HK26097A - Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together - Google Patents
Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded togetherInfo
- Publication number
- HK26097A HK26097A HK26097A HK26097A HK26097A HK 26097 A HK26097 A HK 26097A HK 26097 A HK26097 A HK 26097A HK 26097 A HK26097 A HK 26097A HK 26097 A HK26097 A HK 26097A
- Authority
- HK
- Hong Kong
- Prior art keywords
- wettability
- brazing
- respect
- components
- low
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28685592A JP3212382B2 (ja) | 1992-10-01 | 1992-10-01 | 精密ろう付け方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK26097A true HK26097A (en) | 1997-03-06 |
Family
ID=17709906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK26097A HK26097A (en) | 1992-10-01 | 1997-03-06 | Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together |
Country Status (6)
Country | Link |
---|---|
US (1) | US5402926A (de) |
EP (1) | EP0590989B1 (de) |
JP (1) | JP3212382B2 (de) |
DE (1) | DE69304478T2 (de) |
HK (1) | HK26097A (de) |
SG (1) | SG48712A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3317308B2 (ja) | 1992-08-26 | 2002-08-26 | セイコーエプソン株式会社 | 積層型インクジェット記録ヘッド、及びその製造方法 |
US6601949B1 (en) | 1992-08-26 | 2003-08-05 | Seiko Epson Corporation | Actuator unit for ink jet recording head |
JP3106044B2 (ja) * | 1992-12-04 | 2000-11-06 | 日本碍子株式会社 | アクチュエータ及びそれを用いたインクジェットプリントヘッド |
JP3136455B2 (ja) * | 1993-07-26 | 2001-02-19 | 日本碍子株式会社 | インクジェットプリントヘッドを構成するプレートの接着方法 |
EP1170127B1 (de) | 1993-12-24 | 2005-10-19 | Seiko Epson Corporation | Tintenstrahlaufzeichnungskopf |
EP0661156B1 (de) * | 1993-12-28 | 2000-03-22 | Seiko Epson Corporation | Tintenstrahlaufzeichnungskopf |
US5963234A (en) * | 1995-08-23 | 1999-10-05 | Seiko Epson Corporation | Laminated ink jet recording head having flow path unit with recess that confronts but does not communicate with common ink chamber |
US7052117B2 (en) * | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
DE102004019553A1 (de) * | 2004-04-22 | 2005-11-10 | Linde Ag | Schichtblock mit durch Hochtemperaturlöten verbundenen Segmentblechen |
CN101094770B (zh) | 2004-12-30 | 2010-04-14 | 富士胶卷迪马蒂克斯股份有限公司 | 喷墨打印 |
US8246917B2 (en) * | 2006-06-23 | 2012-08-21 | Johns Hopkins University | Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers and their uses for remote spatially controlled chemical delivery |
US8236259B2 (en) * | 2005-07-22 | 2012-08-07 | Johns Hopkins University | Self-assembled, micropatterned, and radio frequency (RF) shielded biocontainers |
JP5185501B2 (ja) * | 2006-01-06 | 2013-04-17 | 日本碍子株式会社 | ハニカム構造体成形用口金の製造方法 |
US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
DE102007012628B4 (de) * | 2007-03-16 | 2022-03-17 | Bayerische Motoren Werke Aktiengesellschaft | Mehrblechverbindung und Vorrichtung zum Herstellen derselben |
KR20110014013A (ko) * | 2009-08-04 | 2011-02-10 | 삼성전기주식회사 | 잉크젯 헤드 및 잉크젯 헤드의 제조 방법 |
US8803001B2 (en) * | 2011-06-21 | 2014-08-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Bonding area design for transient liquid phase bonding process |
US10058951B2 (en) | 2012-04-17 | 2018-08-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Alloy formation control of transient liquid phase bonding |
US9044822B2 (en) | 2012-04-17 | 2015-06-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | Transient liquid phase bonding process for double sided power modules |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3110102A (en) * | 1958-10-31 | 1963-11-12 | North American Aviation Inc | Method of fusion joining employing stop-off material |
US3330027A (en) * | 1962-12-27 | 1967-07-11 | Gen Electric | Method for making a laminated shunt for electrical measuring instruments |
JPS51107251A (en) * | 1975-03-19 | 1976-09-22 | Oki Electric Ind Co Ltd | Handazuke moshikuha rozukejinoshitajishorihoho |
JPS5251569A (en) * | 1975-10-24 | 1977-04-25 | Hitachi Ltd | Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide |
JPS5352264A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Soldering method |
JPS5426459A (en) * | 1977-07-29 | 1979-02-28 | Matsushita Electric Ind Co Ltd | Method of forming electrode terminals for tip parts |
JPS5944948B2 (ja) * | 1977-12-09 | 1984-11-02 | 株式会社日立製作所 | ろう付け法 |
JPS5758975A (en) * | 1980-09-26 | 1982-04-09 | Citizen Watch Co Ltd | Joining structure of case band of wristwatch made of stainless steel |
JPS5912775A (ja) * | 1982-07-14 | 1984-01-23 | Matsushita Electric Ind Co Ltd | 霧化ポンプユニツト |
JPS59219483A (ja) * | 1984-03-12 | 1984-12-10 | Masami Kobayashi | ステンレス鋼製品に半田性を付与する方法 |
US4603805A (en) * | 1985-05-20 | 1986-08-05 | Motorola, Inc. | Method for enhancing the solderability of nickel layers |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
JPH0217603A (ja) * | 1988-07-06 | 1990-01-22 | Matsushita Electric Ind Co Ltd | チップ部品及びその製造方法 |
US4875619A (en) * | 1988-09-01 | 1989-10-24 | Anderson Jeffrey J | Brazing of ink jet print head components using thin layers of braze material |
US4972989A (en) * | 1989-10-30 | 1990-11-27 | Motorola, Inc. | Through the lead soldering |
-
1992
- 1992-10-01 JP JP28685592A patent/JP3212382B2/ja not_active Expired - Fee Related
-
1993
- 1993-09-28 US US08/127,494 patent/US5402926A/en not_active Expired - Lifetime
- 1993-09-30 SG SG1996000200A patent/SG48712A1/en unknown
- 1993-09-30 EP EP93307786A patent/EP0590989B1/de not_active Expired - Lifetime
- 1993-09-30 DE DE69304478T patent/DE69304478T2/de not_active Expired - Lifetime
-
1997
- 1997-03-06 HK HK26097A patent/HK26097A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG48712A1 (en) | 1998-05-18 |
DE69304478T2 (de) | 1997-02-20 |
DE69304478D1 (de) | 1996-10-10 |
JPH06114550A (ja) | 1994-04-26 |
EP0590989A1 (de) | 1994-04-06 |
EP0590989B1 (de) | 1996-09-04 |
US5402926A (en) | 1995-04-04 |
JP3212382B2 (ja) | 2001-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PE | Patent expired |
Effective date: 20130929 |