HUE044851T2 - Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására - Google Patents

Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására

Info

Publication number
HUE044851T2
HUE044851T2 HUE14868640A HUE044851T2 HU E044851 T2 HUE044851 T2 HU E044851T2 HU E14868640 A HUE14868640 A HU E14868640A HU E044851 T2 HUE044851 T2 HU E044851T2
Authority
HU
Hungary
Prior art keywords
thin film
oxide semiconductor
semiconductor thin
evaluating
managing quality
Prior art date
Application number
Other languages
English (en)
Inventor
Kazushi Hayashi
Aya Miki
Toshihiro Kugimiya
Nobuyuki Kawakami
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of HUE044851T2 publication Critical patent/HUE044851T2/hu

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N22/00Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/8422Investigating thin films, e.g. matrix isolation method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/14Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Thin Film Transistor (AREA)
HUE14868640 2013-12-03 2014-12-01 Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására HUE044851T2 (hu)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013250412 2013-12-03
JP2014104629A JP5798669B2 (ja) 2013-12-03 2014-05-20 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法、並びに上記評価方法に用いられる評価装置

Publications (1)

Publication Number Publication Date
HUE044851T2 true HUE044851T2 (hu) 2019-11-28

Family

ID=53273428

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14868640 HUE044851T2 (hu) 2013-12-03 2014-12-01 Eljárás oxid félvezetõ vékonyfilm értékelésére és az oxid félvezetõ vékonyfilm minõségének biztosítására

Country Status (8)

Country Link
US (1) US9816944B2 (hu)
EP (1) EP3079165B1 (hu)
JP (1) JP5798669B2 (hu)
KR (1) KR101647618B1 (hu)
CN (1) CN105659372A (hu)
HU (1) HUE044851T2 (hu)
TW (1) TWI569003B (hu)
WO (1) WO2015083666A1 (hu)

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US20160005871A1 (en) * 2014-07-04 2016-01-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5993496B2 (ja) * 2014-07-16 2016-09-14 株式会社神戸製鋼所 酸化物半導体薄膜、及び前記酸化物半導体薄膜の表面に保護膜を有する積層体の品質評価方法、及び酸化物半導体薄膜の品質管理方法
WO2016139560A1 (en) 2015-03-03 2016-09-09 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, semiconductor device including the oxide semiconductor film, and display device including the semiconductor device
KR102086442B1 (ko) * 2016-04-27 2020-03-09 가부시키가이샤 고베 세이코쇼 산화물 반도체 박막의 품질 평가 방법, 및 상기 산화물 반도체 박막의 품질 관리 방법, 그리고 해당 품질 평가 방법을 이용하는 반도체의 제조 장치
JP6250855B1 (ja) * 2016-04-27 2017-12-20 株式会社神戸製鋼所 酸化物半導体薄膜の品質評価方法、及び前記酸化物半導体薄膜の品質管理方法、並びに該品質評価方法を用いる半導体の製造装置
JP6957134B2 (ja) * 2016-07-21 2021-11-02 株式会社半導体エネルギー研究所 酸化物半導体の評価方法
JP6957099B2 (ja) * 2017-09-05 2021-11-02 住友重機械工業株式会社 レーザアニール装置及びシート抵抗算出装置
JP6922688B2 (ja) * 2017-11-22 2021-08-18 信越半導体株式会社 シリコン単結晶基板の選別方法及びシリコン単結晶基板
JP6922826B2 (ja) * 2018-04-25 2021-08-18 信越半導体株式会社 シリコン単結晶基板の選別方法
CN109030517A (zh) * 2018-09-17 2018-12-18 南京航空航天大学 微波加热过程中材料反射率/透射率实时测量装置与方法
JP7145826B2 (ja) * 2019-08-27 2022-10-03 三菱電機株式会社 Seb耐性評価方法およびseb耐性評価装置
CN113990845B (zh) * 2021-12-28 2022-03-18 广州粤芯半导体技术有限公司 检测结构及其制备方法、膜层内空洞的检测方法
KR20230117004A (ko) * 2022-01-28 2023-08-07 연세대학교 산학협력단 공정 모니터링 방법 및 장치
KR102604572B1 (ko) * 2022-04-20 2023-11-21 (주) 엔지온 검출 유니트, 반도체 필름층 검사 장치 및 이를 이용하는 반도체 필름층 검사 방법
US12000866B2 (en) 2022-04-20 2024-06-04 Envigth Co., Ltd. Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same

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JP2648098B2 (ja) * 1994-07-29 1997-08-27 日本電気株式会社 薄膜形成装置
HU227170B1 (en) * 2000-02-17 2010-09-28 Semilab Felvezetoe Fiz Lab Rt Surface passivation method and arrangement for measuring life time of minority carrier of semiconductors
JP4476462B2 (ja) * 2000-03-27 2010-06-09 株式会社栃木ニコン 半導体の電気特性評価装置
JP4022474B2 (ja) * 2001-05-03 2007-12-19 リーハイトン エレクトロニクス インコーポレイテツド シート材料の非破壊的測定およびマッピングのための方法および装置
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JP5814558B2 (ja) 2010-06-30 2015-11-17 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法
JP5350345B2 (ja) 2010-09-22 2013-11-27 株式会社神戸製鋼所 薄膜半導体の結晶性評価装置および方法
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JP6204036B2 (ja) 2012-03-16 2017-09-27 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法
JP6152348B2 (ja) 2013-01-11 2017-06-21 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法及び酸化物半導体薄膜の品質管理方法

Also Published As

Publication number Publication date
KR101647618B1 (ko) 2016-08-10
KR20160052742A (ko) 2016-05-12
TWI569003B (zh) 2017-02-01
JP2015130477A (ja) 2015-07-16
EP3079165A4 (en) 2017-07-26
CN105659372A (zh) 2016-06-08
JP5798669B2 (ja) 2015-10-21
TW201534892A (zh) 2015-09-16
WO2015083666A1 (ja) 2015-06-11
EP3079165A1 (en) 2016-10-12
US20160282284A1 (en) 2016-09-29
EP3079165B1 (en) 2019-07-03
US9816944B2 (en) 2017-11-14

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