HUE044851T2 - Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására - Google Patents
Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosításáraInfo
- Publication number
- HUE044851T2 HUE044851T2 HUE14868640A HUE044851T2 HU E044851 T2 HUE044851 T2 HU E044851T2 HU E14868640 A HUE14868640 A HU E14868640A HU E044851 T2 HUE044851 T2 HU E044851T2
- Authority
- HU
- Hungary
- Prior art keywords
- thin film
- oxide semiconductor
- semiconductor thin
- evaluating
- managing quality
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 239000010409 thin film Substances 0.000 title 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N22/00—Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250412 | 2013-12-03 | ||
JP2014104629A JP5798669B2 (ja) | 2013-12-03 | 2014-05-20 | 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法、並びに上記評価方法に用いられる評価装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE044851T2 true HUE044851T2 (hu) | 2019-11-28 |
Family
ID=53273428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE14868640 HUE044851T2 (hu) | 2013-12-03 | 2014-12-01 | Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására |
Country Status (8)
Country | Link |
---|---|
US (1) | US9816944B2 (hu) |
EP (1) | EP3079165B1 (hu) |
JP (1) | JP5798669B2 (hu) |
KR (1) | KR101647618B1 (hu) |
CN (1) | CN105659372A (hu) |
HU (1) | HUE044851T2 (hu) |
TW (1) | TWI569003B (hu) |
WO (1) | WO2015083666A1 (hu) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160005871A1 (en) * | 2014-07-04 | 2016-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5993496B2 (ja) * | 2014-07-16 | 2016-09-14 | 株式会社神戸製鋼所 | 酸化物半導体薄膜、及び前記酸化物半導体薄膜の表面に保護膜を有する積層体の品質評価方法、及び酸化物半導体薄膜の品質管理方法 |
WO2016139560A1 (en) | 2015-03-03 | 2016-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film, semiconductor device including the oxide semiconductor film, and display device including the semiconductor device |
KR102086442B1 (ko) * | 2016-04-27 | 2020-03-09 | 가부시키가이샤 고베 세이코쇼 | 산화물 반도체 박막의 품질 평가 방법, 및 상기 산화물 반도체 박막의 품질 관리 방법, 그리고 해당 품질 평가 방법을 이용하는 반도체의 제조 장치 |
JP6250855B1 (ja) * | 2016-04-27 | 2017-12-20 | 株式会社神戸製鋼所 | 酸化物半導体薄膜の品質評価方法、及び前記酸化物半導体薄膜の品質管理方法、並びに該品質評価方法を用いる半導体の製造装置 |
JP6957134B2 (ja) * | 2016-07-21 | 2021-11-02 | 株式会社半導体エネルギー研究所 | 酸化物半導体の評価方法 |
JP6957099B2 (ja) * | 2017-09-05 | 2021-11-02 | 住友重機械工業株式会社 | レーザアニール装置及びシート抵抗算出装置 |
JP6922688B2 (ja) * | 2017-11-22 | 2021-08-18 | 信越半導体株式会社 | シリコン単結晶基板の選別方法及びシリコン単結晶基板 |
JP6922826B2 (ja) * | 2018-04-25 | 2021-08-18 | 信越半導体株式会社 | シリコン単結晶基板の選別方法 |
CN109030517A (zh) * | 2018-09-17 | 2018-12-18 | 南京航空航天大学 | 微波加热过程中材料反射率/透射率实时测量装置与方法 |
JP7145826B2 (ja) * | 2019-08-27 | 2022-10-03 | 三菱電機株式会社 | Seb耐性評価方法およびseb耐性評価装置 |
CN113990845B (zh) * | 2021-12-28 | 2022-03-18 | 广州粤芯半导体技术有限公司 | 检测结构及其制备方法、膜层内空洞的检测方法 |
KR20230117004A (ko) * | 2022-01-28 | 2023-08-07 | 연세대학교 산학협력단 | 공정 모니터링 방법 및 장치 |
KR102604572B1 (ko) * | 2022-04-20 | 2023-11-21 | (주) 엔지온 | 검출 유니트, 반도체 필름층 검사 장치 및 이를 이용하는 반도체 필름층 검사 방법 |
US12000866B2 (en) | 2022-04-20 | 2024-06-04 | Envigth Co., Ltd. | Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2648098B2 (ja) * | 1994-07-29 | 1997-08-27 | 日本電気株式会社 | 薄膜形成装置 |
HU227170B1 (en) * | 2000-02-17 | 2010-09-28 | Semilab Felvezetoe Fiz Lab Rt | Surface passivation method and arrangement for measuring life time of minority carrier of semiconductors |
JP4476462B2 (ja) * | 2000-03-27 | 2010-06-09 | 株式会社栃木ニコン | 半導体の電気特性評価装置 |
JP4022474B2 (ja) * | 2001-05-03 | 2007-12-19 | リーハイトン エレクトロニクス インコーポレイテツド | シート材料の非破壊的測定およびマッピングのための方法および装置 |
US20030186059A1 (en) * | 2002-02-08 | 2003-10-02 | Masukazu Hirata | Structure matter of thin film particles having carbon skeleton, processes for the production of the structure matter and the thin-film particles and uses thereof |
EP1742273A4 (en) * | 2004-04-09 | 2008-07-09 | Tokyo Electron Ltd | METHOD FOR FORMING GRID ISOLATION FILM, STORAGE MEDIUM, AND COMPUTER PROGRAM |
JP5213458B2 (ja) | 2008-01-08 | 2013-06-19 | キヤノン株式会社 | アモルファス酸化物及び電界効果型トランジスタ |
US8377804B2 (en) * | 2008-10-02 | 2013-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor substrate and semiconductor device |
JP2010123872A (ja) * | 2008-11-21 | 2010-06-03 | Sony Corp | 酸化物半導体層の非破壊検査方法、及び酸化物半導体層の作製方法 |
JP5601562B2 (ja) * | 2009-09-04 | 2014-10-08 | 独立行政法人理化学研究所 | 移動度測定装置及びその方法、並びに、抵抗率測定装置及びその方法 |
JP5389586B2 (ja) * | 2009-09-24 | 2014-01-15 | 株式会社神戸製鋼所 | 半導体薄膜の結晶性評価方法及び結晶性評価装置 |
DE112010003968B4 (de) | 2009-10-06 | 2016-12-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Einrichtung und Verfahren zum Messen einer Halbleiterladungsträgerlebensdauer |
CN102313849B (zh) | 2010-06-30 | 2014-08-06 | 株式会社神户制钢所 | 氧化物半导体薄膜的评价方法及氧化物半导体薄膜的质量管理方法 |
JP5814558B2 (ja) | 2010-06-30 | 2015-11-17 | 株式会社神戸製鋼所 | 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法 |
JP5350345B2 (ja) | 2010-09-22 | 2013-11-27 | 株式会社神戸製鋼所 | 薄膜半導体の結晶性評価装置および方法 |
US8704224B2 (en) * | 2011-09-23 | 2014-04-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor test structures |
JP6204036B2 (ja) | 2012-03-16 | 2017-09-27 | 株式会社神戸製鋼所 | 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法 |
JP6152348B2 (ja) | 2013-01-11 | 2017-06-21 | 株式会社神戸製鋼所 | 酸化物半導体薄膜の評価方法及び酸化物半導体薄膜の品質管理方法 |
-
2014
- 2014-05-20 JP JP2014104629A patent/JP5798669B2/ja not_active Expired - Fee Related
- 2014-12-01 KR KR1020167010141A patent/KR101647618B1/ko active IP Right Grant
- 2014-12-01 EP EP14868640.5A patent/EP3079165B1/en not_active Not-in-force
- 2014-12-01 US US15/031,990 patent/US9816944B2/en active Active
- 2014-12-01 HU HUE14868640 patent/HUE044851T2/hu unknown
- 2014-12-01 CN CN201480057464.4A patent/CN105659372A/zh active Pending
- 2014-12-01 WO PCT/JP2014/081744 patent/WO2015083666A1/ja active Application Filing
- 2014-12-03 TW TW103141979A patent/TWI569003B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101647618B1 (ko) | 2016-08-10 |
KR20160052742A (ko) | 2016-05-12 |
TWI569003B (zh) | 2017-02-01 |
JP2015130477A (ja) | 2015-07-16 |
EP3079165A4 (en) | 2017-07-26 |
CN105659372A (zh) | 2016-06-08 |
JP5798669B2 (ja) | 2015-10-21 |
TW201534892A (zh) | 2015-09-16 |
WO2015083666A1 (ja) | 2015-06-11 |
EP3079165A1 (en) | 2016-10-12 |
US20160282284A1 (en) | 2016-09-29 |
EP3079165B1 (en) | 2019-07-03 |
US9816944B2 (en) | 2017-11-14 |
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