HK74389A - Bath for the galvanic deposition of gold alloys - Google Patents

Bath for the galvanic deposition of gold alloys

Info

Publication number
HK74389A
HK74389A HK743/89A HK74389A HK74389A HK 74389 A HK74389 A HK 74389A HK 743/89 A HK743/89 A HK 743/89A HK 74389 A HK74389 A HK 74389A HK 74389 A HK74389 A HK 74389A
Authority
HK
Hong Kong
Prior art keywords
bath
galvanic deposition
gold alloys
alloys
gold
Prior art date
Application number
HK743/89A
Other languages
English (en)
Inventor
Manfred Dr Dettke
Rudolf Klein
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of HK74389A publication Critical patent/HK74389A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cosmetics (AREA)
HK743/89A 1983-05-27 1989-09-14 Bath for the galvanic deposition of gold alloys HK74389A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833319772 DE3319772A1 (de) 1983-05-27 1983-05-27 Bad fuer die galvanische abscheidung von goldlegierungen

Publications (1)

Publication Number Publication Date
HK74389A true HK74389A (en) 1989-09-22

Family

ID=6200354

Family Applications (1)

Application Number Title Priority Date Filing Date
HK743/89A HK74389A (en) 1983-05-27 1989-09-14 Bath for the galvanic deposition of gold alloys

Country Status (8)

Country Link
US (1) US4517060A (xx)
EP (1) EP0126921B1 (xx)
JP (1) JPS59232289A (xx)
AT (1) AT383148B (xx)
DE (2) DE3319772A1 (xx)
ES (1) ES532837A0 (xx)
HK (1) HK74389A (xx)
IE (1) IE56353B1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8903818D0 (en) * 1989-02-20 1989-04-05 Engelhard Corp Electrolytic deposition of gold-containing alloys
DE3905705A1 (de) * 1989-02-24 1990-08-30 Degussa Bad zur galvanischen abscheidung von feingoldueberzuegen
GB2309032A (en) * 1996-01-11 1997-07-16 Procter & Gamble Bismuth salts and complexes with nitrogen-free organic diphosphonic acids
DE10110743A1 (de) * 2001-02-28 2002-09-05 Wieland Dental & Technik Gmbh Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
SG127854A1 (en) 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
US20090104463A1 (en) 2006-06-02 2009-04-23 Rohm And Haas Electronic Materials Llc Gold alloy electrolytes
DE112021008234T5 (de) 2021-09-16 2024-07-11 P & S, Galvasols Hochgeschwindigkeits-elektroformungs- /elektroplattierungsbad für reines gold

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494284A (fr) * 1968-11-28 1970-07-31 Sel Rex Corp Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé
FR2053770A5 (en) * 1969-07-17 1971-04-16 Radiotechnique Compelec Electrolytic deposition of gold-bismuth - alloys
CH615464A5 (en) * 1976-06-01 1980-01-31 Systemes Traitements Surfaces Special compositions and particular additives for gold electrolysis baths and their use
US4199416A (en) * 1977-05-03 1980-04-22 Johnson, Matthey & Co., Limited Composition for the electroplating of gold
JPS5951058B2 (ja) * 1977-07-20 1984-12-12 松下電器産業株式会社 磁気記録再生装置
FR2405312A1 (fr) * 1977-10-10 1979-05-04 Oxy Metal Industries Corp Bains electrolytiques pour le depot d'alliages d'or
JPS609117B2 (ja) * 1980-06-19 1985-03-07 セイコーエプソン株式会社 金合金メッキ浴

Also Published As

Publication number Publication date
US4517060A (en) 1985-05-14
IE56353B1 (en) 1991-07-03
AT383148B (de) 1987-05-25
EP0126921B1 (de) 1989-01-18
ES8502741A1 (es) 1985-02-01
ATA168784A (de) 1986-10-15
DE3476225D1 (en) 1989-02-23
DE3319772C2 (xx) 1991-05-16
ES532837A0 (es) 1985-02-01
JPH0565598B2 (xx) 1993-09-20
DE3319772A1 (de) 1984-11-29
IE841268L (en) 1984-11-27
EP0126921A2 (de) 1984-12-05
JPS59232289A (ja) 1984-12-27
EP0126921A3 (en) 1985-01-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)