HK59796A - High density memory cell and process for manufacturing - Google Patents

High density memory cell and process for manufacturing

Info

Publication number
HK59796A
HK59796A HK59796A HK59796A HK59796A HK 59796 A HK59796 A HK 59796A HK 59796 A HK59796 A HK 59796A HK 59796 A HK59796 A HK 59796A HK 59796 A HK59796 A HK 59796A
Authority
HK
Hong Kong
Prior art keywords
memory cell
trench
manufacturing
density memory
high density
Prior art date
Application number
HK59796A
Other languages
English (en)
Inventor
Lothar Dr Dipl-Phys Risch
Reinhard Dr Ing-Dipl- Tielert
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of HK59796A publication Critical patent/HK59796A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0387—Making the trench
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48—Data lines or contacts therefor
    • H10B12/482—Bit lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Seeds, Soups, And Other Foods (AREA)
  • Holo Graphy (AREA)
HK59796A 1987-07-10 1996-04-03 High density memory cell and process for manufacturing HK59796A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3722939 1987-07-10

Publications (1)

Publication Number Publication Date
HK59796A true HK59796A (en) 1996-04-12

Family

ID=6331369

Family Applications (1)

Application Number Title Priority Date Filing Date
HK59796A HK59796A (en) 1987-07-10 1996-04-03 High density memory cell and process for manufacturing

Country Status (7)

Country Link
US (1) US4905193A (xx)
EP (1) EP0298251B1 (xx)
JP (1) JPS6436062A (xx)
KR (1) KR890002884A (xx)
AT (1) ATE110189T1 (xx)
DE (1) DE3851102D1 (xx)
HK (1) HK59796A (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3324832B2 (ja) * 1993-07-28 2002-09-17 三菱電機株式会社 半導体装置およびその製造方法
US7488647B1 (en) * 2005-08-11 2009-02-10 National Semiconductor Corporation System and method for providing a poly cap and a no field oxide area to prevent formation of a vertical bird's beak structure in the manufacture of a semiconductor device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154256A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS59161860A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 半導体メモリ装置
JPS60152058A (ja) * 1984-01-20 1985-08-10 Toshiba Corp 半導体記憶装置
JPS60189964A (ja) * 1984-03-12 1985-09-27 Hitachi Ltd 半導体メモリ
US4658283A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Semiconductor integrated circuit device having a carrier trapping trench arrangement
JPS6156444A (ja) * 1984-08-28 1986-03-22 Toshiba Corp 半導体装置
JPS6167954A (ja) * 1984-09-11 1986-04-08 Fujitsu Ltd 半導体記憶装置とその製造方法
JPS61135151A (ja) * 1984-12-05 1986-06-23 Mitsubishi Electric Corp 半導体記憶装置
JPS6223153A (ja) * 1985-07-23 1987-01-31 Mitsubishi Electric Corp 半導体記憶装置
US4774556A (en) * 1985-07-25 1988-09-27 Nippondenso Co., Ltd. Non-volatile semiconductor memory device
US4751558A (en) * 1985-10-31 1988-06-14 International Business Machines Corporation High density memory with field shield
JPS62120070A (ja) * 1985-11-20 1987-06-01 Toshiba Corp 半導体記憶装置
JPS62120067A (ja) * 1985-11-20 1987-06-01 Fujitsu Ltd ダイナミツクランダムアクセスメモリセル
JPS62136069A (ja) * 1985-12-10 1987-06-19 Hitachi Ltd 半導体装置およびその製造方法
JPH0746700B2 (ja) * 1986-02-18 1995-05-17 松下電子工業株式会社 １トランジスタ型ｄｒａｍ装置
US4801989A (en) * 1986-02-20 1989-01-31 Fujitsu Limited Dynamic random access memory having trench capacitor with polysilicon lined lower electrode
US4761385A (en) * 1987-02-10 1988-08-02 Motorola, Inc. Forming a trench capacitor
JP2759586B2 (ja) * 1992-11-24 1998-05-28 株式会社ツムラ 製袋包装充填機の計量充填装置

Also Published As

Publication number Publication date
ATE110189T1 (de) 1994-09-15
JPS6436062A (en) 1989-02-07
US4905193A (en) 1990-02-27
KR890002884A (ko) 1989-04-11
EP0298251A2 (de) 1989-01-11
EP0298251A3 (en) 1989-07-19
EP0298251B1 (de) 1994-08-17
DE3851102D1 (de) 1994-09-22

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)