HK126996A - Device for encapsulating electronic components - Google Patents

Device for encapsulating electronic components

Info

Publication number
HK126996A
HK126996A HK126996A HK126996A HK126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A
Authority
HK
Hong Kong
Prior art keywords
electronic components
encapsulating electronic
encapsulating
components
electronic
Prior art date
Application number
HK126996A
Other languages
English (en)
Inventor
Josephus Johannes Mar Schraven
Maarten Hoekstra
Marinus Bart Jan De Kruijff
Original Assignee
Boschman Tech Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Tech Bv filed Critical Boschman Tech Bv
Publication of HK126996A publication Critical patent/HK126996A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Wrapping Of Specific Fragile Articles (AREA)
HK126996A 1991-02-26 1996-07-18 Device for encapsulating electronic components HK126996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9100339A NL193526C (nl) 1991-02-26 1991-02-26 Inrichting voor het omhullen van elektronische onderdelen met een kunststof.

Publications (1)

Publication Number Publication Date
HK126996A true HK126996A (en) 1996-07-26

Family

ID=19858933

Family Applications (1)

Application Number Title Priority Date Filing Date
HK126996A HK126996A (en) 1991-02-26 1996-07-18 Device for encapsulating electronic components

Country Status (8)

Country Link
US (1) US5158780A (ja)
JP (1) JP3182432B2 (ja)
KR (1) KR0178402B1 (ja)
GB (1) GB2253182B (ja)
HK (1) HK126996A (ja)
MY (1) MY107696A (ja)
NL (1) NL193526C (ja)
TW (1) TW198133B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564707B2 (ja) * 1991-01-09 1996-12-18 ローム株式会社 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置
NL9101558A (nl) * 1991-09-16 1993-04-16 Amco Hi Tech Bv Inrichting voor het in een matrijsholte inbrengen van een kunststofmateriaal.
KR940007754Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조
JP2931715B2 (ja) * 1992-05-12 1999-08-09 三菱電機株式会社 樹脂封止方法、樹脂封止装置、及びガススプリング
NL9202253A (nl) * 1992-12-23 1994-07-18 Asm Fico Tooling Stelsel voor het gedoseerd opvoeren en uitselecteren van cilindervormige pellets voor omhulinrichtingen voor leadframes.
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5478226A (en) * 1994-04-20 1995-12-26 Fierkens; Richard H. J. Automatic plunger apparatus for use in forming encapsulated semiconductor chips
JP2701766B2 (ja) * 1995-01-27 1998-01-21 日本電気株式会社 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置
US5851559A (en) * 1995-10-31 1998-12-22 Motorola, Inc. Transfer molding press
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US7177696B1 (en) * 1999-06-09 2007-02-13 H & P Medical Research, Inc. Multiple selectable field/current-voltage pads having individually powered and controlled cells
WO2001043942A1 (fr) * 1999-12-16 2001-06-21 Dai-Ichi Seiko Co., Ltd. Moule d'obturation par resine et procede d'obturation par resine
KR100455386B1 (ko) * 2002-05-07 2004-11-06 삼성전자주식회사 다수의 반도체 소자를 동시에 성형하는 성형 장비
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
NL2010252C2 (en) * 2013-02-06 2014-08-07 Boschman Tech Bv Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
JP7203715B2 (ja) * 2019-12-06 2023-01-13 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB841494A (en) * 1957-09-04 1960-07-13 Colin Macbeth Plastic moulding and metal die casting machines
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
WO1982002625A1 (en) * 1981-01-26 1982-08-05 Konishi Akira Sealing and molding machine
JPS5886315U (ja) * 1981-12-07 1983-06-11 坂東　一雄 半導体樹脂封入成形用金型装置
JPH0628873B2 (ja) * 1984-03-02 1994-04-20 日新電機株式会社 小型トランスフア−成形機
JPS6174343A (ja) * 1984-09-19 1986-04-16 Nec Corp 半導体樹脂封止用トランスフアモ−ルド成形機
US4655274A (en) * 1984-10-26 1987-04-07 Ube Industries, Ltd. Horizontal mold clamping and vertical injection type die cast machine
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
JPS61177218A (ja) * 1985-02-01 1986-08-08 Hitachi Ltd 多プランジヤ型トランスフア成形機
NL8501393A (nl) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling Inrichting voor het tegelijkertijd omhullen van een aantal elektronische componenten.
JPS62195135A (ja) * 1986-02-21 1987-08-27 Nec Corp 半導体樹脂封止装置
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
JPS62264483A (ja) * 1986-05-10 1987-11-17 Sony Corp 自動画像送出装置
JPS63115710A (ja) * 1986-11-04 1988-05-20 Matsushita Electric Ind Co Ltd 封止金型のプランジヤ−装置
US4915607A (en) * 1987-09-30 1990-04-10 Texas Instruments Incorporated Lead frame assembly for an integrated circuit molding system
JPH01105716A (ja) * 1987-10-20 1989-04-24 Matsushita Electric Ind Co Ltd 樹脂封止装置
JPH06174343A (ja) * 1992-12-03 1994-06-24 Hitachi Ltd 冷凍・冷蔵ユニットの除霜サイクル
JPH06287318A (ja) * 1993-04-01 1994-10-11 Sekisui Chem Co Ltd 繊維複合シートの製造方法

Also Published As

Publication number Publication date
NL193526B (nl) 1999-09-01
MY107696A (en) 1996-05-30
TW198133B (ja) 1993-01-11
NL193526C (nl) 2000-01-04
JP3182432B2 (ja) 2001-07-03
GB2253182B (en) 1995-01-18
GB2253182A (en) 1992-09-02
KR920016212A (ko) 1992-09-24
KR0178402B1 (ko) 1999-05-15
GB9109877D0 (en) 1991-07-03
JPH04279413A (ja) 1992-10-05
US5158780A (en) 1992-10-27
NL9100339A (nl) 1992-09-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)