HUE042046T2 - Eljárás és rendszer lapkákban lévõ mikrorepedések detektálására - Google Patents

Eljárás és rendszer lapkákban lévõ mikrorepedések detektálására

Info

Publication number
HUE042046T2
HUE042046T2 HUE09803217A HUE042046T2 HU E042046 T2 HUE042046 T2 HU E042046T2 HU E09803217 A HUE09803217 A HU E09803217A HU E042046 T2 HUE042046 T2 HU E042046T2
Authority
HU
Hungary
Prior art keywords
wafers
cracks
detecting micro
micro
detecting
Prior art date
Application number
Other languages
English (en)
Inventor
Sok Leng Chan
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of HUE042046T2 publication Critical patent/HUE042046T2/hu

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9505Wafer internal defects, e.g. microcracks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
HUE09803217 2008-07-28 2009-05-14 Eljárás és rendszer lapkákban lévõ mikrorepedések detektálására HUE042046T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200805811-7A SG158782A1 (en) 2008-07-28 2008-07-28 Method and system for detecting micro-cracks in wafers

Publications (1)

Publication Number Publication Date
HUE042046T2 true HUE042046T2 (hu) 2019-10-28

Family

ID=41610587

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE09803217 HUE042046T2 (hu) 2008-07-28 2009-05-14 Eljárás és rendszer lapkákban lévõ mikrorepedések detektálására

Country Status (10)

Country Link
US (1) US9651502B2 (hu)
EP (1) EP2316127B8 (hu)
JP (1) JP5500414B2 (hu)
KR (1) KR101584386B1 (hu)
CN (1) CN102105972B (hu)
HU (1) HUE042046T2 (hu)
MY (1) MY153553A (hu)
SG (1) SG158782A1 (hu)
TW (1) TWI476399B (hu)
WO (1) WO2010014041A1 (hu)

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JP5243785B2 (ja) * 2007-12-28 2013-07-24 日清紡ホールディングス株式会社 太陽電池検査装置及び太陽電池欠陥判定方法
SG158787A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Apparatus for detecting micro-cracks in wafers and method therefor
US20100309309A1 (en) * 2009-06-05 2010-12-09 Shenzhen Siweier Detecting Technology Ltd. Method for precisely detecting crack width
US9735036B2 (en) * 2011-08-19 2017-08-15 Cognex Corporation System and method for aligning a wafer for fabrication
US9136185B2 (en) * 2011-12-19 2015-09-15 MEMC Singapore Pte., Ltd. Methods and systems for grain size evaluation of multi-cystalline solar wafers
US11629951B2 (en) * 2013-07-09 2023-04-18 Auburn University Determining geometric characteristics of reflective surfaces and transparent materials
JP6280365B2 (ja) * 2013-12-27 2018-02-14 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工溝検出方法および加工溝検出装置
WO2016103007A1 (fr) * 2014-12-24 2016-06-30 Arcelormittal Procédé de contrôle d'un support comprenant un substrat métallique, un revêtement diélectrique, et une couche conductrice
US10018565B2 (en) * 2015-05-04 2018-07-10 Semilab Semiconductor Physics Laboratory Co., Ltd. Micro photoluminescence imaging with optical filtering
DE112016006424T5 (de) * 2016-03-16 2018-11-15 Hitachi High-Technologies Corporation Defektinspektionsverfahren und Defektinspektionsvorrichtung
US10692204B2 (en) * 2016-08-01 2020-06-23 The Boeing Company System and method for high speed surface and subsurface FOD and defect detection
WO2018048843A1 (en) * 2016-09-08 2018-03-15 Corning Incorporated Optical inspection systems and methods for detecting surface defects in a transparent sheet
CN106530287A (zh) * 2016-10-24 2017-03-22 武汉新芯集成电路制造有限公司 一种基于晶圆内部缺陷检测的图像自动识别系统
JP6802085B2 (ja) * 2017-02-21 2020-12-16 株式会社ディスコ ウエーハの加工方法
TWI670469B (zh) * 2018-08-24 2019-09-01 超能高新材料股份有限公司 一種晶體品質判定方法

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JP3314440B2 (ja) 1993-02-26 2002-08-12 株式会社日立製作所 欠陥検査装置およびその方法
US20020054291A1 (en) * 1997-06-27 2002-05-09 Tsai Bin-Ming Benjamin Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources
US6088470A (en) * 1998-01-27 2000-07-11 Sensar, Inc. Method and apparatus for removal of bright or dark spots by the fusion of multiple images
US7061601B2 (en) * 1999-07-02 2006-06-13 Kla-Tencor Technologies Corporation System and method for double sided optical inspection of thin film disks or wafers
US6891570B2 (en) * 2001-01-31 2005-05-10 Itt Manufacturing Enterprises Inc. Method and adaptively deriving exposure time and frame rate from image motion
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US6768543B1 (en) * 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
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US7851722B2 (en) 2006-06-15 2010-12-14 Satake Corporation Optical cracked-grain selector
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JP4065893B1 (ja) * 2006-12-04 2008-03-26 東京エレクトロン株式会社 欠陥検出装置、欠陥検出方法、情報処理装置、情報処理方法及びそのプログラム
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EP2006804A1 (en) 2007-06-22 2008-12-24 Siemens Aktiengesellschaft Method for optical inspection of a matt surface and apparatus for applying this method
SG158787A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Apparatus for detecting micro-cracks in wafers and method therefor

Also Published As

Publication number Publication date
WO2010014041A1 (en) 2010-02-04
EP2316127A1 (en) 2011-05-04
US9651502B2 (en) 2017-05-16
CN102105972A (zh) 2011-06-22
EP2316127B8 (en) 2018-10-31
JP5500414B2 (ja) 2014-05-21
TWI476399B (zh) 2015-03-11
MY153553A (en) 2015-02-27
US20100220186A1 (en) 2010-09-02
SG158782A1 (en) 2010-02-26
TW201005283A (en) 2010-02-01
KR20110058742A (ko) 2011-06-01
KR101584386B1 (ko) 2016-01-13
EP2316127A4 (en) 2013-12-04
EP2316127B1 (en) 2018-08-29
JP2010034524A (ja) 2010-02-12
CN102105972B (zh) 2012-10-03

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