PL3063798T3 - Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS) - Google Patents
Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS)Info
- Publication number
- PL3063798T3 PL3063798T3 PL14799602T PL14799602T PL3063798T3 PL 3063798 T3 PL3063798 T3 PL 3063798T3 PL 14799602 T PL14799602 T PL 14799602T PL 14799602 T PL14799602 T PL 14799602T PL 3063798 T3 PL3063798 T3 PL 3063798T3
- Authority
- PL
- Poland
- Prior art keywords
- sas
- spacer
- surround
- heat pump
- thermoelectric heat
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Electromechanical Clocks (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361896287P | 2013-10-28 | 2013-10-28 | |
EP14799602.9A EP3063798B1 (en) | 2013-10-28 | 2014-10-28 | A thermoelectric heat pump with a surround and spacer (sas) structure |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3063798T3 true PL3063798T3 (pl) | 2017-11-30 |
Family
ID=51904250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL14799602T PL3063798T3 (pl) | 2013-10-28 | 2014-10-28 | Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS) |
Country Status (16)
Country | Link |
---|---|
US (1) | US9144180B2 (pl) |
EP (1) | EP3063798B1 (pl) |
JP (1) | JP6494645B2 (pl) |
KR (1) | KR102292432B1 (pl) |
CN (1) | CN105874623B (pl) |
CY (1) | CY1119278T1 (pl) |
DK (1) | DK3063798T3 (pl) |
ES (1) | ES2637481T3 (pl) |
HR (1) | HRP20171205T1 (pl) |
HU (1) | HUE035836T2 (pl) |
LT (1) | LT3063798T (pl) |
PL (1) | PL3063798T3 (pl) |
PT (1) | PT3063798T (pl) |
RS (1) | RS56195B1 (pl) |
SI (1) | SI3063798T1 (pl) |
WO (1) | WO2015066049A1 (pl) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10010213B2 (en) | 2010-11-02 | 2018-07-03 | Ember Technologies, Inc. | Heated or cooled dishware and drinkware and food containers |
US9814331B2 (en) | 2010-11-02 | 2017-11-14 | Ember Technologies, Inc. | Heated or cooled dishware and drinkware |
US11950726B2 (en) | 2010-11-02 | 2024-04-09 | Ember Technologies, Inc. | Drinkware container with active temperature control |
US20130291555A1 (en) * | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
KR102252584B1 (ko) | 2014-02-14 | 2021-05-14 | 젠썸 인코포레이티드 | 전도식 대류식 기온 제어 조립체 |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
USD816198S1 (en) * | 2015-01-28 | 2018-04-24 | Phononic, Inc. | Thermoelectric heat pump |
JP6546414B2 (ja) * | 2015-03-06 | 2019-07-17 | 株式会社Kelk | 熱電発電ユニット |
CN107690726A (zh) * | 2015-06-10 | 2018-02-13 | 金瑟姆股份有限公司 | 具有集成冷板组件的车辆电池热电装置及其组装方法 |
KR20180054515A (ko) * | 2015-06-10 | 2018-05-24 | 젠썸 인코포레이티드 | 단열 특징부를 가진 자동차 전지용 열전 모듈 |
US20180164002A1 (en) * | 2015-06-10 | 2018-06-14 | Gentherm Inc. | Thermoelectric module with temporarily compressible compression limiter for vehicle battery |
CN107735638A (zh) * | 2015-06-10 | 2018-02-23 | 金瑟姆股份有限公司 | 具有改进的传热和隔热特征的运载工具电池热电模块 |
ES2948113T3 (es) | 2016-06-20 | 2023-08-31 | Phononic Inc | Un sistema de control de microclima |
US11249522B2 (en) | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
CA3039382C (en) | 2016-10-07 | 2023-10-03 | Marlow Industries, Inc. | Variable band for thermoelectric modules |
DE102016014686B4 (de) * | 2016-12-12 | 2018-08-02 | Gentherm Gmbh | Thermoelektrische Einrichtung, Verfahren zu seiner Herstellung, Getränkehalter für ein Fahrzeug sowie Temperier-Vorrichtung für Sitze |
USD833588S1 (en) * | 2017-10-11 | 2018-11-13 | Phononic, Inc. | Thermoelectric heat pump |
JP2021522462A (ja) | 2018-04-19 | 2021-08-30 | エンバー テクノロジーズ, インコーポレイテッド | アクティブ温度制御を備えた携帯型冷却器 |
US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
KR20210095206A (ko) | 2018-11-30 | 2021-07-30 | 젠썸 인코포레이티드 | 열전 공조 시스템 및 방법 |
EP3906383A2 (en) | 2019-01-11 | 2021-11-10 | Ember Technologies, Inc. | Portable cooler with active temperature control |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
US11670813B2 (en) | 2019-04-01 | 2023-06-06 | Applied Thermoelectric Solutions, LLC | Electrically insulative and thermally conductive parallel battery cooling and temperature control system |
US11162716B2 (en) | 2019-06-25 | 2021-11-02 | Ember Technologies, Inc. | Portable cooler |
CA3143365A1 (en) | 2019-06-25 | 2020-12-30 | Ember Technologies, Inc. | Portable cooler |
US11668508B2 (en) | 2019-06-25 | 2023-06-06 | Ember Technologies, Inc. | Portable cooler |
JP2023508480A (ja) | 2019-12-26 | 2023-03-02 | フォノニック インコーポレイテッド | 熱電冷蔵/冷凍製品の貯蔵及び輸送用クーラー |
EP4100683A1 (en) | 2020-02-04 | 2022-12-14 | Phononic, Inc. | Systems and methods for fluid-dynamic isolation of actively conditioned and return air flow in unconstrained environments |
JP2023521040A (ja) | 2020-04-03 | 2023-05-23 | エンバー ライフサイエンシズ, インコーポレイテッド | 能動的温度制御を有する可搬式冷却器 |
KR20210154413A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 발전장치 |
JP2023530321A (ja) * | 2020-06-15 | 2023-07-14 | エルジー イノテック カンパニー リミテッド | 熱電モジュール及びこれを含む発電装置 |
US20230255113A1 (en) * | 2020-06-18 | 2023-08-10 | Lg Innotek Co., Ltd. | Thermoelectric module and power generation device including same |
JP2022099385A (ja) * | 2020-12-23 | 2022-07-05 | 株式会社Kelk | 熱電発電装置 |
EP4367463A1 (en) | 2021-07-09 | 2024-05-15 | Phononic, Inc. | High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture |
EP4367451A1 (en) | 2021-07-09 | 2024-05-15 | Phononic, Inc. | Control scheme for beverage coolers optimized for beverage quality and fast pulldown time |
EP4402624A1 (en) | 2021-09-15 | 2024-07-24 | Phononic, Inc. | Method for using an intelligent actively cooled tote |
US20230194141A1 (en) | 2021-12-17 | 2023-06-22 | Phononic, Inc. | Countertop freezer |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2497150A (en) | 1946-08-23 | 1950-02-14 | Standard Oil Dev Co | Process for the control of foaming |
FR1310228A (pl) | 1961-01-06 | 1963-03-06 | ||
US3196620A (en) | 1964-02-10 | 1965-07-27 | Thore M Elfving | Thermoelectric cooling system |
JP3533826B2 (ja) * | 1996-05-29 | 2004-05-31 | アイシン精機株式会社 | 熱変換装置 |
JPH10125962A (ja) * | 1996-10-22 | 1998-05-15 | Nanba Kikujiro | 熱電変換装置 |
CN1236488A (zh) | 1997-08-25 | 1999-11-24 | 时至准钟表股份有限公司 | 热电装置 |
ES2159218B1 (es) | 1998-05-14 | 2002-04-01 | Consejo Superior Investigacion | Refrigerador domestico con efecto peltier, acumuladores termicos y termosifones evaporativos. |
JP2000124510A (ja) * | 1998-10-19 | 2000-04-28 | Nissan Motor Co Ltd | 電子冷却モジュール |
US20040068991A1 (en) * | 1999-10-07 | 2004-04-15 | Ben Banney | Heat exchanger for an electronic heat pump |
CA2305647C (en) | 2000-04-20 | 2006-07-11 | Jacques Laliberte | Modular thermoelectric unit and cooling system using same |
US6345507B1 (en) * | 2000-09-29 | 2002-02-12 | Electrografics International Corporation | Compact thermoelectric cooling system |
US6712258B2 (en) | 2001-12-13 | 2004-03-30 | International Business Machines Corporation | Integrated quantum cold point coolers |
WO2004054007A2 (en) * | 2002-12-09 | 2004-06-24 | M.T.R.E Advanced Technologies Ltd. | Thermoelectric heat pumps |
US6804965B2 (en) | 2003-02-12 | 2004-10-19 | Applied Integrated Systems, Inc. | Heat exchanger for high purity and corrosive fluids |
US6880345B1 (en) | 2003-11-04 | 2005-04-19 | Intel Corporation | Cooling system for an electronic component |
US7032389B2 (en) | 2003-12-12 | 2006-04-25 | Thermoelectric Design, Llc | Thermoelectric heat pump with direct cold sink support |
US7051536B1 (en) * | 2004-11-12 | 2006-05-30 | Bio-Rad Laboratories, Inc. | Thermal cycler with protection from atmospheric moisture |
US7703291B2 (en) * | 2005-04-15 | 2010-04-27 | March Networks Corporation | Contained environmental control system for mobile event data recorder |
US7861538B2 (en) | 2006-07-26 | 2011-01-04 | The Aerospace Corporation | Thermoelectric-based refrigerator apparatuses |
US20080098750A1 (en) | 2006-10-27 | 2008-05-01 | Busier Mark J | Thermoelectric cooling/heating device |
US8209989B2 (en) | 2007-03-30 | 2012-07-03 | Intel Corporation | Microarchitecture control for thermoelectric cooling |
WO2008148042A2 (en) | 2007-05-25 | 2008-12-04 | Bsst Llc | System and method for distributed thermoelectric heating and colling |
WO2011044115A2 (en) | 2009-10-05 | 2011-04-14 | Board Of Regents Of The University Of Oklahoma | Method for thin film thermoelectric module fabrication |
WO2011127416A2 (en) | 2010-04-09 | 2011-10-13 | Arnold Anthony P | Improved mechanical support for a thin-film thermoelectric cooling device |
JP2012156227A (ja) * | 2011-01-25 | 2012-08-16 | National Institute Of Advanced Industrial & Technology | 熱電発電モジュールのケーシング及びその製造方法 |
US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
JP5488510B2 (ja) * | 2011-03-25 | 2014-05-14 | 株式会社豊田自動織機 | 熱電変換ユニット |
DE102011075661A1 (de) | 2011-03-29 | 2012-10-04 | Micropelt Gmbh | Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung |
JP2013077810A (ja) * | 2011-09-12 | 2013-04-25 | Yamaha Corp | 熱電装置 |
US8997502B2 (en) * | 2012-03-01 | 2015-04-07 | Marlow Industries, Inc. | Thermoelectric assembly for improved airflow |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
WO2013169774A2 (en) * | 2012-05-07 | 2013-11-14 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US9437518B2 (en) * | 2012-10-29 | 2016-09-06 | Samsung Electronics Co., Ltd. | Semiconductor module |
-
2014
- 2014-10-28 CN CN201480059279.9A patent/CN105874623B/zh active Active
- 2014-10-28 EP EP14799602.9A patent/EP3063798B1/en active Active
- 2014-10-28 KR KR1020167011283A patent/KR102292432B1/ko active IP Right Grant
- 2014-10-28 WO PCT/US2014/062685 patent/WO2015066049A1/en active Application Filing
- 2014-10-28 PL PL14799602T patent/PL3063798T3/pl unknown
- 2014-10-28 ES ES14799602.9T patent/ES2637481T3/es active Active
- 2014-10-28 HU HUE14799602A patent/HUE035836T2/en unknown
- 2014-10-28 LT LTEP14799602.9T patent/LT3063798T/lt unknown
- 2014-10-28 RS RS20170835A patent/RS56195B1/sr unknown
- 2014-10-28 JP JP2016550688A patent/JP6494645B2/ja active Active
- 2014-10-28 SI SI201430351T patent/SI3063798T1/sl unknown
- 2014-10-28 US US14/525,843 patent/US9144180B2/en active Active
- 2014-10-28 PT PT147996029T patent/PT3063798T/pt unknown
- 2014-10-28 DK DK14799602.9T patent/DK3063798T3/en active
-
2017
- 2017-08-07 HR HRP20171205TT patent/HRP20171205T1/hr unknown
- 2017-09-01 CY CY20171100929T patent/CY1119278T1/el unknown
Also Published As
Publication number | Publication date |
---|---|
US9144180B2 (en) | 2015-09-22 |
PT3063798T (pt) | 2017-08-01 |
HUE035836T2 (en) | 2018-05-28 |
CN105874623A (zh) | 2016-08-17 |
SI3063798T1 (sl) | 2017-10-30 |
RS56195B1 (sr) | 2017-11-30 |
JP2017502527A (ja) | 2017-01-19 |
HRP20171205T1 (hr) | 2017-10-06 |
JP6494645B2 (ja) | 2019-04-03 |
DK3063798T3 (en) | 2017-08-28 |
WO2015066049A1 (en) | 2015-05-07 |
ES2637481T3 (es) | 2017-10-13 |
CY1119278T1 (el) | 2018-02-14 |
EP3063798A1 (en) | 2016-09-07 |
EP3063798B1 (en) | 2017-07-05 |
US20150116943A1 (en) | 2015-04-30 |
KR20160077078A (ko) | 2016-07-01 |
KR102292432B1 (ko) | 2021-08-20 |
LT3063798T (lt) | 2017-08-25 |
CN105874623B (zh) | 2019-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RS56195B1 (sr) | Termoelektrična toplotna pumpa sa konstrukcijom omotača i odstojnika (sas) | |
HK1222425A1 (zh) | 部件的接合構造以及具有該部件的接合構造的組裝構造物 | |
EP3011179A4 (en) | ARRANGEMENT WITH BEARINGS AND SPACER HOLDER | |
BR302014001231S1 (pt) | Configuração aplicada em torradeira. | |
BR302013002320S1 (pt) | Configuração aplicada em computador tipo tablet | |
EP2998301A4 (en) | ORGANIC CONNECTION, ORGANIC OPTOELECTRONIC COMPONENT AND DISPLAY DEVICE | |
EP3029395A4 (en) | Heat pump device | |
PL2956422T5 (pl) | Oszklenie przeciwsłoneczne | |
BR302013005760S1 (pt) | Configuração aplicada em computador tablet | |
GB201317148D0 (en) | Computer game with physics element | |
PL2827185T3 (pl) | Urządzenie wyświetlacza z czujnikami fotoelektrycznymi podczerwieni | |
EP3006848A4 (en) | Heat pump device | |
BR302013005762S1 (pt) | Configuração aplicada em computador tablet | |
EP2974046A4 (en) | PORTABLE DEVICE WITH TEMPERATURE MEASUREMENT | |
PL3011187T3 (pl) | Pompa z urządzeniem grzewczym | |
EP3009767A4 (en) | Heat pump device | |
PT3301238T (pt) | Elemento de perfil com lábio e linguetas e espaçador associado | |
PL2816302T3 (pl) | Urządzenie chłodnicze ze wspornikiem dystansowym | |
GB201312188D0 (en) | Heat Pump | |
EP3012542A4 (en) | HEAT PUMP DEVICE | |
DE112014002244A5 (de) | Infusionslösung | |
TWM476314U (en) | Touch-control structure and its manufacturing device | |
PL2823732T3 (pl) | System meblowy z elementem meblowym | |
GB201511443D0 (en) | Rugged Scintillation crystal assembly | |
HK1189448A2 (en) | Sucker structure |