HK195396A - Process for producing molding for precision fine line-circuit - Google Patents

Process for producing molding for precision fine line-circuit

Info

Publication number
HK195396A
HK195396A HK195396A HK195396A HK195396A HK 195396 A HK195396 A HK 195396A HK 195396 A HK195396 A HK 195396A HK 195396 A HK195396 A HK 195396A HK 195396 A HK195396 A HK 195396A
Authority
HK
Hong Kong
Prior art keywords
precision fine
circuit
fine line
producing molding
liquid
Prior art date
Application number
HK195396A
Other languages
English (en)
Inventor
Yoshiharu Suzuki
Tomoyuki Aketa
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of HK195396A publication Critical patent/HK195396A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
HK195396A 1989-07-03 1996-10-24 Process for producing molding for precision fine line-circuit HK195396A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1171368A JPH0724328B2 (ja) 1989-07-03 1989-07-03 精密細線回路用成形品の製造方法

Publications (1)

Publication Number Publication Date
HK195396A true HK195396A (en) 1996-11-01

Family

ID=15921885

Family Applications (1)

Application Number Title Priority Date Filing Date
HK195396A HK195396A (en) 1989-07-03 1996-10-24 Process for producing molding for precision fine line-circuit

Country Status (9)

Country Link
US (1) US5209819A (de)
EP (1) EP0407129B1 (de)
JP (1) JPH0724328B2 (de)
KR (1) KR920007118B1 (de)
AT (1) ATE137906T1 (de)
CA (1) CA2019978A1 (de)
DE (1) DE69026871T2 (de)
HK (1) HK195396A (de)
SG (1) SG44525A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2682688B1 (fr) * 1991-10-22 1994-01-14 Thomson Csf Procede pour la metallisation de la surface de pieces en materiau plastique et pieces a usage electronique ainsi obtenues.
DE4141719C2 (de) * 1991-12-18 2002-12-12 Bayer Ag Metallhaltige Formmassen
US20030018135A1 (en) * 1999-09-23 2003-01-23 Pagilagan Rolando Umali Toughened nylon compositions with improved flow and processes for their preparation
TW539614B (en) * 2000-06-06 2003-07-01 Matsushita Electric Works Ltd Laminate
JP4524958B2 (ja) * 2000-06-06 2010-08-18 パナソニック電工株式会社 成形体
US6611046B2 (en) 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
DE602005022418D1 (de) * 2004-03-10 2010-09-02 Panasonic Elec Works Co Ltd Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür
KR100663266B1 (ko) * 2005-07-11 2007-01-02 삼성전기주식회사 미세 배선의 형성방법 및 도전성 기판
JP5183981B2 (ja) * 2007-06-15 2013-04-17 兵庫県 液晶ポリマー材料からなる物品の表面改質方法および表面被覆方法
WO2011038206A2 (en) * 2009-09-24 2011-03-31 Ceramic Sciences Group, Llc Surface-etched etched alumina/sic mini-whisker composite material and uses thereof
CN102596562A (zh) * 2009-11-11 2012-07-18 宝理塑料株式会社 镀敷树脂成型体、镀敷树脂成型体的制造方法及镀敷树脂成型体和成型电路板
DE102011004801B4 (de) * 2011-02-25 2013-11-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Selektiv beschichtete CFK-Bauteile und Verfahren zu deren Herstellung
KR101310124B1 (ko) * 2012-02-27 2013-09-23 주식회사 동방플랜텍 탄소섬유강화 플라스틱제 금속도금 롤러의 제조방법 및 이에 따른 롤러

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984907A (en) * 1975-07-25 1976-10-12 Rca Corporation Adherence of metal films to polymeric materials
DE3136283C1 (de) * 1981-09-12 1983-02-03 Nukem Gmbh, 6450 Hanau Verfahren zum Metallisieren kohlefaserverstaerkter Kunststoffteile
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
JPS60134067A (ja) * 1983-12-19 1985-07-17 豊田合成株式会社 繊維物
CA1243462A (en) * 1984-12-21 1988-10-25 Peter S. Allan Moulding process
US4615763A (en) * 1985-01-02 1986-10-07 International Business Machines Corporation Roughening surface of a substrate
GB8511905D0 (en) * 1985-05-10 1985-06-19 Akzo Nv Metallizing polymeric materials
US4714631A (en) * 1985-08-28 1987-12-22 W. H. Brady Co. Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
US4826720A (en) * 1985-11-07 1989-05-02 General Electric Company Directly solderable three-dimensional electrically conductive circuit components and process for the preparation thereof
EP0227857B1 (de) * 1985-12-30 1990-03-28 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen
DE3700902A1 (de) * 1986-01-14 1987-07-16 Mitsubishi Gas Chemical Co Verfahren zur herstellung von plastikgeformten, gedruckten schaltplatten
JP2581543B2 (ja) * 1986-07-04 1997-02-12 エビナ電化工業 株式会社 メッキした全芳香族系ポリエステル液晶ポリマ−成形品の製造法
US4871595A (en) * 1986-12-16 1989-10-03 Foster Miller, Inc. Lyotropic liquid crystalline oriented polymer substrate for printed wire board
JPS6461087A (en) * 1987-09-01 1989-03-08 Sumitomo Chemical Co Resin composition for printed wiring board
DE3884546T3 (de) * 1987-10-02 2000-03-23 Polyplastics Co Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz.
JP2513728B2 (ja) * 1987-10-09 1996-07-03 ポリプラスチックス株式会社 液晶性ポリエステル樹脂成形品の表面処理法
JPH01214096A (ja) * 1988-02-22 1989-08-28 Furukawa Electric Co Ltd:The フレキシブルプリント回路基板の製造方法
JPH01268874A (ja) * 1988-04-19 1989-10-26 Asahi Glass Co Ltd 金属メツキの設けられた樹脂成形品およびその製造方法

Also Published As

Publication number Publication date
DE69026871D1 (de) 1996-06-13
ATE137906T1 (de) 1996-05-15
CA2019978A1 (en) 1991-01-03
DE69026871T2 (de) 1996-11-28
JPH0335585A (ja) 1991-02-15
SG44525A1 (en) 1997-12-19
EP0407129B1 (de) 1996-05-08
EP0407129A2 (de) 1991-01-09
KR910002974A (ko) 1991-02-26
JPH0724328B2 (ja) 1995-03-15
US5209819A (en) 1993-05-11
KR920007118B1 (ko) 1992-08-24
EP0407129A3 (en) 1991-09-25

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070702