HK188595A - Integrated circuit electromigration monitor - Google Patents
Integrated circuit electromigration monitorInfo
- Publication number
- HK188595A HK188595A HK188595A HK188595A HK188595A HK 188595 A HK188595 A HK 188595A HK 188595 A HK188595 A HK 188595A HK 188595 A HK188595 A HK 188595A HK 188595 A HK188595 A HK 188595A
- Authority
- HK
- Hong Kong
- Prior art keywords
- electromigration
- monitor
- integrated circuit
- integrated
- circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
- G01R31/2858—Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49746790A | 1990-03-21 | 1990-03-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK188595A true HK188595A (en) | 1995-12-22 |
Family
ID=23977004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK188595A HK188595A (en) | 1990-03-21 | 1995-12-14 | Integrated circuit electromigration monitor |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0448273B1 (ja) |
JP (1) | JPH04223355A (ja) |
DE (1) | DE69104248T2 (ja) |
HK (1) | HK188595A (ja) |
SG (1) | SG30537G (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3611338B2 (ja) * | 1993-06-21 | 2005-01-19 | 財団法人国際科学振興財団 | 電流駆動導電性材料評価方法 |
DE10108915A1 (de) * | 2001-02-23 | 2002-09-12 | Infineon Technologies Ag | Elektromigrations-Teststruktur zur Erfassung einer Zuverlässigkeit von Verdrahtungen |
DE10227829A1 (de) * | 2002-06-21 | 2004-01-15 | Infineon Technologies Ag | Verfahren zum Überwachen der Herstellung und zum Bewerten der Qualität einer Metallisierungsanordnung sowie zugehörige Erfassungsvorrichtung |
DE102006049791A1 (de) * | 2006-10-21 | 2008-04-30 | X-Fab Semiconductor Foundries Ag | Teststruktur für hochbeschleunigte Elektromigrationstests für dicke Metallisierungssysteme von Festkörperschaltkreisen |
FR2964749A1 (fr) * | 2010-09-14 | 2012-03-16 | St Microelectronics Sa | Procede et dispositif de mesure de fiabilite d'un circuit integre |
CN113782516B (zh) * | 2021-08-20 | 2024-04-05 | 长江存储科技有限责任公司 | 电迁移测试结构、系统、存储器、制造方法及测试方法 |
CN114264926A (zh) * | 2021-11-26 | 2022-04-01 | 中国电子科技集团公司第五十八研究所 | 单侧引出电压测试焊盘的单通孔跨层型电迁移测试结构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE32625E (en) * | 1983-01-05 | 1988-03-15 | Syracuse University | Dynamic testing of electrical conductors |
US4739258A (en) * | 1986-07-11 | 1988-04-19 | Syracuse University | Dynamic testing of thin-film conductor |
EP0281553A1 (en) * | 1986-09-17 | 1988-09-14 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Method of manufacturing integrated circuits |
-
1991
- 1991-03-12 SG SG1995903324A patent/SG30537G/en unknown
- 1991-03-12 DE DE69104248T patent/DE69104248T2/de not_active Expired - Fee Related
- 1991-03-12 EP EP91302072A patent/EP0448273B1/en not_active Expired - Lifetime
- 1991-03-20 JP JP3056354A patent/JPH04223355A/ja active Pending
-
1995
- 1995-12-14 HK HK188595A patent/HK188595A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0448273B1 (en) | 1994-09-28 |
EP0448273A1 (en) | 1991-09-25 |
JPH04223355A (ja) | 1992-08-13 |
DE69104248T2 (de) | 1995-01-26 |
SG30537G (en) | 1995-09-01 |
DE69104248D1 (de) | 1994-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |