HK27394A - Die attach adhesive composition - Google Patents

Die attach adhesive composition

Info

Publication number
HK27394A
HK27394A HK273/94A HK27394A HK27394A HK 27394 A HK27394 A HK 27394A HK 273/94 A HK273/94 A HK 273/94A HK 27394 A HK27394 A HK 27394A HK 27394 A HK27394 A HK 27394A
Authority
HK
Hong Kong
Prior art keywords
adhesive composition
die attach
attach adhesive
metal
composition
Prior art date
Application number
HK273/94A
Other languages
English (en)
Inventor
Sara Trygg Joslin
Christine Mary Rosell
Jerome David Smith
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK27394A publication Critical patent/HK27394A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
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    • H01L2224/29001—Core members of the layer connector
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Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
HK273/94A 1987-11-25 1994-03-24 Die attach adhesive composition HK27394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12262887A 1987-11-25 1987-11-25

Publications (1)

Publication Number Publication Date
HK27394A true HK27394A (en) 1994-03-31

Family

ID=22403829

Family Applications (1)

Application Number Title Priority Date Filing Date
HK273/94A HK27394A (en) 1987-11-25 1994-03-24 Die attach adhesive composition

Country Status (7)

Country Link
EP (1) EP0317694B1 (xx)
JP (1) JP2895063B2 (xx)
KR (1) KR910003851B1 (xx)
CA (1) CA1324859C (xx)
DE (1) DE3882920T2 (xx)
DK (1) DK54988A (xx)
HK (1) HK27394A (xx)

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US4986849A (en) * 1988-09-23 1991-01-22 Johnson Matthey Inc. Silver-glass pastes
JP2659578B2 (ja) * 1989-02-06 1997-09-30 三菱製紙株式会社 写真用支持体
US4933030A (en) * 1989-06-21 1990-06-12 Dietz Raymond L Low temperature glass composition, paste and method of use
DE4013256C1 (en) * 1990-04-26 1991-10-24 Degussa Ag, 6000 Frankfurt, De Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
EP0558841A1 (en) * 1992-03-04 1993-09-08 CTS Corporation Copper ink for aluminium nitride
DE19531170C1 (de) * 1995-08-24 1996-11-21 Cerdec Ag Elektrostatisch applizierbares Beschichtungspulver, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung keramischer Beschichtungen
DE10150197A1 (de) * 2001-10-12 2003-05-08 Tesa Ag Haftklebemassen mit geringer Klebkraft
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
TW201529655A (zh) * 2013-12-11 2015-08-01 Heraeus Precious Metals North America Conshohocken Llc 用於導電性糊料之含有丙烯酸系樹脂之有機載體
EP3086361A3 (de) * 2015-04-02 2017-01-25 Heraeus Deutschland GmbH & Co. KG Verfahren zum herstellen einer substratanordnung mit einem vorfixiermittel, entsprechende substratanordnung, verfahren zum verbinden eines elektronikbauteils mit einer substratanordnung mit anwendung eines auf dem elektronikbauteil und/oder der substratanordnung aufgebrachten vorfixiermittels und mit einer substratanordnung verbundenes elektronikbauteil
CN105693094B (zh) * 2016-03-24 2019-06-14 福建省南平市三金电子有限公司 一种预烧低熔封接玻璃片及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3350341A (en) * 1964-07-16 1967-10-31 Du Pont Silver compositions containing novel vitreous binders and a vehicle
US3843379A (en) * 1971-03-15 1974-10-22 Owens Illinois Inc Gold powder
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate

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DK54988D0 (da) 1988-02-03
DE3882920D1 (de) 1993-09-09
JP2895063B2 (ja) 1999-05-24
KR910003851B1 (ko) 1991-06-12
DK54988A (da) 1989-05-26
KR890008280A (ko) 1989-07-10
EP0317694B1 (en) 1993-08-04
CA1324859C (en) 1993-11-30
DE3882920T2 (de) 1993-12-23
EP0317694A1 (en) 1989-05-31
JPH02269172A (ja) 1990-11-02

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