HUP9700191A2 - Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók - Google Patents
Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciókInfo
- Publication number
- HUP9700191A2 HUP9700191A2 HU9700191A HUP9700191A HUP9700191A2 HU P9700191 A2 HUP9700191 A2 HU P9700191A2 HU 9700191 A HU9700191 A HU 9700191A HU P9700191 A HUP9700191 A HU P9700191A HU P9700191 A2 HUP9700191 A2 HU P9700191A2
- Authority
- HU
- Hungary
- Prior art keywords
- stone
- epoxy
- resin
- filler
- aromatic
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 2
- 239000010703 silicon Substances 0.000 title abstract 2
- 239000004575 stone Substances 0.000 abstract 6
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 150000001408 amides Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 abstract 1
- 239000010428 baryte Substances 0.000 abstract 1
- 229910052601 baryte Inorganic materials 0.000 abstract 1
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- UOCIZHQMWNPGEN-UHFFFAOYSA-N dialuminum;oxygen(2-);trihydrate Chemical compound O.O.O.[O-2].[O-2].[O-2].[Al+3].[Al+3] UOCIZHQMWNPGEN-UHFFFAOYSA-N 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 238000004049 embossing Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000002209 hydrophobic effect Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 230000005923 long-lasting effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000011505 plaster Substances 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 229920000768 polyamine Polymers 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
A találmány szerinti kőmpőzíció lényege, hőgy kiváló villamősszilárdságú anyagőkat házasít össze úgy, hőgy egyesíti az epőxigyantákviszőnylag alacsőnyabb árát és egyszerű feldőlgőzhatóságát aszilikőngűmi előnyös felületi jellemzőivel (hidrőfób jelleg, villamőskisülés űtáni helyreállás), jó időjárásállóságával. Az új kőmpőzíciókisnyőmású öntési technőlógiával, illetve nyőmás alatti gélesítésselis feldőlgőzható. Az alapgyanta kis viszkőzitása főlytán a gyanta nagymennyiségű töltőanyag felvételére képes. Az epőxigyantát módősítószilikőn nem egyszerűen lágyítóként van jelen, hanem beépül a térhálósszerkezetbe és tartósan fejti ki hatását. A szigetelőkőmpőzíció főbbösszetevői: ciklőalifás, alifás (vagy arőmás) epőxigyanta, ciklőalifás(vagy arőmás) anhidrid (esetleg amin vagy pőliaminő-amid) térhálósító,győrsító, epőxi-végcsőpőrtőt tartalmazó szilikőn őligőmer, amihezjárűlhat kismőlekűlás vagy makrőmőlekűlás aktív hígító(flexibilizátőr), töltőanyag (példáűl kvarc, alűmíniűm-őxid-trihidrát,wőllastőnit, vágőtt üvegszál, barit, kalciűm-karbőnát stb.). Akőmpőnensek arányának váltőztatásával a merev, teherhőrdószerkezetektől a lágy, gűmiszerű anyagőkig mindenféle kőmpőzícióelőállítható. ŕ
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HU9700191A HU217112B (hu) | 1997-01-21 | 1997-01-21 | Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók |
JP10534022A JP2001502470A (ja) | 1997-01-21 | 1998-01-21 | エポキシ―シリコーンハイブリッド樹脂ベース電気絶縁組成物 |
PCT/HU1998/000007 WO1998032138A1 (en) | 1997-01-21 | 1998-01-21 | Electric insulation compositions based on epoxy-silicone hybrid resins |
EP98902143A EP0896723A1 (en) | 1997-01-21 | 1998-01-21 | Electric insulation compositions based on epoxy-silicone hybrid resins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HU9700191A HU217112B (hu) | 1997-01-21 | 1997-01-21 | Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók |
Publications (4)
Publication Number | Publication Date |
---|---|
HU9700191D0 HU9700191D0 (en) | 1997-03-28 |
HUP9700191A2 true HUP9700191A2 (hu) | 1998-08-28 |
HUP9700191A3 HUP9700191A3 (en) | 1999-04-28 |
HU217112B HU217112B (hu) | 1999-11-29 |
Family
ID=89994659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU9700191A HU217112B (hu) | 1997-01-21 | 1997-01-21 | Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0896723A1 (hu) |
JP (1) | JP2001502470A (hu) |
HU (1) | HU217112B (hu) |
WO (1) | WO1998032138A1 (hu) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6764616B1 (en) | 1999-11-29 | 2004-07-20 | Huntsman Advanced Materials Americas Inc. | Hydrophobic epoxide resin system |
WO2001059791A1 (fr) | 2000-02-10 | 2001-08-16 | The Furukawa Electric Co., Ltd. | Fil isole |
EP1172408A1 (de) † | 2000-07-14 | 2002-01-16 | Abb Research Ltd. | Volumenmodifizierte Vergussmassen auf der Basis polymerer Matrixharze |
EP1176611B1 (en) * | 2001-02-13 | 2006-05-03 | The Furukawa Electric Co., Ltd. | Insulated wire |
KR20090033226A (ko) * | 2006-07-20 | 2009-04-01 | 에이비비 리써치 리미티드 | 경화 가능한 에폭시 수지 조성물 |
ES2411462T3 (es) | 2009-04-02 | 2013-07-05 | Huntsman Advanced Materials (Switzerland) Gmbh | Sobremoldeo directo |
CN102421835A (zh) * | 2009-05-05 | 2012-04-18 | Abb研究有限公司 | 可固化溶胶-凝胶组合物 |
CN103319925A (zh) * | 2013-06-04 | 2013-09-25 | 常熟市九洲电器设备有限公司 | 一种高韧性和耐高低温电机用绝缘漆 |
DE102018202061A1 (de) * | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Isolation, elektrische Maschine und Verfahren zur Herstellung der Isolation |
DE102018202058A1 (de) * | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems |
FR3091406B1 (fr) * | 2018-12-31 | 2021-01-15 | Centre National De Recherche Scient Cnrs | Matériau pour l’isolation électrique et procédé de fabrication |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930001988B1 (ko) * | 1988-04-05 | 1993-03-20 | 미쓰비시뎅끼 가부시끼가이샤 | 반도체 봉지용 에폭시 수지조성물 |
KR0158868B1 (ko) * | 1988-09-20 | 1998-12-01 | 미다 가쓰시게 | 반도체장치 |
JP3359410B2 (ja) * | 1994-03-04 | 2002-12-24 | 三菱電機株式会社 | 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法 |
-
1997
- 1997-01-21 HU HU9700191A patent/HU217112B/hu not_active IP Right Cessation
-
1998
- 1998-01-21 EP EP98902143A patent/EP0896723A1/en not_active Withdrawn
- 1998-01-21 WO PCT/HU1998/000007 patent/WO1998032138A1/en not_active Application Discontinuation
- 1998-01-21 JP JP10534022A patent/JP2001502470A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
HU9700191D0 (en) | 1997-03-28 |
HU217112B (hu) | 1999-11-29 |
JP2001502470A (ja) | 2001-02-20 |
WO1998032138A1 (en) | 1998-07-23 |
HUP9700191A3 (en) | 1999-04-28 |
EP0896723A1 (en) | 1999-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HUP9700191A2 (hu) | Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók | |
KR101708505B1 (ko) | 실리콘 수지 조성물 및 이의 경화물 | |
DE60301389T2 (de) | Verbesserter schnittstellenklebstoff | |
CN105038694B (zh) | 一种双组份加成型有机硅粘接灌封胶及其使用方法 | |
ATE344831T1 (de) | Klebstoff für siliconkautschuk | |
DE60204209D1 (de) | Lackierbares material | |
CN108822790B (zh) | 一种单组份脱醇型低模量硅酮耐候密封胶及其制备方法 | |
MY114561A (en) | Curable organosiloxane compositions and semiconductor devices | |
BR9714295A (pt) | Composição de polìmero de epóxi-polissilixano | |
ATE28376T1 (de) | Mittel zur befestigung an waenden. | |
MY126953A (en) | Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same | |
JPH0449878B2 (hu) | ||
CN103184031B (zh) | 一种led封装胶及其制备方法 | |
JP2000063791A (ja) | 圧縮性シリコ―ン組成物 | |
US3183198A (en) | Two-part adhesive bonding compositions comprising an epoxy resinous material and a poly-amido amine | |
ATE308587T1 (de) | Verfahren zur herstellung von organopolysiloxan- zusammensetzungen | |
CN104845377A (zh) | 一种双组分室温固化硅橡胶及其制备方法 | |
CN106010406A (zh) | 一种高强韧改性环氧树脂植筋胶 | |
CN109575873A (zh) | 一种耐高温有机硅凝胶及其制备方法 | |
CN103911107B (zh) | 低粘度环氧树脂灌封胶和将其用于灌封500kV高压带电显示器的用途 | |
US20070249779A1 (en) | Composition for, and method of, sealing cracks in concrete | |
KR960004442A (ko) | 에폭시 수지 조성물 및 수지 봉지형 반도체 장치 | |
MXPA02012048A (es) | Adhesivo de pegado en frio. | |
CA2313007C (en) | Quick-hardening silicone materials with good adhesive properties | |
KR19990036999A (ko) | 분배할 수 있는 레진 페이스트 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
HMM4 | Cancellation of final prot. due to non-payment of fee |