HK126996A - Device for encapsulating electronic components - Google Patents

Device for encapsulating electronic components Download PDF

Info

Publication number
HK126996A
HK126996A HK126996A HK126996A HK126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A HK 126996 A HK126996 A HK 126996A
Authority
HK
Hong Kong
Prior art keywords
electronic components
plungers
during
transfer phase
encapsulating electronic
Prior art date
Application number
HK126996A
Other languages
English (en)
Inventor
Johannes Maria Schraven Josephus
Hoekstra Maarten
Bart Jan De Kruijff Marinus
Original Assignee
Boschman Technologies B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Technologies B.V. filed Critical Boschman Technologies B.V.
Publication of HK126996A publication Critical patent/HK126996A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Wrapping Of Specific Fragile Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK126996A 1991-02-26 1996-07-18 Device for encapsulating electronic components HK126996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9100339A NL193526C (nl) 1991-02-26 1991-02-26 Inrichting voor het omhullen van elektronische onderdelen met een kunststof.

Publications (1)

Publication Number Publication Date
HK126996A true HK126996A (en) 1996-07-26

Family

ID=19858933

Family Applications (1)

Application Number Title Priority Date Filing Date
HK126996A HK126996A (en) 1991-02-26 1996-07-18 Device for encapsulating electronic components

Country Status (8)

Country Link
US (1) US5158780A (OSRAM)
JP (1) JP3182432B2 (OSRAM)
KR (1) KR0178402B1 (OSRAM)
GB (1) GB2253182B (OSRAM)
HK (1) HK126996A (OSRAM)
MY (1) MY107696A (OSRAM)
NL (1) NL193526C (OSRAM)
TW (1) TW198133B (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564707B2 (ja) * 1991-01-09 1996-12-18 ローム株式会社 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置
NL9101558A (nl) * 1991-09-16 1993-04-16 Amco Hi Tech Bv Inrichting voor het in een matrijsholte inbrengen van een kunststofmateriaal.
KR940007754Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조
JP2931715B2 (ja) * 1992-05-12 1999-08-09 三菱電機株式会社 樹脂封止方法、樹脂封止装置、及びガススプリング
NL9202253A (nl) * 1992-12-23 1994-07-18 Asm Fico Tooling Stelsel voor het gedoseerd opvoeren en uitselecteren van cilindervormige pellets voor omhulinrichtingen voor leadframes.
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5478226A (en) * 1994-04-20 1995-12-26 Fierkens; Richard H. J. Automatic plunger apparatus for use in forming encapsulated semiconductor chips
JP2701766B2 (ja) * 1995-01-27 1998-01-21 日本電気株式会社 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置
US5851559A (en) * 1995-10-31 1998-12-22 Motorola, Inc. Transfer molding press
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US7177696B1 (en) 1999-06-09 2007-02-13 H & P Medical Research, Inc. Multiple selectable field/current-voltage pads having individually powered and controlled cells
CN1227107C (zh) * 1999-12-16 2005-11-16 第一精工株式会社 树脂封装用模具装置及树脂封装方法
KR100455386B1 (ko) * 2002-05-07 2004-11-06 삼성전자주식회사 다수의 반도체 소자를 동시에 성형하는 성형 장비
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
NL2010252C2 (en) * 2013-02-06 2014-08-07 Boschman Tech Bv Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
JP7203715B2 (ja) * 2019-12-06 2023-01-13 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
NL2028010B1 (en) * 2021-04-19 2022-10-31 Boschman Tech Bv Rotor Core Manufacturing Method, and rotor core molding system therefore

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB841494A (en) * 1957-09-04 1960-07-13 Colin Macbeth Plastic moulding and metal die casting machines
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
EP0070320A4 (en) * 1981-01-26 1985-03-06 Dai Ichi Seiko Co Ltd MOLDING AND SEALING APPARATUS.
JPS5886315U (ja) * 1981-12-07 1983-06-11 坂東　一雄 半導体樹脂封入成形用金型装置
JPH0628873B2 (ja) * 1984-03-02 1994-04-20 日新電機株式会社 小型トランスフア−成形機
JPS6174343A (ja) * 1984-09-19 1986-04-16 Nec Corp 半導体樹脂封止用トランスフアモ−ルド成形機
US4655274A (en) * 1984-10-26 1987-04-07 Ube Industries, Ltd. Horizontal mold clamping and vertical injection type die cast machine
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
JPS61177218A (ja) * 1985-02-01 1986-08-08 Hitachi Ltd 多プランジヤ型トランスフア成形機
NL8501393A (nl) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling Inrichting voor het tegelijkertijd omhullen van een aantal elektronische componenten.
JPS62195135A (ja) * 1986-02-21 1987-08-27 Nec Corp 半導体樹脂封止装置
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
JPS62264483A (ja) * 1986-05-10 1987-11-17 Sony Corp 自動画像送出装置
JPS63115710A (ja) * 1986-11-04 1988-05-20 Matsushita Electric Ind Co Ltd 封止金型のプランジヤ−装置
US4915607A (en) * 1987-09-30 1990-04-10 Texas Instruments Incorporated Lead frame assembly for an integrated circuit molding system
JPH01105716A (ja) * 1987-10-20 1989-04-24 Matsushita Electric Ind Co Ltd 樹脂封止装置
JPH06174343A (ja) * 1992-12-03 1994-06-24 Hitachi Ltd 冷凍・冷蔵ユニットの除霜サイクル
JPH06287318A (ja) * 1993-04-01 1994-10-11 Sekisui Chem Co Ltd 繊維複合シートの製造方法

Also Published As

Publication number Publication date
NL193526C (nl) 2000-01-04
NL9100339A (nl) 1992-09-16
KR920016212A (ko) 1992-09-24
NL193526B (nl) 1999-09-01
TW198133B (OSRAM) 1993-01-11
GB2253182A (en) 1992-09-02
GB9109877D0 (en) 1991-07-03
US5158780A (en) 1992-10-27
MY107696A (en) 1996-05-30
GB2253182B (en) 1995-01-18
JP3182432B2 (ja) 2001-07-03
JPH04279413A (ja) 1992-10-05
KR0178402B1 (ko) 1999-05-15

Similar Documents

Publication Publication Date Title
HK126996A (en) Device for encapsulating electronic components
JPS5630841A (en) Plastic molding method and metallic mold therefor
JPS57212039A (en) Injection molding method for thermoplastic plastic
JPS53102960A (en) Injection mold
CA2077533A1 (en) Gas assisted injection molding
KR970060461A (ko) 에폭시 수지로 캡슐화된 반도체 장치의 제조 방법
EP0783948A3 (en) Sequentially injected multi-component shuttle-stack injection molding
ES8607804A1 (es) Un metodo para encapsular e impregnar un articulo
ES440787A1 (es) Metodo para encapsular componentes electricos.
TW200510161A (en) A method for production of an in-mold decorated product in injection molding and a mold for in-mold decorating in injection molding
GB1339445A (en) Production of laminar articles
SG35053A1 (en) Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor
CA1034317A (en) Tool locking device with tie rods, particularly for plastics injection molding machines
JPS5772832A (en) Injection molding machine
US6576170B1 (en) Gas-assisted injection molding of thermosetting polymers
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS5565510A (en) Synthetic resin forming device
CA2054218A1 (en) Method for the preparation of heterogeneous silicone rubber moldings
GB2054447B (en) Encapsulating semiconductor devices by injection moulding
JPS53120768A (en) Molds for thermosetting resins
JPS55146724A (en) Double molding device using different kinds of materials
GB1325614A (en) Apparatus and method for injection moulding twocoloured products
Babbington et al. Evolution of RTM with vinyl ester resins
JPS56100429A (en) Resin molding method
Thirion et al. New Developments in the Production of Composite High Performance Components by the RTM Process

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)