DK54988A - Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag - Google Patents
Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlagInfo
- Publication number
- DK54988A DK54988A DK054988A DK54988A DK54988A DK 54988 A DK54988 A DK 54988A DK 054988 A DK054988 A DK 054988A DK 54988 A DK54988 A DK 54988A DK 54988 A DK54988 A DK 54988A
- Authority
- DK
- Denmark
- Prior art keywords
- inorganic
- materials
- integrated circuits
- dielectric surfaces
- binding integrated
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2666/28—Non-macromolecular organic substances
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/156—Material
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Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12262887A | 1987-11-25 | 1987-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK54988D0 DK54988D0 (da) | 1988-02-03 |
DK54988A true DK54988A (da) | 1989-05-26 |
Family
ID=22403829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK054988A DK54988A (da) | 1987-11-25 | 1988-02-03 | Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0317694B1 (da) |
JP (1) | JP2895063B2 (da) |
KR (1) | KR910003851B1 (da) |
CA (1) | CA1324859C (da) |
DE (1) | DE3882920T2 (da) |
DK (1) | DK54988A (da) |
HK (1) | HK27394A (da) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4986849A (en) * | 1988-09-23 | 1991-01-22 | Johnson Matthey Inc. | Silver-glass pastes |
JP2659578B2 (ja) * | 1989-02-06 | 1997-09-30 | 三菱製紙株式会社 | 写真用支持体 |
US4933030A (en) * | 1989-06-21 | 1990-06-12 | Dietz Raymond L | Low temperature glass composition, paste and method of use |
DE4013256C1 (en) * | 1990-04-26 | 1991-10-24 | Degussa Ag, 6000 Frankfurt, De | Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder |
EP0558841A1 (en) * | 1992-03-04 | 1993-09-08 | CTS Corporation | Copper ink for aluminium nitride |
DE19531170C1 (de) * | 1995-08-24 | 1996-11-21 | Cerdec Ag | Elektrostatisch applizierbares Beschichtungspulver, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung keramischer Beschichtungen |
DE10150197A1 (de) * | 2001-10-12 | 2003-05-08 | Tesa Ag | Haftklebemassen mit geringer Klebkraft |
TWI540590B (zh) * | 2011-05-31 | 2016-07-01 | 住友電木股份有限公司 | 半導體裝置 |
TW201529655A (zh) * | 2013-12-11 | 2015-08-01 | Heraeus Precious Metals North America Conshohocken Llc | 用於導電性糊料之含有丙烯酸系樹脂之有機載體 |
EP3276652A3 (de) * | 2015-04-02 | 2018-04-25 | Heraeus Deutschland GmbH & Co. KG | Verfahren zum herstellen einer substratanordnung mit einem klebevorfixiermittel, entsprechende substratanordnung, verfahren zum verbinden eines elektronikbauteils mit einer substratanordnung mit anwendung eines auf dem elektronikbauteil und/oder der substratanordnung aufgebrachten klebevorfixiermittels und mit einer substratanordnung verbundenes elektronikbauteil |
CN105693094B (zh) * | 2016-03-24 | 2019-06-14 | 福建省南平市三金电子有限公司 | 一种预烧低熔封接玻璃片及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3350341A (en) * | 1964-07-16 | 1967-10-31 | Du Pont | Silver compositions containing novel vitreous binders and a vehicle |
US3843379A (en) * | 1971-03-15 | 1974-10-22 | Owens Illinois Inc | Gold powder |
US4459166A (en) * | 1982-03-08 | 1984-07-10 | Johnson Matthey Inc. | Method of bonding an electronic device to a ceramic substrate |
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1988
- 1988-02-03 DK DK054988A patent/DK54988A/da not_active Application Discontinuation
- 1988-02-04 EP EP88101584A patent/EP0317694B1/en not_active Expired - Lifetime
- 1988-02-04 DE DE88101584T patent/DE3882920T2/de not_active Expired - Fee Related
- 1988-02-13 KR KR1019880001451A patent/KR910003851B1/ko not_active IP Right Cessation
- 1988-03-03 CA CA000560444A patent/CA1324859C/en not_active Expired - Fee Related
- 1988-03-11 JP JP63056477A patent/JP2895063B2/ja not_active Expired - Fee Related
-
1994
- 1994-03-24 HK HK273/94A patent/HK27394A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR910003851B1 (ko) | 1991-06-12 |
DK54988D0 (da) | 1988-02-03 |
CA1324859C (en) | 1993-11-30 |
DE3882920T2 (de) | 1993-12-23 |
DE3882920D1 (de) | 1993-09-09 |
EP0317694B1 (en) | 1993-08-04 |
EP0317694A1 (en) | 1989-05-31 |
HK27394A (en) | 1994-03-31 |
JP2895063B2 (ja) | 1999-05-24 |
JPH02269172A (ja) | 1990-11-02 |
KR890008280A (ko) | 1989-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |