HRP20171205T1 - Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak - Google Patents

Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak Download PDF

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Publication number
HRP20171205T1
HRP20171205T1 HRP20171205TT HRP20171205T HRP20171205T1 HR P20171205 T1 HRP20171205 T1 HR P20171205T1 HR P20171205T T HRP20171205T T HR P20171205TT HR P20171205 T HRP20171205 T HR P20171205T HR P20171205 T1 HRP20171205 T1 HR P20171205T1
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HR
Croatia
Prior art keywords
heat
sas
pump according
spreader
construction
Prior art date
Application number
HRP20171205TT
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English (en)
Inventor
Mattias K-O Olsson
Abhishek Yadav
Devon Newman
Original Assignee
Phononic Devices, Inc.
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Publication date
Application filed by Phononic Devices, Inc. filed Critical Phononic Devices, Inc.
Publication of HRP20171205T1 publication Critical patent/HRP20171205T1/hr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Electromechanical Clocks (AREA)

Claims (15)

1. Toplinska pumpa (120, 152, 182), naznačena time, da obuhvaća kako slijedi: konstrukciju koja opkoljava i drži razmak (SAS-konstrukciju) (122, 154, 184) koja obuhvaća zid koji definira prvu otvorenu stranu (132, 168, 196) i drugu otvorenu stranu (136, 172, 200); međuspojnu ploču (142, 176, 204) uklopljenu unutar SAS-konstrukcije, gdje međuspojna ploča obuhvaća jedan ili više otvora (144) od prve površine međuspojne ploče do druge površine međuspojne ploče, dok jedan ili više otvora definiraju mjesta na međuspojnoj ploči, na kojima se treba montirati veći broj termoelektričnih modula (146, 178, 206); veći broj termoelektričnih modula koji su montirani na međuspojnoj ploči na mjestima koja su definirana s jednim ili više otvora, pri čemu svaki termoelektrični modul od većeg broja termoelektričnih modula, ima prvu stranu i drugu stranu; toplinski raspršivač koji predaje toplinu (vruća strana) (124, 156, 186), te koji je u toplinskom doticaju s prvom stranom od svakog termoelektričnog modula od većeg broja termoelektričnih modula; i toplinski raspršivač koji preuzima toplinu (hladna strana) (130, 166, 194), te koji je u toplinskom doticaju s drugom stranom od svakog termoelektričnog modula od većeg broja termoelektričnih modula; pri čemu rubni dio toplinskog raspršivača koji predaje toplinu, mehanički dotiče zid od SAS-konstrukcije uz prvu otvorenu stranu, a rubni dio toplinskog raspršivača koji preuzima toplinu, mehanički dotiče zid od SAS-konstrukcije uz drugu otvorenu stranu, tako da se tlačna sila koja se primjenjuje na toplinsku pumpu, apsorbira putem SAS-konstrukcije.
2. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća okolišnu brtvu smještenu tamo gdje rubni dio toplinskog raspršivača koji predaje toplinu, mehanički dotiče zid od SAS-konstrukcije i tamo gdje rubni dio toplinskog raspršivača koji preuzima toplinu, mehanički dotiče zid od SAS-konstrukcije.
3. Toplinska pumpa prema zahtjevu 1, naznačena time, da je debljina zida od SAS-konstrukcije takva, da se ublažava toplinski kratki spoj između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, dok se omogućava dovoljna snaga, kako bi se zadržala barem predodređena količina tlačne sile koja se primjenjuje na toplinsku pumpu.
4. Toplinska pumpa prema zahtjevu 1, naznačena time, da visina SAS-konstrukcije definira razmak (150, 180) između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, pri čemu je razmak takav, da se ublažava toplinski kratki spoj između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, dok se ublažava toplinski otpor jednoga ili oba toplinska raspršivača koji predaje toplinu i koji preuzima toplinu.
5. Toplinska pumpa prema zahtjevu 1, naznačena time, da sastavljena površina od drugih strana od većeg broja termoelektričnih modula, iznosi više od 50% površine međuspojne ploče, i poželjno iznosi više od 75% površine međuspojne ploče.
6. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća izolaciju (140) između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, i koja je uklopljena u SAS-konstrukciju.
7. Toplinska pumpa prema zahtjevu 6, naznačena time, da je izolacija ili predoblikovana ili je injektirana.
8. Toplinska pumpa prema zahtjevu 1, naznačena time, da su toplinski raspršivač koji predaje toplinu i toplinski raspršivač koji preuzima toplinu, pričvršćeni na SAS-konstrukciju pomoću mehaničkog pričvršćivača (162).
9. Toplinska pumpa prema zahtjevu 8, naznačena time, da je mehanički pričvršćivač odabran iz skupine koja se sastoji od vijka, klina i zakovice.
10. Toplinska pumpa prema zahtjevu 1, naznačena time, da su toplinski raspršivač koji predaje toplinu i toplinski raspršivač koji preuzima toplinu, pričvršćeni na SAS-konstrukciju pomoću kemijskog pričvrsnog sredstva, gdje je kemijsko pričvrsno sredstvo odabrano iz skupine koja se sastoji od ljepljive tvari, epoksida i akrilnog ljepila.
11. Toplinska pumpa prema zahtjevu 1, naznačena time, da je najmanje jedan od toplinskih raspršivača koji predaju toplinu i toplinskih raspršivača koji preuzimaju toplinu, pričvršćen na SAS-konstrukciju pomoću škljocajnog zapora, pri čemu škljocajni zapor obuhvaća prirubnicu (192) oko rubnog dijela SAS-konstrukcije, što omogućava da najmanje jedan od toplinskih raspršivača koji predaju toplinu i toplinskih raspršivača koji preuzimaju toplinu, bude pričvršćen na SAS-konstrukciju pomoću stezanja.
12. Toplinska pumpa prema zahtjevu 1, naznačena time, da je druga otvorena strana SAS-konstrukcije, manja od toplinskog raspršivača koji preuzima toplinu, dok se toplinski raspršivač koji preuzima toplinu, nalazi unutar SAS-konstrukcije uz drugu otvorenu stranu SAS-konstrukcije.
13. Toplinska pumpa prema zahtjevu 12, naznačena time, da se SAS-konstrukcija sužava, tako da je druga otvorena strana SAS-konstrukcije, manja od prve otvorene strane SAS-konstrukcije.
14. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća jednu ili više žica (160) koje su električno priključene na međuspojnu ploču, i koje su izložene kroz SAS-konstrukciju, te kapicu (126, 158) za zaštitu jedne ili više žica koje su izložene kroz SAS-konstrukciju.
15. Toplinska pumpa prema zahtjevu 1, naznačena time, da međuspojna ploča nadalje obuhvaća jedan ili više električnih konektora koji su izloženi kroz SAS-konstrukciju.
HRP20171205TT 2013-10-28 2017-08-07 Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak HRP20171205T1 (hr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361896287P 2013-10-28 2013-10-28
PCT/US2014/062685 WO2015066049A1 (en) 2013-10-28 2014-10-28 A thermoelectric heat pump with a surround and spacer (sas) structure
EP14799602.9A EP3063798B1 (en) 2013-10-28 2014-10-28 A thermoelectric heat pump with a surround and spacer (sas) structure

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HRP20171205T1 true HRP20171205T1 (hr) 2017-10-06

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US (1) US9144180B2 (hr)
EP (1) EP3063798B1 (hr)
JP (1) JP6494645B2 (hr)
KR (1) KR102292432B1 (hr)
CN (1) CN105874623B (hr)
CY (1) CY1119278T1 (hr)
DK (1) DK3063798T3 (hr)
ES (1) ES2637481T3 (hr)
HR (1) HRP20171205T1 (hr)
HU (1) HUE035836T2 (hr)
LT (1) LT3063798T (hr)
PL (1) PL3063798T3 (hr)
PT (1) PT3063798T (hr)
RS (1) RS56195B1 (hr)
SI (1) SI3063798T1 (hr)
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Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11950726B2 (en) 2010-11-02 2024-04-09 Ember Technologies, Inc. Drinkware container with active temperature control
US9814331B2 (en) 2010-11-02 2017-11-14 Ember Technologies, Inc. Heated or cooled dishware and drinkware
US10010213B2 (en) 2010-11-02 2018-07-03 Ember Technologies, Inc. Heated or cooled dishware and drinkware and food containers
US20130291555A1 (en) * 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2015123585A1 (en) 2014-02-14 2015-08-20 Gentherm Incorporated Conductive convective climate controlled seat
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
USD816198S1 (en) * 2015-01-28 2018-04-24 Phononic, Inc. Thermoelectric heat pump
JP6546414B2 (ja) * 2015-03-06 2019-07-17 株式会社Kelk 熱電発電ユニット
US20200031242A1 (en) * 2015-06-10 2020-01-30 Gentherm Inc. Thermoelectric module with thermal isolation features for vehicle battery
US20180164002A1 (en) * 2015-06-10 2018-06-14 Gentherm Inc. Thermoelectric module with temporarily compressible compression limiter for vehicle battery
JP6527250B2 (ja) * 2015-06-10 2019-06-05 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 低温プレートアセンブリ一体化車両バッテリ熱電素子と熱電素子の組立方法
WO2016200904A1 (en) * 2015-06-10 2016-12-15 Gentherm Inc. Vehicle battery thermoelectric module with improved heat transfer and thermal isolation features
ES2948113T3 (es) 2016-06-20 2023-08-31 Phononic Inc Un sistema de control de microclima
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
WO2018067799A1 (en) * 2016-10-07 2018-04-12 Marlow Industries, Inc. Variable band for thermoelectric modules
DE102016014686B4 (de) * 2016-12-12 2018-08-02 Gentherm Gmbh Thermoelektrische Einrichtung, Verfahren zu seiner Herstellung, Getränkehalter für ein Fahrzeug sowie Temperier-Vorrichtung für Sitze
USD833588S1 (en) * 2017-10-11 2018-11-13 Phononic, Inc. Thermoelectric heat pump
CN112136012A (zh) 2018-04-19 2020-12-25 恩伯技术公司 具有主动温度控制的便携式冷却器
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
KR20210095206A (ko) 2018-11-30 2021-07-30 젠썸 인코포레이티드 열전 공조 시스템 및 방법
CA3125017A1 (en) 2019-01-11 2020-07-16 Ember Technologies, Inc. Portable cooler with active temperature control
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11670813B2 (en) 2019-04-01 2023-06-06 Applied Thermoelectric Solutions, LLC Electrically insulative and thermally conductive parallel battery cooling and temperature control system
US11668508B2 (en) 2019-06-25 2023-06-06 Ember Technologies, Inc. Portable cooler
US11162716B2 (en) 2019-06-25 2021-11-02 Ember Technologies, Inc. Portable cooler
JP2022539116A (ja) 2019-06-25 2022-09-07 エンバー テクノロジーズ， インコーポレイテッド 携帯型クーラー
WO2021134068A1 (en) 2019-12-26 2021-07-01 Phononic, Inc. Thermoelectric refrigerated/frozen product storage and transportation cooler
CN115053101A (zh) 2020-02-04 2022-09-13 弗诺尼克公司 用于在非限制环境中对主动调节空气流和返回空气流进行流体动力学隔离的系统和方法
KR20210154413A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 발전장치
JP2023530321A (ja) * 2020-06-15 2023-07-14 エルジー イノテック カンパニー リミテッド 熱電モジュール及びこれを含む発電装置
US20230255113A1 (en) * 2020-06-18 2023-08-10 Lg Innotek Co., Ltd. Thermoelectric module and power generation device including same
JP2022099385A (ja) * 2020-12-23 2022-07-05 株式会社Kelk 熱電発電装置
CN117751268A (zh) 2021-07-09 2024-03-22 弗诺尼克公司 用于提高效率、简化充注/排放并降低制造成本的高可靠性微通道热管阵列
US20230009192A1 (en) 2021-07-09 2023-01-12 Phononic, Inc. Control scheme for beverage coolers optimized for beverage quality and fast pulldown time
WO2023043948A1 (en) 2021-09-15 2023-03-23 Phononic, Inc. Method for using an intelligent actively cooled tote
US20230194141A1 (en) 2021-12-17 2023-06-22 Phononic, Inc. Countertop freezer

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2497150A (en) 1946-08-23 1950-02-14 Standard Oil Dev Co Process for the control of foaming
FR1310228A (hr) 1961-01-06 1963-03-06
US3196620A (en) 1964-02-10 1965-07-27 Thore M Elfving Thermoelectric cooling system
JP3533826B2 (ja) * 1996-05-29 2004-05-31 アイシン精機株式会社 熱変換装置
JPH10125962A (ja) * 1996-10-22 1998-05-15 Nanba Kikujiro 熱電変換装置
AU8751098A (en) 1997-08-25 1999-03-16 Citizen Watch Co. Ltd. Thermoelectric device
ES2159218B1 (es) 1998-05-14 2002-04-01 Consejo Superior Investigacion Refrigerador domestico con efecto peltier, acumuladores termicos y termosifones evaporativos.
JP2000124510A (ja) * 1998-10-19 2000-04-28 Nissan Motor Co Ltd 電子冷却モジュール
US20040068991A1 (en) * 1999-10-07 2004-04-15 Ben Banney Heat exchanger for an electronic heat pump
CA2305647C (en) 2000-04-20 2006-07-11 Jacques Laliberte Modular thermoelectric unit and cooling system using same
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US6712258B2 (en) 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
AU2003286400A1 (en) * 2002-12-09 2004-06-30 M.T.R.E Advanced Technologies Ltd. Thermoelectric heat pumps
US6804965B2 (en) 2003-02-12 2004-10-19 Applied Integrated Systems, Inc. Heat exchanger for high purity and corrosive fluids
US6880345B1 (en) 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component
US7032389B2 (en) 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US7051536B1 (en) * 2004-11-12 2006-05-30 Bio-Rad Laboratories, Inc. Thermal cycler with protection from atmospheric moisture
US7703291B2 (en) * 2005-04-15 2010-04-27 March Networks Corporation Contained environmental control system for mobile event data recorder
US7861538B2 (en) 2006-07-26 2011-01-04 The Aerospace Corporation Thermoelectric-based refrigerator apparatuses
US20080098750A1 (en) 2006-10-27 2008-05-01 Busier Mark J Thermoelectric cooling/heating device
US8209989B2 (en) 2007-03-30 2012-07-03 Intel Corporation Microarchitecture control for thermoelectric cooling
WO2008148042A2 (en) 2007-05-25 2008-12-04 Bsst Llc System and method for distributed thermoelectric heating and colling
US8216871B2 (en) 2009-10-05 2012-07-10 The Board Of Regents Of The University Of Oklahoma Method for thin film thermoelectric module fabrication
WO2011127416A2 (en) * 2010-04-09 2011-10-13 Arnold Anthony P Improved mechanical support for a thin-film thermoelectric cooling device
JP2012156227A (ja) * 2011-01-25 2012-08-16 National Institute Of Advanced Industrial & Technology 熱電発電モジュールのケーシング及びその製造方法
US8649179B2 (en) * 2011-02-05 2014-02-11 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules
JP5488510B2 (ja) 2011-03-25 2014-05-14 株式会社豊田自動織機 熱電変換ユニット
DE102011075661A1 (de) 2011-03-29 2012-10-04 Micropelt Gmbh Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung
JP2013077810A (ja) * 2011-09-12 2013-04-25 Yamaha Corp 熱電装置
US8997502B2 (en) * 2012-03-01 2015-04-07 Marlow Industries, Inc. Thermoelectric assembly for improved airflow
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US8893513B2 (en) * 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module

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WO2015066049A1 (en) 2015-05-07
KR102292432B1 (ko) 2021-08-20
US9144180B2 (en) 2015-09-22
JP2017502527A (ja) 2017-01-19
JP6494645B2 (ja) 2019-04-03
ES2637481T3 (es) 2017-10-13
HUE035836T2 (en) 2018-05-28
EP3063798A1 (en) 2016-09-07
CY1119278T1 (el) 2018-02-14
PT3063798T (pt) 2017-08-01
CN105874623B (zh) 2019-01-29
KR20160077078A (ko) 2016-07-01
LT3063798T (lt) 2017-08-25
SI3063798T1 (sl) 2017-10-30
US20150116943A1 (en) 2015-04-30
DK3063798T3 (en) 2017-08-28
PL3063798T3 (pl) 2017-11-30
EP3063798B1 (en) 2017-07-05

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