ID29245A - Metoda pembuatan substrat keramik multi-lapisan - Google Patents

Metoda pembuatan substrat keramik multi-lapisan

Info

Publication number
ID29245A
ID29245A IDW20002614A ID20002614A ID29245A ID 29245 A ID29245 A ID 29245A ID W20002614 A IDW20002614 A ID W20002614A ID 20002614 A ID20002614 A ID 20002614A ID 29245 A ID29245 A ID 29245A
Authority
ID
Indonesia
Prior art keywords
ceramic substrate
making method
layer ceramic
substrate making
layer
Prior art date
Application number
IDW20002614A
Other languages
English (en)
Indonesian (id)
Inventor
Shigetosi Segawa
Hiroshi Ochi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID29245A publication Critical patent/ID29245A/id

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
IDW20002614A 1999-04-15 2000-03-23 Metoda pembuatan substrat keramik multi-lapisan ID29245A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11108416A JP2000299561A (ja) 1999-04-15 1999-04-15 セラミック多層基板の製造方法

Publications (1)

Publication Number Publication Date
ID29245A true ID29245A (id) 2001-08-16

Family

ID=14484219

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20002614A ID29245A (id) 1999-04-15 2000-03-23 Metoda pembuatan substrat keramik multi-lapisan

Country Status (7)

Country Link
EP (1) EP1094694A1 (fr)
JP (1) JP2000299561A (fr)
KR (1) KR20010052911A (fr)
CN (1) CN1300527A (fr)
ID (1) ID29245A (fr)
TW (1) TW463539B (fr)
WO (1) WO2000064227A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878084B2 (ja) * 2001-04-09 2012-02-15 パナソニック株式会社 セラミック多層基板の製造方法
JP2003017851A (ja) * 2001-06-29 2003-01-17 Murata Mfg Co Ltd 多層セラミック基板の製造方法
JP4337822B2 (ja) * 2004-01-27 2009-09-30 株式会社村田製作所 積層型電子部品の製造方法
KR20060108908A (ko) * 2005-04-13 2006-10-18 삼성전기주식회사 적층형 세라믹 기판의 제조 방법
CN101494957B (zh) * 2008-01-23 2011-03-30 富葵精密组件(深圳)有限公司 多层电路板制作方法及用于制作多层电路板的基板
KR101386524B1 (ko) * 2012-09-07 2014-04-21 한국세라믹기술원 근접장 통신용 자성체 시트의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283595A (ja) * 1990-03-30 1991-12-13 Nec Corp セラミック多層配線基板の製造方法
US5370759A (en) * 1992-05-20 1994-12-06 Matsushita Electric Industrial Co., Ltd. Method for producing multilayered ceramic substrate
US5470412A (en) * 1992-07-30 1995-11-28 Sumitomo Metal Ceramics Inc. Process for producing a circuit substrate
JP3623534B2 (ja) * 1994-07-27 2005-02-23 イビデン株式会社 多層セラミックス基板の製造方法

Also Published As

Publication number Publication date
JP2000299561A (ja) 2000-10-24
EP1094694A1 (fr) 2001-04-25
WO2000064227A1 (fr) 2000-10-26
CN1300527A (zh) 2001-06-20
KR20010052911A (ko) 2001-06-25
TW463539B (en) 2001-11-11

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