IL140145A - Non-contact test method and apparatus - Google Patents

Non-contact test method and apparatus

Info

Publication number
IL140145A
IL140145A IL14014599A IL14014599A IL140145A IL 140145 A IL140145 A IL 140145A IL 14014599 A IL14014599 A IL 14014599A IL 14014599 A IL14014599 A IL 14014599A IL 140145 A IL140145 A IL 140145A
Authority
IL
Israel
Prior art keywords
test method
contact test
contact
test
Prior art date
Application number
IL14014599A
Other languages
English (en)
Other versions
IL140145A0 (en
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of IL140145A0 publication Critical patent/IL140145A0/xx
Publication of IL140145A publication Critical patent/IL140145A/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
IL14014599A 1998-06-16 1999-06-16 Non-contact test method and apparatus IL140145A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL124961A IL124961A (en) 1998-06-16 1998-06-16 Contactless test method and system
PCT/IL1999/000333 WO1999065287A2 (en) 1998-06-16 1999-06-16 Non-contact test method and apparatus

Publications (2)

Publication Number Publication Date
IL140145A0 IL140145A0 (en) 2002-02-10
IL140145A true IL140145A (en) 2005-09-25

Family

ID=11071639

Family Applications (2)

Application Number Title Priority Date Filing Date
IL124961A IL124961A (en) 1998-06-16 1998-06-16 Contactless test method and system
IL14014599A IL140145A (en) 1998-06-16 1999-06-16 Non-contact test method and apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL124961A IL124961A (en) 1998-06-16 1998-06-16 Contactless test method and system

Country Status (6)

Country Link
US (2) US6630832B1 (xx)
CN (2) CN1560647A (xx)
AU (1) AU4388099A (xx)
IL (2) IL124961A (xx)
TW (1) TW496963B (xx)
WO (1) WO1999065287A2 (xx)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL124961A (en) * 1998-06-16 2006-10-05 Orbotech Ltd Contactless test method and system
US6316949B1 (en) * 1999-01-19 2001-11-13 Nidec-Read Corporation Apparatus and method for testing electric conductivity of circuit path ways on circuit board
CA2308820A1 (en) 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
JP2002098727A (ja) * 2000-09-25 2002-04-05 Oht Inc 検査ユニット、及び、基板の製造方法
FR2817352B1 (fr) * 2000-11-27 2004-07-16 Pierre Paul Jobert Dispositif de controle de conformite de reseaux de pistes conductrices pour ecrans plats
US6759850B2 (en) 2001-03-28 2004-07-06 Orbotech Ltd. System and method for non-contact electrical testing employing a CAM derived reference
JP2003035738A (ja) * 2001-07-19 2003-02-07 Omron Corp 部品実装基板の検査方法および部品実装基板用の検査装置
US6999888B2 (en) * 2002-09-30 2006-02-14 Intel Corporation Automated circuit board test actuator system
US7154257B2 (en) * 2002-09-30 2006-12-26 Intel Corporation Universal automated circuit board tester
US7214528B1 (en) 2002-12-31 2007-05-08 Oregon Health & Sciences University Device for direct electrical detection of molecules and molecule-molecule interactions
US7872485B2 (en) * 2004-10-18 2011-01-18 Colvin James B System and method for use in functional failure analysis by induced stimulus
US7323888B1 (en) * 2003-11-01 2008-01-29 Colvin James B System and method for use in functional failure analysis by induced stimulus
KR101270180B1 (ko) * 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 검사장치 및 검사방법과, 반도체장치 제작방법
KR100799161B1 (ko) * 2006-07-20 2008-01-29 마이크로 인스펙션 주식회사 비접촉 싱글사이드 프로브와 이를 이용한 패턴전극의 단선및 단락 검사장치 및 그 방법
DE102008030545A1 (de) * 2008-06-27 2010-01-07 Siemens Aktiengesellschaft Vorrichtung und Verfahren zur berührungslosen Ankontaktierung von leitfähigen Strukturen, insbesondere von Dünnschicht-Transistor-Flüssigkristallanzeigen (Thin Film Transistor Liquid Crystal Displays)
DE102009022965A1 (de) * 2009-05-28 2010-12-02 Siemens Aktiengesellschaft Messung eines Substrats mit elektrisch leitenden Strukturen
US9035673B2 (en) 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
KR101233070B1 (ko) * 2011-09-30 2013-02-25 마이크로 인스펙션 주식회사 비접촉 프로브
US20130088245A1 (en) * 2011-10-10 2013-04-11 Kla-Tencor Corporation Capacitive Inspection Of EUV Photomasks
US20150331038A1 (en) * 2013-09-30 2015-11-19 Radiation Monitoring Devices, Inc. Analysis system
US10379156B2 (en) 2015-05-29 2019-08-13 Taiwan Semiconductor Manufacturing Company, Ltd. Bump ball testing system and method
CN105372578A (zh) * 2015-09-24 2016-03-02 北京同方微电子有限公司 一种非接触芯片测试系统及方法
TWI778072B (zh) * 2017-06-22 2022-09-21 以色列商奧寶科技有限公司 用於在超高解析度面板中偵測缺陷之方法
KR102387464B1 (ko) * 2017-10-12 2022-04-15 삼성전자주식회사 배선 회로 테스트 장치 및 방법과, 그 방법을 포함한 반도체 소자 제조방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE437427B (sv) 1983-07-21 1985-02-25 Seg Resistor Ab Vagdon for bandtransportor med tre transportrullar placerade i var sin omslutande ram, varav atminstone sidorullarna er individuellt instellbara vagdon for bandtransportor med tre transportrullar placerade i var sin omslutande ram, varav atminstone sidorullarna er individuellt instellbara
GB2143954A (en) 1983-07-22 1985-02-20 Sharetree Ltd A capacitive method and apparatus for checking connections of a printed circuit board
US4647849A (en) 1985-05-10 1987-03-03 The United States Of America As Represented By The Secretary Of The Army Two dimensional non-field perturbing, diode detected, double gapped, high sensitivity, B-dot electromagnetic field probes
CA1286724C (en) 1986-03-27 1991-07-23 Richard Ralph Goulette Method and apparatus for monitoring electromagnetic emission levels
US5122753A (en) 1990-12-20 1992-06-16 Microelectronics And Computer Technology Corporation Method of testing electrical components for defects
US5254953A (en) 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
CA2049616C (en) 1991-01-22 2000-04-04 Jacob Soiferman Contactless test method and system for testing printed circuit boards
US5424633A (en) 1991-01-22 1995-06-13 Advanced Test Technologies Inc. Contactless test method and system for testing printed circuit boards
EP0498007A1 (en) * 1991-02-06 1992-08-12 International Business Machines Corporation Method and apparatus for contactless testing
US5202640A (en) 1991-06-03 1993-04-13 International Business Machines Corporation Capacitance and leakage test method and apparatus
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
US5646522A (en) 1992-09-24 1997-07-08 Hughes Electronics Wireless test fixture for high frequency testing
US5406209A (en) 1993-02-04 1995-04-11 Northern Telecom Limited Methods and apparatus for testing circuit boards
US5426372A (en) 1993-07-30 1995-06-20 Genrad, Inc. Probe for capacitive open-circuit tests
JPH07140209A (ja) 1993-09-20 1995-06-02 Fujitsu Ltd 回路配線基板の検査装置およびその検査方法
US5428626A (en) 1993-10-18 1995-06-27 Tektronix, Inc. Timing analyzer for embedded testing
US5469051A (en) 1994-04-29 1995-11-21 International Business Machines Corp. Electrical defect detector for circuit lines
US5517110A (en) * 1995-04-06 1996-05-14 Yentec Inc. Contactless test method and system for testing printed circuit boards
CA2162347C (en) 1995-11-07 2001-01-09 Gary Gunthorpe Method and apparatus for high-speed scanning of electromagnetic field levels
JP2994259B2 (ja) 1996-03-28 1999-12-27 オー・エイチ・ティー株式会社 基板検査方法および基板検査装置
GB2312519A (en) * 1996-04-23 1997-10-29 George Guozhen Zhong Multiple probe printed circuit board test arrangement
US6087842A (en) 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
US5821759A (en) 1997-02-27 1998-10-13 International Business Machines Corporation Method and apparatus for detecting shorts in a multi-layer electronic package
US6242923B1 (en) 1997-02-27 2001-06-05 International Business Machines Corporation Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards
JP3080595B2 (ja) 1997-02-28 2000-08-28 日本電産リード株式会社 基板検査装置および基板検査方法
US5807763A (en) 1997-05-05 1998-09-15 International Business Machines Corporation Electric field test of integrated circuit component
US6160517A (en) 1998-01-20 2000-12-12 Dell Usa, Llp Method and apparatus for testing electronic systems using electromagnetic emissions profiles
IL124961A (en) * 1998-06-16 2006-10-05 Orbotech Ltd Contactless test method and system
US6268719B1 (en) 1998-09-23 2001-07-31 Delaware Capital Formation, Inc. Printed circuit board test apparatus
US6759850B2 (en) * 2001-03-28 2004-07-06 Orbotech Ltd. System and method for non-contact electrical testing employing a CAM derived reference

Also Published As

Publication number Publication date
AU4388099A (en) 2000-01-05
CN1312911A (zh) 2001-09-12
CN1560647A (zh) 2005-01-05
IL124961A0 (en) 1999-01-26
WO1999065287A3 (en) 2000-02-10
IL140145A0 (en) 2002-02-10
US20050248353A1 (en) 2005-11-10
IL124961A (en) 2006-10-05
TW496963B (en) 2002-08-01
WO1999065287A2 (en) 1999-12-23
US6630832B1 (en) 2003-10-07

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Legal Events

Date Code Title Description
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees