IE34305B1 - Semiconductor chip bonding - Google Patents

Semiconductor chip bonding

Info

Publication number
IE34305B1
IE34305B1 IE775/70A IE77570A IE34305B1 IE 34305 B1 IE34305 B1 IE 34305B1 IE 775/70 A IE775/70 A IE 775/70A IE 77570 A IE77570 A IE 77570A IE 34305 B1 IE34305 B1 IE 34305B1
Authority
IE
Ireland
Prior art keywords
semiconductor chips
bond
heater
gold
semiconductor chip
Prior art date
Application number
IE775/70A
Other versions
IE34305L (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE34305L publication Critical patent/IE34305L/en
Publication of IE34305B1 publication Critical patent/IE34305B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

An apparatus for attaching semiconductor chips to gold pads is described as comprising a stainless steel hot stage mounted on top of a heater block having a temperature of approximately 300.degree. C. with a platinum ribbon heater or an RF heater element protruding through a hole in the hot stage and flush with the top surface thereof so as to provide a local hot spot smaller than the gold pads to which the semiconductor chips are to be attached. A current passed through the platinum causes heating to a temperature sufficient to eutectically bond the chip to the gold pad. An inert atmosphere is provided during the bonding operation to enhance the accuracy and reproducibility of the bond.[US3617682A]
IE775/70A 1969-06-23 1970-06-15 Semiconductor chip bonding IE34305B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83569469A 1969-06-23 1969-06-23

Publications (2)

Publication Number Publication Date
IE34305L IE34305L (en) 1970-12-23
IE34305B1 true IE34305B1 (en) 1975-04-02

Family

ID=25270224

Family Applications (1)

Application Number Title Priority Date Filing Date
IE775/70A IE34305B1 (en) 1969-06-23 1970-06-15 Semiconductor chip bonding

Country Status (8)

Country Link
US (1) US3617682A (en)
JP (1) JPS4840807B1 (en)
BE (1) BE752344A (en)
DE (2) DE2029915A1 (en)
FR (1) FR2047079B1 (en)
GB (1) GB1313342A (en)
IE (1) IE34305B1 (en)
NL (1) NL7009064A (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717743A (en) * 1970-12-07 1973-02-20 Argus Eng Co Method and apparatus for heat-bonding in a local area using combined heating techniques
US3710432A (en) * 1971-03-30 1973-01-16 Gen Electric Method for removing a metalized device from a surface
US3797100A (en) * 1971-04-12 1974-03-19 L Browne Soldering method and apparatus for ceramic circuits
US3740521A (en) * 1971-08-16 1973-06-19 M Bullard Soldering apparatus for saw cutting teeth
US3722072A (en) * 1971-11-15 1973-03-27 Signetics Corp Alignment and bonding method for semiconductor components
US3791018A (en) * 1971-11-16 1974-02-12 Western Electric Co Heating method and apparatus for securing a member to an article
US3765590A (en) * 1972-05-08 1973-10-16 Fairchild Camera Instr Co Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads
US3846905A (en) * 1973-07-09 1974-11-12 Texas Instruments Inc Assembly method for semiconductor chips
US3883945A (en) * 1974-03-13 1975-05-20 Mallory & Co Inc P R Method for transferring and joining beam leaded chips
US3920949A (en) * 1974-03-13 1975-11-18 Mallory & Co Inc P R Beam leaded device welding machine
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
CH647908A5 (en) * 1979-06-05 1985-02-15 Siemens Ag Albis METHOD AND ARRANGEMENT FOR CONTACTING THE CIRCUITS OF CIRCUIT BOARDS WITH CONTACT PINS.
US4320865A (en) * 1980-03-21 1982-03-23 National Semiconductor Corporation Apparatus for attachment of die to heat sink
US4583676A (en) * 1982-05-03 1986-04-22 Motorola, Inc. Method of wire bonding a semiconductor die and apparatus therefor
JPS58192999A (en) * 1982-05-06 1983-11-10 Akaishi Kinzoku Kogyo Kk Cylinder type multi-blade fan and manufacturing thereof
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
US4638938A (en) * 1984-09-07 1987-01-27 Rockwell International Corporation Vapor phase bonding for RF microstrip line circuits
DE3722730A1 (en) * 1987-07-09 1989-01-19 Productech Gmbh HEATED STAMP
FR2618606B1 (en) * 1987-07-24 1990-02-16 Thomson Composants Militaires INTEGRATED CIRCUIT CHIP WELDING OVEN
US5058800A (en) * 1988-05-30 1991-10-22 Canon Kabushiki Kaisha Method of making electric circuit device
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
EP0434135B1 (en) * 1989-12-20 1994-06-01 Koninklijke Philips Electronics N.V. Method of positioning and soldering of SMD components
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device
JP3290632B2 (en) * 1999-01-06 2002-06-10 株式会社アルテクス Ultrasonic vibration bonding equipment
DE10133217A1 (en) * 2001-07-09 2003-01-23 Seho Systemtechnik Gmbh Method and device for soldering electrical components to plastic film
JP4206320B2 (en) * 2003-09-19 2009-01-07 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
US20050127144A1 (en) * 2003-12-10 2005-06-16 Atuhito Mochida Method of mounting a semiconductor laser component on a submount
FR2938724B1 (en) * 2008-11-19 2012-08-10 Valeo Equip Electr Moteur METHOD AND DEVICE FOR THERMODY SELECTIVE WELDING FOR ELECTRONIC CHIPS
CN114429927B (en) * 2022-01-26 2022-09-27 深圳市锐博自动化设备有限公司 Automatic eutectic machine for semiconductor chip

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US236972A (en) * 1881-01-25 Soldering-iron
US379822A (en) * 1888-03-20 Electric heater
NL175652B (en) * 1952-02-07 Krings Josef SLIDING SHOE FOR TENSIONING DEVICE OF A HANDLE CONSTRUCTION DEVICE.
US3070683A (en) * 1960-01-27 1962-12-25 Joseph J Moro-Lin Cementing of semiconductor device components
NL261280A (en) * 1960-02-25 1900-01-01
US3006122A (en) * 1960-04-06 1961-10-31 Weishans Albert Heat sealing apparatus and method
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
NL283249A (en) * 1961-09-19 1900-01-01
US3095492A (en) * 1961-12-26 1963-06-25 Northrop Corp Controlled resistance spot heating device
US3197608A (en) * 1962-01-23 1965-07-27 Sylvania Electric Prod Method of manufacture of semiconductor devices
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3369954A (en) * 1964-11-12 1968-02-20 Fener Alfred Heat sealing machine and sealing member therefor
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus
FR1524295A (en) * 1967-03-29 1968-05-10 Improvements to thermocompression scuder machines for manufacturing steep junction diodes

Also Published As

Publication number Publication date
FR2047079B1 (en) 1974-05-03
JPS4840807B1 (en) 1973-12-03
GB1313342A (en) 1973-04-11
DE7022778U (en) 1972-04-20
DE2029915A1 (en) 1971-01-07
IE34305L (en) 1970-12-23
BE752344A (en) 1970-12-22
NL7009064A (en) 1970-12-28
US3617682A (en) 1971-11-02
FR2047079A1 (en) 1971-03-12

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