HK186096A - Fluorination process - Google Patents

Fluorination process

Info

Publication number
HK186096A
HK186096A HK186096A HK186096A HK186096A HK 186096 A HK186096 A HK 186096A HK 186096 A HK186096 A HK 186096A HK 186096 A HK186096 A HK 186096A HK 186096 A HK186096 A HK 186096A
Authority
HK
Hong Kong
Prior art keywords
fluorination process
alpha
hydroxy compound
difluoroalkylamine
reacting
Prior art date
Application number
HK186096A
Other languages
English (en)
Inventor
Doris P Schumacher
Jon E Clark
Bruce L Murphy
Original Assignee
Schering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22921827&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK186096(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schering Corp filed Critical Schering Corp
Publication of HK186096A publication Critical patent/HK186096A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D263/00—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
    • C07D263/02—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings
    • C07D263/04—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D263/00—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
    • C07D263/02—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings
    • C07D263/08—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • C07D263/10—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D263/00—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
    • C07D263/02—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings
    • C07D263/08—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • C07D263/16—Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D263/18—Oxygen atoms
    • C07D263/20—Oxygen atoms attached in position 2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Glass Compositions (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Catalysts (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Liquid Crystal Substances (AREA)
HK186096A 1988-09-14 1996-10-03 Fluorination process HK186096A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/244,210 US4876352A (en) 1988-09-14 1988-09-14 Pressurized fluorination of hydroxy alkyl groups

Publications (1)

Publication Number Publication Date
HK186096A true HK186096A (en) 1996-10-11

Family

ID=22921827

Family Applications (1)

Application Number Title Priority Date Filing Date
HK186096A HK186096A (en) 1988-09-14 1996-10-03 Fluorination process

Country Status (15)

Country Link
US (1) US4876352A (no)
EP (2) EP0434732A1 (no)
JP (1) JPH03502695A (no)
KR (1) KR940003288B1 (no)
AT (1) ATE126514T1 (no)
AU (1) AU631141B2 (no)
DE (1) DE68923839T2 (no)
ES (1) ES2075018T3 (no)
FI (1) FI89914C (no)
GR (1) GR3017921T3 (no)
HK (1) HK186096A (no)
HU (1) HU207057B (no)
LU (1) LU88719I2 (no)
NO (1) NO301007B1 (no)
WO (1) WO1990002739A1 (no)

Families Citing this family (39)

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US5243056A (en) * 1983-06-02 1993-09-07 Zambon S.P.A. Intermediates for the preparation of 1-(phenyl)-1-hydroxy-2-amino-3-fluoro propane derivatives
US5332835A (en) * 1984-02-03 1994-07-26 Zambon S.P.A. Process for fluorinating 1-phenyl-2-amino-1,3-propanediol compounds and new oxazoline compounds useful in this process
US5153328A (en) * 1984-02-03 1992-10-06 Zambon S.P.A. 2 Hydrocarbyl-4 substituted methyl 5 (4 substituted phenyl)-oxazolines
EP0555340B1 (en) * 1990-10-25 1994-12-07 Schering Corporation Process for preparing florfenicol, its analogs and oxazoline intermediates thereto
IT1249048B (it) 1991-02-21 1995-02-11 Zambon Spa Processo per la preparazione di trans-(5r)-2-ossazoline -2,4,5, trisostituite
US5352832A (en) * 1992-12-18 1994-10-04 Schering Corporation Asymmetric process for preparing florfenicol, thiamphenicol chloramphenicol and oxazoline intermediates
DE4437932A1 (de) * 1994-10-24 1996-04-25 Bayer Ag Verfahren zur Herstellung von in einer Seitenkette fluorierten Alkyloxazolen und neue, in einer Seitenkette fluorierte Alkyloxazole
US5663361A (en) * 1996-08-19 1997-09-02 Schering Corporation Process for preparing intermediates to florfenicol
CN1649829A (zh) * 2002-03-08 2005-08-03 先灵-普劳有限公司 新型氟苯尼考类抗生素
US7439268B2 (en) * 2003-07-18 2008-10-21 Idexx Laboratories Compositions containing prodrugs of florfenicol and methods of use
US20050049210A1 (en) * 2003-08-27 2005-03-03 Idexx Laboratories, Inc. Methods for the controlled delivery of pharmacologically active compounds
US7126005B2 (en) 2003-10-06 2006-10-24 Aurobindo Pharma Limited Process for preparing florfenicol
EP1776109B1 (en) * 2004-08-13 2008-12-31 Schering-Plough Ltd. Pharmaceutical formulation comprising an antibiotic, a triazole and a corticosteroid
BRPI0515917A (pt) 2004-09-23 2008-08-12 Schering Plough Ltd controle de parasitas em animais pelo uso de novos derivados de éter de oxima de trifluorometanossulfonanilida
MX2007006072A (es) * 2004-11-19 2007-07-11 Schering Plough Ltd Control de parasitos en animales mediante el uso de derivados del parasiticida 2-fenil-3-(1h-pirrol-2-il)acrilonitrilo.
PL1830885T3 (pl) * 2004-12-21 2009-04-30 Intervet Int Bv Iniekcyjna kompozycja weterynaryjna zawierająca florfenikol
EP1890547A2 (en) * 2005-06-09 2008-02-27 Schering-Plough Ltd. Control of parasites in animals by n-[(phenyloxy)phenyl]-1,1,1-trifluoromethanesulfonamide and n-[(phenylsulfanyl)phenyl]-1,1,1-trifluoromethanesulfonamide derivatives
US8119667B2 (en) * 2005-12-29 2012-02-21 Schering-Plough Animal Health Corporation Carbonates of fenicol antibiotics
US7518017B2 (en) 2006-02-17 2009-04-14 Idexx Laboratories Fenicol compounds and methods synthesizing 2-trifluoroacetamido-3-substituted propiophenone compounds
US20070238700A1 (en) * 2006-04-10 2007-10-11 Winzenberg Kevin N N-phenyl-1,1,1-trifluoromethanesulfonamide hydrazone derivative compounds and their usage in controlling parasites
CA2672795A1 (en) * 2006-12-13 2008-06-26 Schering-Plough Ltd. Water-soluble prodrugs of chloramphenicol, thiamphenicol, and analogs thereof
US8084643B2 (en) * 2006-12-13 2011-12-27 Intervet Inc. Water-soluble prodrugs of florfenicol and its analogs
PE20090234A1 (es) * 2007-04-27 2009-04-02 Schering Plough Ltd Composiciones farmaceuticas que comprenden florfenicol y ciclodextrinas
TWI430995B (zh) 2007-06-26 2014-03-21 Du Pont 萘異唑啉無脊椎有害動物控制劑
HUE037127T2 (hu) 2007-06-27 2018-08-28 Du Pont Állati károkozó irtására szolgáló eljárás
US7550625B2 (en) * 2007-10-19 2009-06-23 Idexx Laboratories Esters of florfenicol
AU2008324852A1 (en) * 2007-11-09 2009-05-14 Intervet International B.V. Fast release solid formulation, preparation and use thereof
TWI401023B (zh) 2008-02-06 2013-07-11 Du Pont 中離子農藥
CA2732017A1 (en) * 2008-07-30 2010-02-04 Intervet International B.V. Process for preparing oxazoline-protected aminodiol compounds useful as intermediates to florfenicol
UA107804C2 (en) 2009-08-05 2015-02-25 Du Pont Mixtures of pesticides mezoionnyh
UA110924C2 (uk) 2009-08-05 2016-03-10 Е. І. Дю Пон Де Немур Енд Компані Мезоіонні пестициди
EP2461684A2 (en) 2009-08-05 2012-06-13 E. I. du Pont de Nemours and Company Mesoionic pesticides
IN2012DN00838A (no) 2009-08-05 2015-06-26 Du Pont
BRPI1002023A2 (pt) 2010-03-01 2011-10-25 Nanocore Biotecnologia S A forma farmacêutica sólida de dissolução rápida para tratamento de infecções bacterianas
MA34247B1 (fr) 2010-05-27 2013-05-02 Du Pont Forme cristalline du 4-[5-[3-chloro-5-(trifluorométhyl) phényl] -4,5-dihydro-5-(trifluorométhyl)-3-isoxazolyl]-n-[2-oxo-2-[(2, 2,2-trifluoroéthyl) amino] éthyl]-1-naphtalènecarboxamide
WO2012087630A1 (en) 2010-12-20 2012-06-28 E.I. Du Pont De Nemours And Company Pyridine and pyrimidine compounds for controlling invertebrate
WO2013158422A1 (en) 2012-04-17 2013-10-24 E. I. Du Pont De Nemours And Company Heterocyclic compounds for controlling invertebrate pests
CN103980168A (zh) * 2014-05-29 2014-08-13 京山瑞生制药有限公司 一种高纯度氟苯尼考的合成新方法
CN106278964B (zh) * 2016-07-31 2018-01-16 浙江润康药业有限公司 氟苯尼考的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169133A (en) * 1962-07-02 1965-02-09 Upjohn Co 3alpha-fluoroandrostanes and 15beta-fluorogesterone
US3153644A (en) * 1962-07-31 1964-10-20 Upjohn Co 16alpha, 17alpha-(2-halo-1-di-lower-alkylamino-2-haloalkylidenedioxy)-steroids and process for the preparation thereof
US4348393A (en) * 1978-06-09 1982-09-07 Delalande S.A. N-Aryl oxazolidinones, oxazolidinethiones, pyrrolidinones, pyrrolidines and thiazolidinones
US4235892A (en) * 1979-02-05 1980-11-25 Schering Corporation, Patent Dept. 1-Aryl-2-acylamido-3-fluoro-1-propanols, methods for their use as antibacterial agents and compositions useful therefor
ES488154A0 (es) * 1979-02-05 1981-04-16 Schering Corp Un procedimiento para la preparacion de un compuesto d-(treo-1-aril-2-acilamido-3-fluor-1-propanol
EP0678506A3 (en) * 1983-06-02 1996-07-24 Zambon Spa Intermediates for the preparation of 1-phenyl-1-hydroxy-2-amino-3-fluoropropane derivatives.
US4603422A (en) * 1984-09-26 1986-07-29 The United States Of America As Represented By The Secretary Of The Navy Long-lived laser dye
US4698353A (en) * 1985-11-13 1987-10-06 Merrell Dow Pharmaceuticals Inc. Cardiotonic heterocyclic oxazolones
US4955090A (en) * 1989-11-13 1990-09-11 Alexander Stefan Zero gravity toilet

Also Published As

Publication number Publication date
NO910879D0 (no) 1991-03-06
AU631141B2 (en) 1992-11-19
FI911236A0 (fi) 1991-03-13
ES2075018T3 (es) 1995-10-01
DE68923839T2 (de) 1995-12-21
US4876352A (en) 1989-10-24
KR940003288B1 (ko) 1994-04-20
HUT55766A (en) 1991-06-28
LU88719I2 (fr) 1996-08-23
KR900701766A (ko) 1990-12-04
ATE126514T1 (de) 1995-09-15
AU4311089A (en) 1990-04-02
WO1990002739A1 (en) 1990-03-22
JPH0552830B2 (no) 1993-08-06
HU895576D0 (en) 1991-05-28
JPH03502695A (ja) 1991-06-20
FI89914B (fi) 1993-08-31
HU207057B (en) 1993-03-01
FI89914C (fi) 1993-12-10
NO910879L (no) 1991-03-06
NO301007B1 (no) 1997-09-01
EP0359190B1 (en) 1995-08-16
EP0434732A1 (en) 1991-07-03
EP0359190A1 (en) 1990-03-21
GR3017921T3 (en) 1996-01-31
DE68923839D1 (de) 1995-09-21

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20090911