JPS5251569A - Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide - Google Patents

Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide

Info

Publication number
JPS5251569A
JPS5251569A JP50127436A JP12743675A JPS5251569A JP S5251569 A JPS5251569 A JP S5251569A JP 50127436 A JP50127436 A JP 50127436A JP 12743675 A JP12743675 A JP 12743675A JP S5251569 A JPS5251569 A JP S5251569A
Authority
JP
Japan
Prior art keywords
polyamide acid
sulfon
dam
preventive
forming solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50127436A
Other languages
Japanese (ja)
Inventor
Tasao Soga
Tomirou Yasuda
Yasuo Miyatera
Mamoru Sawahata
Kouzou Odawara
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50127436A priority Critical patent/JPS5251569A/en
Publication of JPS5251569A publication Critical patent/JPS5251569A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175Flow barriers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/38Effects and problems related to the device integration
    • H01L2924/384Bump effects
    • H01L2924/3841Solder bridging
JP50127436A 1975-10-24 1975-10-24 Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide Pending JPS5251569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50127436A JPS5251569A (en) 1975-10-24 1975-10-24 Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50127436A JPS5251569A (en) 1975-10-24 1975-10-24 Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide

Publications (1)

Publication Number Publication Date
JPS5251569A true JPS5251569A (en) 1977-04-25

Family

ID=14959893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50127436A Pending JPS5251569A (en) 1975-10-24 1975-10-24 Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide

Country Status (1)

Country Link
JP (1) JPS5251569A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371860A (en) * 1979-06-18 1983-02-01 General Electric Company Solderable varistor
JPS6374657A (en) * 1986-09-19 1988-04-05 Hitachi Ltd Thermal head
US5402926A (en) * 1992-10-01 1995-04-04 Ngk Insulators, Ltd. Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371860A (en) * 1979-06-18 1983-02-01 General Electric Company Solderable varistor
JPS6374657A (en) * 1986-09-19 1988-04-05 Hitachi Ltd Thermal head
US5402926A (en) * 1992-10-01 1995-04-04 Ngk Insulators, Ltd. Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates

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