962T2/de not_active Expired - Lifetime
- 2001-10-23 CA CA002425869A patent/CA2425869A1/en not_active Abandoned
- 2001-10-23 KR KR1020037005613A patent/KR100850386B1/ko not_active Expired - Fee Related
- 2001-10-23 IL IL15521401A patent/IL155214A0/xx active IP Right Grant
- 2001-10-23 PT PT05001377T patent/PT1527834E/pt unknown
- 2001-10-23 DE DE60133143T patent/DE60133143T2/de not_active Expired - Lifetime
- 2001-10-23 EP EP05001377A patent/EP1527834B1/en not_active Expired - Lifetime
- 2001-10-23 JP JP2002537471A patent/JP4294951B2/ja not_active Expired - Fee Related
- 2001-10-23 CN CNB018178855A patent/CN1309513C/zh not_active Expired - Fee Related
- 2001-10-23 WO PCT/US2001/046281 patent/WO2002034436A1/en active IP Right Grant
- 2001-10-23 CZ CZ2003-1149A patent/CZ305289B6/cs not_active IP Right Cessation
-
2002
- 2002-10-25 US US10/280,295 patent/US6716389B2/en not_active Expired - Fee Related
-
2003
- 2003-06-04 IL IL155214A patent/IL155214A/en not_active IP Right Cessation
-
2006
- 2006-02-07 IL IL173587A patent/IL173587A0/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1527834B1 (en) | 2008-03-05 |
| EP1337371B1 (en) | 2005-08-24 |
| DE60112962T2 (de) | 2006-05-18 |
| MXPA03003544A (es) | 2004-09-10 |
| PT1527834E (pt) | 2008-04-23 |
| CZ20031149A3 (cs) | 2003-10-15 |
| CA2425869A1 (en) | 2002-05-02 |
| US6716389B2 (en) | 2004-04-06 |
| DE60133143D1 (de) | 2008-04-17 |
| CN1498144A (zh) | 2004-05-19 |
| EP1527834A1 (en) | 2005-05-04 |
| US6554884B1 (en) | 2003-04-29 |
| EP1337371A4 (en) | 2004-05-26 |
| WO2002034436A1 (en) | 2002-05-02 |
| KR20030051734A (ko) | 2003-06-25 |
| DE60112962D1 (de) | 2005-09-29 |
| IL173587A0 (en) | 2006-07-05 |
| US20030126944A1 (en) | 2003-07-10 |
| IL155214A (en) | 2006-08-20 |
| AU2002228767A1 (en) | 2002-05-06 |
| CZ305289B6 (cs) | 2015-07-22 |
| JP2004524674A (ja) | 2004-08-12 |
| CN1309513C (zh) | 2007-04-11 |
| EP1337371A1 (en) | 2003-08-27 |
| DE60133143T2 (de) | 2009-03-12 |
| JP4294951B2 (ja) | 2009-07-15 |
| KR100850386B1 (ko) | 2008-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |