JPS6374657A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS6374657A
JPS6374657A JP21932786A JP21932786A JPS6374657A JP S6374657 A JPS6374657 A JP S6374657A JP 21932786 A JP21932786 A JP 21932786A JP 21932786 A JP21932786 A JP 21932786A JP S6374657 A JPS6374657 A JP S6374657A
Authority
JP
Japan
Prior art keywords
soldering
alloy
pad
peripheral
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21932786A
Other languages
Japanese (ja)
Other versions
JPH068053B2 (en
Inventor
Tsuneaki Kamei
Yoshiharu Mori
Mamoru Morita
Yasunori Narizuka
Hideo Takahashi
Akira Yabushita
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61219327A priority Critical patent/JPH068053B2/en
Publication of JPS6374657A publication Critical patent/JPS6374657A/en
Publication of JPH068053B2 publication Critical patent/JPH068053B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05655—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/36—Material effects
    • H01L2924/365—Metallurgical effects
    • H01L2924/3651—Formation of intermetallics

Abstract

PURPOSE:To improve the workability of soldering, by a method wherein an alloy layer consisting of Ni and Cu is formed to a terminal part or a pad part to be soldered and a layer to prevent soldering from spreading is formed in a dam state to the peripheral part of said soldering position. CONSTITUTION:A wetting area in soldering is controlled by forming a specific shaped dam consisting of heat resisting resin 7 or oxides and nitrides 8 of inorganic-type to the soldering peripheral part of the terminal or pad part for which Ni-Cu alloy material is used, and the simultaneous operations of many soldering joints can also be smoothly executed. Further, its corrosion resistance is improved by Ni-Cu alloy layer and the joint is instantly wetted by using flux in soldering. Besides, since the diffusion speed of 63 Sn/37 Pb solder 4 is about one hundredth of Cu simple substance, and the necessary thickness as a Ni-Cu alloy electrode in execution of solder joint is may be safely settled to be a fraction of that of Cu electrode, accordingly the time to form a film can be extremely shortened. Further, the following photoetching can be processed in a short time and the precision of a pattern is improved.
JP61219327A 1986-09-19 1986-09-19 Thermal head Expired - Lifetime JPH068053B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61219327A JPH068053B2 (en) 1986-09-19 1986-09-19 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61219327A JPH068053B2 (en) 1986-09-19 1986-09-19 Thermal head

Publications (2)

Publication Number Publication Date
JPS6374657A true JPS6374657A (en) 1988-04-05
JPH068053B2 JPH068053B2 (en) 1994-02-02

Family

ID=16733725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61219327A Expired - Lifetime JPH068053B2 (en) 1986-09-19 1986-09-19 Thermal head

Country Status (1)

Country Link
JP (1) JPH068053B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229789A (en) * 1989-12-20 1993-07-20 Hitachi, Ltd. Apparatus for thermal printing
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
CN1090392C (en) * 1996-10-30 2002-09-04 矢崎总业株式会社 Terminal material and terminal
US7190386B2 (en) 2002-10-29 2007-03-13 Rohm Co., Ltd. Thermal print head
CN100436143C (en) * 2004-04-28 2008-11-26 罗姆股份有限公司 Thermal print head

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251569A (en) * 1975-10-24 1977-04-25 Hitachi Ltd Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide
JPS5416388A (en) * 1977-06-10 1979-02-06 Kernforschungsz Karlsruhe Waste water purification method by adsorbent
JPS592329A (en) * 1982-06-29 1984-01-07 Hitachi Ltd Manufacture of substrate of semiconductor integrated circuit
JPS61135146A (en) * 1984-12-06 1986-06-23 Toshiba Corp Semiconductor lead frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251569A (en) * 1975-10-24 1977-04-25 Hitachi Ltd Method of forming solder flow out preventive dam with polyamide acid sulfon or polyamide acid carboxylic amide
JPS5416388A (en) * 1977-06-10 1979-02-06 Kernforschungsz Karlsruhe Waste water purification method by adsorbent
JPS592329A (en) * 1982-06-29 1984-01-07 Hitachi Ltd Manufacture of substrate of semiconductor integrated circuit
JPS61135146A (en) * 1984-12-06 1986-06-23 Toshiba Corp Semiconductor lead frame

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229789A (en) * 1989-12-20 1993-07-20 Hitachi, Ltd. Apparatus for thermal printing
CN1090392C (en) * 1996-10-30 2002-09-04 矢崎总业株式会社 Terminal material and terminal
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US7190386B2 (en) 2002-10-29 2007-03-13 Rohm Co., Ltd. Thermal print head
CN1323845C (en) * 2002-10-29 2007-07-04 罗姆股份有限公司 Thermal print head
CN100436143C (en) * 2004-04-28 2008-11-26 罗姆股份有限公司 Thermal print head

Also Published As

Publication number Publication date
JPH068053B2 (en) 1994-02-02

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